JP2010129995A5 - - Google Patents
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- Publication number
- JP2010129995A5 JP2010129995A5 JP2009049455A JP2009049455A JP2010129995A5 JP 2010129995 A5 JP2010129995 A5 JP 2010129995A5 JP 2009049455 A JP2009049455 A JP 2009049455A JP 2009049455 A JP2009049455 A JP 2009049455A JP 2010129995 A5 JP2010129995 A5 JP 2010129995A5
- Authority
- JP
- Japan
- Prior art keywords
- molten metal
- metal
- opening surface
- vacuum chamber
- cooled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims 22
- 229910052751 metal Inorganic materials 0.000 claims 22
- 238000000034 method Methods 0.000 claims 18
- 239000010409 thin film Substances 0.000 claims 3
- 238000002347 injection Methods 0.000 claims 2
- 239000007924 injection Substances 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- 229910052741 iridium Inorganic materials 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009049455A JP4611429B2 (ja) | 2009-03-03 | 2009-03-03 | 微細空間への金属充填方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009049455A JP4611429B2 (ja) | 2009-03-03 | 2009-03-03 | 微細空間への金属充填方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008300887A Division JP4278007B1 (ja) | 2008-11-26 | 2008-11-26 | 微細空間への金属充填方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010129995A JP2010129995A (ja) | 2010-06-10 |
| JP2010129995A5 true JP2010129995A5 (enExample) | 2010-08-12 |
| JP4611429B2 JP4611429B2 (ja) | 2011-01-12 |
Family
ID=42330146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009049455A Expired - Fee Related JP4611429B2 (ja) | 2009-03-03 | 2009-03-03 | 微細空間への金属充填方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4611429B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9704793B2 (en) | 2011-01-04 | 2017-07-11 | Napra Co., Ltd. | Substrate for electronic device and electronic device |
| JP5250707B2 (ja) * | 2011-05-26 | 2013-07-31 | 有限会社 ナプラ | 電子機器用基板及び電子機器 |
| JP5303054B2 (ja) * | 2011-09-14 | 2013-10-02 | 住友精密工業株式会社 | 金属充填装置 |
| JP2013115340A (ja) * | 2011-11-30 | 2013-06-10 | Napura:Kk | 縦導体充填構造 |
| JP5124693B1 (ja) * | 2012-04-24 | 2013-01-23 | 有限会社 ナプラ | 電子機器 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05269564A (ja) * | 1992-03-24 | 1993-10-19 | Inax Corp | 加圧鋳造方法及び加圧鋳造装置 |
| JP3488586B2 (ja) * | 1996-12-24 | 2004-01-19 | 株式会社東芝 | 半導体装置の製造方法 |
| JP4260387B2 (ja) * | 2001-10-29 | 2009-04-30 | 株式会社フジクラ | 貫通配線付き基板の製造方法、および充填金属部付き製品の製造方法 |
-
2009
- 2009-03-03 JP JP2009049455A patent/JP4611429B2/ja not_active Expired - Fee Related
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