JP2010040911A5 - - Google Patents

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Publication number
JP2010040911A5
JP2010040911A5 JP2008204141A JP2008204141A JP2010040911A5 JP 2010040911 A5 JP2010040911 A5 JP 2010040911A5 JP 2008204141 A JP2008204141 A JP 2008204141A JP 2008204141 A JP2008204141 A JP 2008204141A JP 2010040911 A5 JP2010040911 A5 JP 2010040911A5
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JP
Japan
Prior art keywords
metal substrate
sealing body
molding die
substrate
metal
Prior art date
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Application number
JP2008204141A
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English (en)
Japanese (ja)
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JP5167022B2 (ja
JP2010040911A (ja
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Priority to JP2008204141A priority Critical patent/JP5167022B2/ja
Priority claimed from JP2008204141A external-priority patent/JP5167022B2/ja
Publication of JP2010040911A publication Critical patent/JP2010040911A/ja
Publication of JP2010040911A5 publication Critical patent/JP2010040911A5/ja
Application granted granted Critical
Publication of JP5167022B2 publication Critical patent/JP5167022B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008204141A 2008-08-07 2008-08-07 半導体装置の製造方法 Expired - Fee Related JP5167022B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008204141A JP5167022B2 (ja) 2008-08-07 2008-08-07 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008204141A JP5167022B2 (ja) 2008-08-07 2008-08-07 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2010040911A JP2010040911A (ja) 2010-02-18
JP2010040911A5 true JP2010040911A5 (enExample) 2011-09-15
JP5167022B2 JP5167022B2 (ja) 2013-03-21

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ID=42013110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008204141A Expired - Fee Related JP5167022B2 (ja) 2008-08-07 2008-08-07 半導体装置の製造方法

Country Status (1)

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JP (1) JP5167022B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6466252B2 (ja) 2014-06-19 2019-02-06 株式会社ジェイデバイス 半導体パッケージ及びその製造方法
JP6457206B2 (ja) 2014-06-19 2019-01-23 株式会社ジェイデバイス 半導体パッケージ及びその製造方法
CN105280567B (zh) 2014-06-19 2018-12-28 株式会社吉帝伟士 半导体封装件及其制造方法
JP6304435B1 (ja) * 2017-07-25 2018-04-04 第一精工株式会社 基材の変形止め機構及び基材の変形止め方法
CN117939794B (zh) * 2024-03-20 2024-05-28 大连保税区金宝至电子有限公司 一种分布式外引脚覆铜陶瓷基板的加工方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62124747A (ja) * 1985-11-25 1987-06-06 Sharp Corp 自動モ−ルド装置に於けるカルブレイク方法
JP2000299329A (ja) * 1999-04-12 2000-10-24 Mitsubishi Electric Corp 樹脂パッケージ型半導体装置の製造装置及び製造方法
JP4106844B2 (ja) * 2000-02-22 2008-06-25 沖電気工業株式会社 樹脂封止半導体装置のリード部のゲートブレーク方法
JP2002016181A (ja) * 2000-04-25 2002-01-18 Torex Semiconductor Ltd 半導体装置、その製造方法、及び電着フレーム
JP2004214265A (ja) * 2002-12-27 2004-07-29 Kyushu Hitachi Maxell Ltd 半導体装置および半導体装置の製造方法
JP2006269486A (ja) * 2005-03-22 2006-10-05 Renesas Technology Corp 半導体装置の製造方法
JP2006351835A (ja) * 2005-06-16 2006-12-28 Aoi Electronics Co Ltd 半導体装置および半導体装置の製造方法

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