JP2010002328A5 - - Google Patents

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Publication number
JP2010002328A5
JP2010002328A5 JP2008162047A JP2008162047A JP2010002328A5 JP 2010002328 A5 JP2010002328 A5 JP 2010002328A5 JP 2008162047 A JP2008162047 A JP 2008162047A JP 2008162047 A JP2008162047 A JP 2008162047A JP 2010002328 A5 JP2010002328 A5 JP 2010002328A5
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JP
Japan
Prior art keywords
max
film thickness
wavelength
measured
thickness measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008162047A
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English (en)
Japanese (ja)
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JP2010002328A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008162047A priority Critical patent/JP2010002328A/ja
Priority claimed from JP2008162047A external-priority patent/JP2010002328A/ja
Priority to TW098115659A priority patent/TW201007116A/zh
Priority to KR1020090054697A priority patent/KR20090132538A/ko
Publication of JP2010002328A publication Critical patent/JP2010002328A/ja
Publication of JP2010002328A5 publication Critical patent/JP2010002328A5/ja
Pending legal-status Critical Current

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JP2008162047A 2008-06-20 2008-06-20 膜厚測定装置 Pending JP2010002328A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008162047A JP2010002328A (ja) 2008-06-20 2008-06-20 膜厚測定装置
TW098115659A TW201007116A (en) 2008-06-20 2009-05-12 Film thickness measuring apparatus
KR1020090054697A KR20090132538A (ko) 2008-06-20 2009-06-19 막 두께 측정 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008162047A JP2010002328A (ja) 2008-06-20 2008-06-20 膜厚測定装置

Publications (2)

Publication Number Publication Date
JP2010002328A JP2010002328A (ja) 2010-01-07
JP2010002328A5 true JP2010002328A5 (enExample) 2011-06-23

Family

ID=41584175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008162047A Pending JP2010002328A (ja) 2008-06-20 2008-06-20 膜厚測定装置

Country Status (3)

Country Link
JP (1) JP2010002328A (enExample)
KR (1) KR20090132538A (enExample)
TW (1) TW201007116A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5309359B2 (ja) * 2008-06-20 2013-10-09 大塚電子株式会社 膜厚測定装置および膜厚測定方法
JP2012021916A (ja) * 2010-07-15 2012-02-02 Disco Abrasive Syst Ltd 厚み検出装置および研削機
US9664625B2 (en) 2012-09-28 2017-05-30 Rudolph Technologies, Inc. Inspection of substrates using calibration and imaging
KR101326204B1 (ko) * 2013-01-16 2013-11-08 에스엔유 프리시젼 주식회사 박막 두께 측정장치 및 방법
TWI485383B (zh) * 2013-01-21 2015-05-21 Nat Univ Chung Cheng 石墨烯薄膜層數檢測系統及檢測方法
KR20150012509A (ko) 2013-07-25 2015-02-04 삼성전자주식회사 피측정물의 두께를 측정하는 방법 및 장치
JP6180909B2 (ja) * 2013-12-06 2017-08-16 東京エレクトロン株式会社 距離を求める方法、静電チャックを除電する方法、及び、処理装置
JP7103906B2 (ja) * 2018-09-28 2022-07-20 株式会社ディスコ 厚み計測装置
JP6758736B1 (ja) * 2020-04-08 2020-09-23 大塚電子株式会社 光学測定システムおよび光学測定方法
JP7705723B2 (ja) * 2021-03-24 2025-07-10 株式会社Ｓｃｒｅｅｎホールディングス 検査装置および検査方法
CN114935313B (zh) * 2022-04-26 2023-09-15 香港中文大学（深圳） 薄膜厚度测量方法、装置、设备和计算机可读存储介质

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6271804A (ja) * 1985-09-26 1987-04-02 Nippon Kogaku Kk <Nikon> 膜厚測定装置
JP2533514B2 (ja) * 1987-02-06 1996-09-11 日本分光株式会社 凹部深さ・膜厚測定装置
JPS63222208A (ja) * 1987-03-11 1988-09-16 Japan Spectroscopic Co 凹部深さ測定装置
JP2539283B2 (ja) * 1990-07-09 1996-10-02 日本分光工業株式会社 膜厚測定方法
JPH074922A (ja) * 1993-06-21 1995-01-10 Jasco Corp 半導体多層薄膜膜厚測定装置およびその測定方法
JPH07190858A (ja) * 1993-12-27 1995-07-28 Nikon Corp フーリエ変換分光器
JPH07294220A (ja) * 1994-04-27 1995-11-10 Mitsubishi Chem Corp 多層薄膜の膜厚検出方法および装置
JP3732894B2 (ja) * 1996-06-26 2006-01-11 松下電器産業株式会社 多層薄膜の膜厚測定方法と、その方法を用いた光学情報記録媒体の製造方法及び光学情報記録媒体の製造装置
JPH11118431A (ja) * 1997-10-16 1999-04-30 Jeol Ltd Ｆｔ−ｉｒを用いた膜厚測定方法及び装置
JP2001227916A (ja) * 2000-02-17 2001-08-24 Murata Mfg Co Ltd 膜厚測定方法および干渉膜厚測定装置
JP3946470B2 (ja) * 2001-03-12 2007-07-18 株式会社デンソー 半導体層の膜厚測定方法及び半導体基板の製造方法
KR100393522B1 (en) * 2003-01-11 2003-08-02 Ellipso Technology Co Ltd Device and method for measuring film thickness, making use of improved fast fourier transformation
KR100947228B1 (ko) * 2003-06-20 2010-03-11 엘지전자 주식회사 광디스크의 두께 측정 방법

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