JP2009534857A - オプトエレクトロニクス半導体チップ - Google Patents
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- 239000010409 thin film Substances 0.000 claims description 18
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- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 3
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- 229910001218 Gallium arsenide Inorganic materials 0.000 description 11
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/387—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/14—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
- H01L33/145—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure with a current-blocking structure
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H—ELECTRICITY
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- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/382—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
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- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
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- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
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Abstract
Description
・放射を発生するエピタキシャル層列において担体エレメントの方に向いた側に位置する主表面に反射層が被着または形成されており、この反射層はエピタキシャル層列において発生した電磁放射の少なくとも一部分をこのエピタキシャル層列に戻り反射する。
D≧λ/4nk+m・λ/2nk
ここではλは、活性領域で生成された光の放出スペクトルの特徴的な放出波長であり、たとえばピーク波長、主波長または重心波長であり、nkはコンタクト層の屈折率であり、m=0,1,2...である。
Claims (30)
- 半導体ボディ(2)と、該半導体ボディ上に配置された光透過性かつ導電性のコンタクト層(6)とを備えたオプトエレクトロニクス半導体チップ(1)において、
該半導体ボディ(2)は、半導体層列と、光生成に適した活性領域(3)とを有し、
該コンタクト層(6)は該活性領域に導電接続されており、
該コンタクト層は該半導体層列のバリア層(5)と該半導体層列の接続層(4)とにわたって延在し、該接続層の端子領域(7)を介して該活性領域に導電接続されていることを特徴とする、オプトエレクトロニクス半導体チップ。 - 前記コンタクト層(6)はバリア領域(8)において前記バリア層(5)に接し、かつ/または、前記端子領域(7)において前記接続層(4)に接する、請求項1記載のオプトエレクトロニクス半導体チップ。
- 前記接続層(4)との前記コンタクト層(6)の電気的な接触抵抗は、前記バリア層(5)との該コンタクト層の電気的な接触抵抗より低い、請求項1または2記載のオプトエレクトロニクス半導体チップ。
- 前記コンタクト層(6)は光透過性かつ導電性の酸化物を含有し、とりわけ金属酸化物を含有し、たとえば酸化亜鉛、酸化錫またはインジウム錫酸化物を含む、請求項1から3までのいずれか1項記載のオプトエレクトロニクス半導体チップ。
- 前記コンタクト層(6)の前記活性領域(3)と反対側の面に鏡面層(9)が配置されている、請求項1から4までのいずれか1項記載のオプトエレクトロニクス半導体チップ。
- 前記鏡面層(9)は金属を含有する、請求項5記載のオプトエレクトロニクス半導体チップ。
- 前記鏡面層(9)はAuを含有し、前記コンタクト層(6)はZnOを含有する、請求項4および6に記載のオプトエレクトロニクス半導体チップ。
- 前記バリア層(5)の導電型と前記接続層(4)の導電層とは異なる、請求項1から7までのいずれか1項記載のオプトエレクトロニクス半導体チップ。
- 前記活性領域(3)の前記バリア層(5)と反対側の面に配置された、前記半導体層列の半導体層の導電型と、前記バリア層の導電型とは同じである、請求項8記載のオプトエレクトロニクス半導体チップ。
- 前記接続層(4)はドーピングされて形成され、前記バリア層(5)はドーピングされずに形成されている、請求項1から7までのいずれか1項記載のオプトエレクトロニクス半導体チップ。
- 前記接続層(4)の導電型と前記バリア層(5)の導電型とは同じであり、かつ、該接続層のドーパント濃度は該バリア層のドーパント濃度より高い、請求項1から7までのいずれか1項記載のオプトエレクトロニクス半導体チップ。
- 前記接続層(4)はp型に形成されている、請求項1から11までのいずれか1項記載のオプトエレクトロニクス半導体チップ。
- 前記接続層(4)は前記活性領域(3)と前記バリア層(5)との間に配置されている、請求項1から12までのいずれか1項記載のオプトエレクトロニクス半導体チップ。
- 前記バリア層(5)は切欠部を有し、
該切欠部は前記コンタクト層(6)を貫通して延在する、請求項1から13までのいずれか1項記載のオプトエレクトロニクス半導体チップ。 - 前記バリア層(5)は前記活性領域(3)と前記接続層(4)との間に配置されている、請求項1から12までのいずれか1項または請求項14記載のオプトエレクトロニクス半導体チップ。
- 前記接続層(4)は切欠部を有し、
該切欠部は前記コンタクト層(6)を貫通して延在する、請求項1から15までのいずれか1項記載のオプトエレクトロニクス半導体チップ。 - 前記コンタクト層(6)は切欠無しの層として形成されている、請求項1から16までのいずれか1項記載のオプトエレクトロニクス半導体チップ。
- 前記接続層(4)と前記バリア層(5)とは前記半導体ボディ(2)にモノリシック集積されている、請求項1から17までのいずれか1項記載のオプトエレクトロニクス半導体チップ。
- 前記半導体ボディ(2)は薄膜半導体ボディとして形成されている、請求項1から18までのいずれか1項記載のオプトエレクトロニクス半導体チップ。
- 表面上に前記半導体層列が配置される担体(10)を含み、
前記コンタクト層(6)は該半導体層列と該担体との間に配置される、請求項19記載のオプトエレクトロニクス半導体チップ。 - 前記担体(10)は前記半導体層列の成長基板(22)とは異なる、請求項20記載のオプトエレクトロニクス半導体チップ。
- 前記バリア領域(8)は、前記半導体ボディの該バリア領域と反対側の面に配置された、半導体チップの電極(14)を被覆する、請求項2から21までのいずれか1項記載のオプトエレクトロニクス半導体チップ。
- 前記バリア領域(8)はオプトエレクトロニクス半導体チップの縁部領域に配置されている、請求項2から21までのいずれか1項記載のオプトエレクトロニクス半導体チップ。
- 複数のバリア領域(80,81,82)が設けられており、
該複数のバリア領域のうち1つ(80)は、前記半導体ボディのバリア領域と反対側の面に配置された、オプトエレクトロニクス半導体チップの電極(14)を被覆し、別のバリア領域(82)が該オプトエレクトロニクス半導体チップの縁部領域に配置されている、請求項22および23記載のオプトエレクトロニクス半導体チップ。 - 前記バリア領域(80,81,82)は繋がって形成されている、請求項24記載のオプトエレクトロニクス半導体チップ。
- 光生成に適したオプトエレクトロニクス半導体チップのためのコンタクト構造体を製造するための製造方法において、
・接続層(4)と、該接続層(4)上に配置されるバリア層(5)とを備えた半導体層列(21)を設けるステップと、
・該バリア層を露出するように該半導体層列の該接続層を局所的に除去するか、または該接続層を露出するように該半導体層列のバリア層を局所的に除去するステップと、
・光透過性かつ導電性のコンタクト層(6)を該半導体層列上に設け、該コンタクト層は該接続層に直接配置され、かつ該バリア層にも直接配置されるようにするステップ
とを有することを特徴とする製造方法。 - 前記コンタクト層(6)を前記半導体層列上に堆積する、請求項26記載の製造方法。
- 前記コンタクト層(6)を設けた後に焼結処理を行う、請求項26または27記載の製造方法。
- 前記コンタクト層(6)の前記接続層(4)と反対側の面に鏡面層(9)を設ける、請求項26から28までのいずれか1項記載の製造方法。
- 請求項1から25までのいずれか1項記載のオプトエレクトロニクス半導体チップ(1)の製造で実施される、請求項26から29までのいずれか1項記載の製造方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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DE102006019725.9 | 2006-04-27 | ||
DE102006019725 | 2006-04-27 | ||
DE102006034847.8 | 2006-07-27 | ||
DE102006034847A DE102006034847A1 (de) | 2006-04-27 | 2006-07-27 | Optoelektronischer Halbleiterchip |
PCT/DE2007/000554 WO2007124708A1 (de) | 2006-04-27 | 2007-03-26 | Optoelektronischer halbleiterchip |
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JP2009534857A true JP2009534857A (ja) | 2009-09-24 |
JP5404386B2 JP5404386B2 (ja) | 2014-01-29 |
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US (1) | US8378371B2 (ja) |
EP (1) | EP2011160B1 (ja) |
JP (1) | JP5404386B2 (ja) |
KR (1) | KR101294911B1 (ja) |
CN (1) | CN101427392B (ja) |
DE (1) | DE102006034847A1 (ja) |
TW (1) | TWI381545B (ja) |
WO (1) | WO2007124708A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2012500479A (ja) * | 2008-08-19 | 2012-01-05 | ラティス パワー (チアンシ) コーポレイション | 両面不動態化を伴う半導体発光デバイスを製造するための方法 |
JP2017534185A (ja) * | 2014-11-06 | 2017-11-16 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 頂部コンタクトの下方にトレンチを有する発光デバイス |
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Publication number | Priority date | Publication date | Assignee | Title |
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DE102007020291A1 (de) | 2007-01-31 | 2008-08-07 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung einer Kontaktstruktur für einen derartigen Chip |
US10463774B2 (en) * | 2007-02-27 | 2019-11-05 | Deka Products Limited Partnership | Control systems and methods for blood or fluid handling medical devices |
EP2259346B1 (en) * | 2008-03-27 | 2019-07-03 | LG Innotek Co., Ltd. | Light-emitting element and a production method therefor |
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Publication number | Publication date |
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DE102006034847A1 (de) | 2007-10-31 |
CN101427392A (zh) | 2009-05-06 |
JP5404386B2 (ja) | 2014-01-29 |
EP2011160B1 (de) | 2018-08-15 |
KR101294911B1 (ko) | 2013-08-08 |
US8378371B2 (en) | 2013-02-19 |
WO2007124708A1 (de) | 2007-11-08 |
KR20090009912A (ko) | 2009-01-23 |
US20100019268A1 (en) | 2010-01-28 |
CN101427392B (zh) | 2011-04-06 |
TW200802984A (en) | 2008-01-01 |
EP2011160A1 (de) | 2009-01-07 |
TWI381545B (zh) | 2013-01-01 |
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