JP4611429B2 - 微細空間への金属充填方法 - Google Patents

微細空間への金属充填方法 Download PDF

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JP4611429B2
JP4611429B2 JP2009049455A JP2009049455A JP4611429B2 JP 4611429 B2 JP4611429 B2 JP 4611429B2 JP 2009049455 A JP2009049455 A JP 2009049455A JP 2009049455 A JP2009049455 A JP 2009049455A JP 4611429 B2 JP4611429 B2 JP 4611429B2
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molten metal
metal
pressure
fine space
vacuum chamber
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JP2010129995A5 (enExample
JP2010129995A (ja
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重信 関根
由莉奈 関根
竜司 木村
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有限会社ナプラ
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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2009049455A 2009-03-03 2009-03-03 微細空間への金属充填方法 Expired - Fee Related JP4611429B2 (ja)

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JP2009049455A JP4611429B2 (ja) 2009-03-03 2009-03-03 微細空間への金属充填方法

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JP2009049455A JP4611429B2 (ja) 2009-03-03 2009-03-03 微細空間への金属充填方法

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JP2008300887A Division JP4278007B1 (ja) 2008-11-26 2008-11-26 微細空間への金属充填方法

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JP2010129995A JP2010129995A (ja) 2010-06-10
JP2010129995A5 JP2010129995A5 (enExample) 2010-08-12
JP4611429B2 true JP4611429B2 (ja) 2011-01-12

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013075330A (ja) * 2011-09-14 2013-04-25 Sumitomo Precision Prod Co Ltd 金属充填装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9704793B2 (en) 2011-01-04 2017-07-11 Napra Co., Ltd. Substrate for electronic device and electronic device
JP5250707B2 (ja) * 2011-05-26 2013-07-31 有限会社 ナプラ 電子機器用基板及び電子機器
JP2013115340A (ja) * 2011-11-30 2013-06-10 Napura:Kk 縦導体充填構造
JP5124693B1 (ja) * 2012-04-24 2013-01-23 有限会社 ナプラ 電子機器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05269564A (ja) * 1992-03-24 1993-10-19 Inax Corp 加圧鋳造方法及び加圧鋳造装置
JP3488586B2 (ja) * 1996-12-24 2004-01-19 株式会社東芝 半導体装置の製造方法
JP4260387B2 (ja) * 2001-10-29 2009-04-30 株式会社フジクラ 貫通配線付き基板の製造方法、および充填金属部付き製品の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013075330A (ja) * 2011-09-14 2013-04-25 Sumitomo Precision Prod Co Ltd 金属充填装置

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