JP2010002328A - 膜厚測定装置 - Google Patents

膜厚測定装置 Download PDF

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Publication number
JP2010002328A
JP2010002328A JP2008162047A JP2008162047A JP2010002328A JP 2010002328 A JP2010002328 A JP 2010002328A JP 2008162047 A JP2008162047 A JP 2008162047A JP 2008162047 A JP2008162047 A JP 2008162047A JP 2010002328 A JP2010002328 A JP 2010002328A
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JP
Japan
Prior art keywords
film thickness
layer
wavelength
measured
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008162047A
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English (en)
Japanese (ja)
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JP2010002328A5 (enExample
Inventor
Masayoshi Fujimori
匡嘉 藤森
Yoshimi Sawamura
義巳 澤村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Otsuka Electronics Co Ltd
Original Assignee
Otsuka Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Otsuka Electronics Co Ltd filed Critical Otsuka Electronics Co Ltd
Priority to JP2008162047A priority Critical patent/JP2010002328A/ja
Priority to TW098115659A priority patent/TW201007116A/zh
Priority to KR1020090054697A priority patent/KR20090132538A/ko
Publication of JP2010002328A publication Critical patent/JP2010002328A/ja
Publication of JP2010002328A5 publication Critical patent/JP2010002328A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2008162047A 2008-06-20 2008-06-20 膜厚測定装置 Pending JP2010002328A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008162047A JP2010002328A (ja) 2008-06-20 2008-06-20 膜厚測定装置
TW098115659A TW201007116A (en) 2008-06-20 2009-05-12 Film thickness measuring apparatus
KR1020090054697A KR20090132538A (ko) 2008-06-20 2009-06-19 막 두께 측정 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008162047A JP2010002328A (ja) 2008-06-20 2008-06-20 膜厚測定装置

Publications (2)

Publication Number Publication Date
JP2010002328A true JP2010002328A (ja) 2010-01-07
JP2010002328A5 JP2010002328A5 (enExample) 2011-06-23

Family

ID=41584175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008162047A Pending JP2010002328A (ja) 2008-06-20 2008-06-20 膜厚測定装置

Country Status (3)

Country Link
JP (1) JP2010002328A (enExample)
KR (1) KR20090132538A (enExample)
TW (1) TW201007116A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010002327A (ja) * 2008-06-20 2010-01-07 Otsuka Denshi Co Ltd 膜厚測定装置および膜厚測定方法
JP2012021916A (ja) * 2010-07-15 2012-02-02 Disco Abrasive Syst Ltd 厚み検出装置および研削機
JP2022148122A (ja) * 2021-03-24 2022-10-06 株式会社Ｓｃｒｅｅｎホールディングス 検査装置および検査方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9664625B2 (en) 2012-09-28 2017-05-30 Rudolph Technologies, Inc. Inspection of substrates using calibration and imaging
KR101326204B1 (ko) * 2013-01-16 2013-11-08 에스엔유 프리시젼 주식회사 박막 두께 측정장치 및 방법
TWI485383B (zh) * 2013-01-21 2015-05-21 Nat Univ Chung Cheng 石墨烯薄膜層數檢測系統及檢測方法
KR20150012509A (ko) 2013-07-25 2015-02-04 삼성전자주식회사 피측정물의 두께를 측정하는 방법 및 장치
JP6180909B2 (ja) * 2013-12-06 2017-08-16 東京エレクトロン株式会社 距離を求める方法、静電チャックを除電する方法、及び、処理装置
JP7103906B2 (ja) * 2018-09-28 2022-07-20 株式会社ディスコ 厚み計測装置
JP6758736B1 (ja) * 2020-04-08 2020-09-23 大塚電子株式会社 光学測定システムおよび光学測定方法
CN114935313B (zh) * 2022-04-26 2023-09-15 香港中文大学（深圳） 薄膜厚度测量方法、装置、设备和计算机可读存储介质

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6271804A (ja) * 1985-09-26 1987-04-02 Nippon Kogaku Kk <Nikon> 膜厚測定装置
JPS63193003A (ja) * 1987-02-06 1988-08-10 Japan Spectroscopic Co 凹部深さ・膜厚測定装置
JPS63222208A (ja) * 1987-03-11 1988-09-16 Japan Spectroscopic Co 凹部深さ測定装置
JPH0466806A (ja) * 1990-07-09 1992-03-03 Jasco Corp 膜厚測定方法
JPH074922A (ja) * 1993-06-21 1995-01-10 Jasco Corp 半導体多層薄膜膜厚測定装置およびその測定方法
JPH07190858A (ja) * 1993-12-27 1995-07-28 Nikon Corp フーリエ変換分光器
JPH07294220A (ja) * 1994-04-27 1995-11-10 Mitsubishi Chem Corp 多層薄膜の膜厚検出方法および装置
JPH109829A (ja) * 1996-06-26 1998-01-16 Matsushita Electric Ind Co Ltd 多層薄膜の膜厚測定方法と、その方法を用いた光学情報記録媒体の製造方法及び光学情報記録媒体の製造装置
JPH11118431A (ja) * 1997-10-16 1999-04-30 Jeol Ltd Ｆｔ−ｉｒを用いた膜厚測定方法及び装置
JP2001227916A (ja) * 2000-02-17 2001-08-24 Murata Mfg Co Ltd 膜厚測定方法および干渉膜厚測定装置
JP2002343842A (ja) * 2001-03-12 2002-11-29 Denso Corp 半導体層の膜厚測定方法及び半導体基板の製造方法
JP2006513418A (ja) * 2003-01-11 2006-04-20 エリップソ テクノロジー カンパニー リミテッド 改善された高速フ−リエ変換を利用した膜厚の測定装置及び方法
JP2008039789A (ja) * 2003-06-20 2008-02-21 Lg Electron Inc 光ディスクの厚さ測定方法

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6271804A (ja) * 1985-09-26 1987-04-02 Nippon Kogaku Kk <Nikon> 膜厚測定装置
JPS63193003A (ja) * 1987-02-06 1988-08-10 Japan Spectroscopic Co 凹部深さ・膜厚測定装置
JPS63222208A (ja) * 1987-03-11 1988-09-16 Japan Spectroscopic Co 凹部深さ測定装置
JPH0466806A (ja) * 1990-07-09 1992-03-03 Jasco Corp 膜厚測定方法
JPH074922A (ja) * 1993-06-21 1995-01-10 Jasco Corp 半導体多層薄膜膜厚測定装置およびその測定方法
JPH07190858A (ja) * 1993-12-27 1995-07-28 Nikon Corp フーリエ変換分光器
JPH07294220A (ja) * 1994-04-27 1995-11-10 Mitsubishi Chem Corp 多層薄膜の膜厚検出方法および装置
JPH109829A (ja) * 1996-06-26 1998-01-16 Matsushita Electric Ind Co Ltd 多層薄膜の膜厚測定方法と、その方法を用いた光学情報記録媒体の製造方法及び光学情報記録媒体の製造装置
JPH11118431A (ja) * 1997-10-16 1999-04-30 Jeol Ltd Ｆｔ−ｉｒを用いた膜厚測定方法及び装置
JP2001227916A (ja) * 2000-02-17 2001-08-24 Murata Mfg Co Ltd 膜厚測定方法および干渉膜厚測定装置
JP2002343842A (ja) * 2001-03-12 2002-11-29 Denso Corp 半導体層の膜厚測定方法及び半導体基板の製造方法
JP2006513418A (ja) * 2003-01-11 2006-04-20 エリップソ テクノロジー カンパニー リミテッド 改善された高速フ−リエ変換を利用した膜厚の測定装置及び方法
JP2008039789A (ja) * 2003-06-20 2008-02-21 Lg Electron Inc 光ディスクの厚さ測定方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010002327A (ja) * 2008-06-20 2010-01-07 Otsuka Denshi Co Ltd 膜厚測定装置および膜厚測定方法
JP2012021916A (ja) * 2010-07-15 2012-02-02 Disco Abrasive Syst Ltd 厚み検出装置および研削機
JP2022148122A (ja) * 2021-03-24 2022-10-06 株式会社Ｓｃｒｅｅｎホールディングス 検査装置および検査方法
JP7705723B2 (ja) 2021-03-24 2025-07-10 株式会社Ｓｃｒｅｅｎホールディングス 検査装置および検査方法

Also Published As

Publication number Publication date
KR20090132538A (ko) 2009-12-30
TW201007116A (en) 2010-02-16

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