KR20090132538A - 막 두께 측정 장치 - Google Patents

막 두께 측정 장치 Download PDF

Info

Publication number
KR20090132538A
KR20090132538A KR1020090054697A KR20090054697A KR20090132538A KR 20090132538 A KR20090132538 A KR 20090132538A KR 1020090054697 A KR1020090054697 A KR 1020090054697A KR 20090054697 A KR20090054697 A KR 20090054697A KR 20090132538 A KR20090132538 A KR 20090132538A
Authority
KR
South Korea
Prior art keywords
film thickness
layer
wavelength
max
measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020090054697A
Other languages
English (en)
Korean (ko)
Inventor
다다요시 후지모리
요시미 사와무라
Original Assignee
오츠카 일렉트로닉스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오츠카 일렉트로닉스 가부시키가이샤 filed Critical 오츠카 일렉트로닉스 가부시키가이샤
Publication of KR20090132538A publication Critical patent/KR20090132538A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020090054697A 2008-06-20 2009-06-19 막 두께 측정 장치 Withdrawn KR20090132538A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-162047 2008-06-20
JP2008162047A JP2010002328A (ja) 2008-06-20 2008-06-20 膜厚測定装置

Publications (1)

Publication Number Publication Date
KR20090132538A true KR20090132538A (ko) 2009-12-30

Family

ID=41584175

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090054697A Withdrawn KR20090132538A (ko) 2008-06-20 2009-06-19 막 두께 측정 장치

Country Status (3)

Country Link
JP (1) JP2010002328A (enExample)
KR (1) KR20090132538A (enExample)
TW (1) TW201007116A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101326204B1 (ko) * 2013-01-16 2013-11-08 에스엔유 프리시젼 주식회사 박막 두께 측정장치 및 방법
KR20150066447A (ko) * 2013-12-06 2015-06-16 도쿄엘렉트론가부시키가이샤 거리를 구하는 방법, 정전 척을 제전하는 방법, 및, 처리 장치
US9255789B2 (en) 2013-07-25 2016-02-09 Samsung Electronics Co., Ltd. Method for measuring thickness of object
CN114935313A (zh) * 2022-04-26 2022-08-23 香港中文大学（深圳） 薄膜厚度测量方法、装置、设备和计算机程序产品

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5309359B2 (ja) * 2008-06-20 2013-10-09 大塚電子株式会社 膜厚測定装置および膜厚測定方法
JP2012021916A (ja) * 2010-07-15 2012-02-02 Disco Abrasive Syst Ltd 厚み検出装置および研削機
US9664625B2 (en) 2012-09-28 2017-05-30 Rudolph Technologies, Inc. Inspection of substrates using calibration and imaging
TWI485383B (zh) * 2013-01-21 2015-05-21 Nat Univ Chung Cheng 石墨烯薄膜層數檢測系統及檢測方法
JP7103906B2 (ja) * 2018-09-28 2022-07-20 株式会社ディスコ 厚み計測装置
JP6758736B1 (ja) * 2020-04-08 2020-09-23 大塚電子株式会社 光学測定システムおよび光学測定方法
JP7705723B2 (ja) * 2021-03-24 2025-07-10 株式会社Ｓｃｒｅｅｎホールディングス 検査装置および検査方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6271804A (ja) * 1985-09-26 1987-04-02 Nippon Kogaku Kk <Nikon> 膜厚測定装置
JP2533514B2 (ja) * 1987-02-06 1996-09-11 日本分光株式会社 凹部深さ・膜厚測定装置
JPS63222208A (ja) * 1987-03-11 1988-09-16 Japan Spectroscopic Co 凹部深さ測定装置
JP2539283B2 (ja) * 1990-07-09 1996-10-02 日本分光工業株式会社 膜厚測定方法
JPH074922A (ja) * 1993-06-21 1995-01-10 Jasco Corp 半導体多層薄膜膜厚測定装置およびその測定方法
JPH07190858A (ja) * 1993-12-27 1995-07-28 Nikon Corp フーリエ変換分光器
JPH07294220A (ja) * 1994-04-27 1995-11-10 Mitsubishi Chem Corp 多層薄膜の膜厚検出方法および装置
JP3732894B2 (ja) * 1996-06-26 2006-01-11 松下電器産業株式会社 多層薄膜の膜厚測定方法と、その方法を用いた光学情報記録媒体の製造方法及び光学情報記録媒体の製造装置
JPH11118431A (ja) * 1997-10-16 1999-04-30 Jeol Ltd Ｆｔ−ｉｒを用いた膜厚測定方法及び装置
JP2001227916A (ja) * 2000-02-17 2001-08-24 Murata Mfg Co Ltd 膜厚測定方法および干渉膜厚測定装置
JP3946470B2 (ja) * 2001-03-12 2007-07-18 株式会社デンソー 半導体層の膜厚測定方法及び半導体基板の製造方法
KR100393522B1 (en) * 2003-01-11 2003-08-02 Ellipso Technology Co Ltd Device and method for measuring film thickness, making use of improved fast fourier transformation
KR100947228B1 (ko) * 2003-06-20 2010-03-11 엘지전자 주식회사 광디스크의 두께 측정 방법

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101326204B1 (ko) * 2013-01-16 2013-11-08 에스엔유 프리시젼 주식회사 박막 두께 측정장치 및 방법
US9255789B2 (en) 2013-07-25 2016-02-09 Samsung Electronics Co., Ltd. Method for measuring thickness of object
KR20150066447A (ko) * 2013-12-06 2015-06-16 도쿄엘렉트론가부시키가이샤 거리를 구하는 방법, 정전 척을 제전하는 방법, 및, 처리 장치
CN114935313A (zh) * 2022-04-26 2022-08-23 香港中文大学（深圳） 薄膜厚度测量方法、装置、设备和计算机程序产品
CN114935313B (zh) * 2022-04-26 2023-09-15 香港中文大学（深圳） 薄膜厚度测量方法、装置、设备和计算机可读存储介质

Also Published As

Publication number Publication date
JP2010002328A (ja) 2010-01-07
TW201007116A (en) 2010-02-16

Similar Documents

Publication Publication Date Title
KR101582357B1 (ko) 막 두께 측정 장치 및 막 두께 측정 방법
KR20090132538A (ko) 막 두께 측정 장치
KR20130018553A (ko) 막 두께 측정 장치
KR101815325B1 (ko) 웨이퍼 상에서 고 종횡비의 에칭된 피처의 깊이를 직접 측정하기 위한 시스템
US8582124B2 (en) Optical characteristic measuring apparatus and optical characteristic measuring method
US6775015B2 (en) Optical metrology of single features
JP4834847B2 (ja) 多層膜解析装置および多層膜解析方法
US7483147B2 (en) Apparatus and method for measuring thickness and profile of transparent thin film using white-light interferometer
US10041838B2 (en) Optical critical dimension metrology
JP4384463B2 (ja) 焦点検出ユニット並びにそれを用いた屈折率測定装置及び非接触温度計
US20120176623A1 (en) Apparatus and method for measuring characteristics of multi-layered thin films
CN107037437B (zh) 厚度测量装置及厚度测量方法
US8068228B2 (en) In-plane optical metrology
US20150029504A1 (en) Fourier-transform interferometer with staircase reflective element
TWI292030B (en) High density multi-channel detecting device
JP2017156245A (ja) 分光測定装置
JP5028660B2 (ja) 光学特性測定装置および光学特性測定方法
JP2021071433A (ja) 偏光計測装置およびエリプソメータ
CA2653710C (en) Tapered waveguide coupler and spectrometer
CN120380585A (zh) 用于基板的经相位解析的光学计量
KR20050103100A (ko) 박막의 굴절률 및 두께 측정장치

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000