JP2009529238A5 - - Google Patents

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Publication number
JP2009529238A5
JP2009529238A5 JP2008558291A JP2008558291A JP2009529238A5 JP 2009529238 A5 JP2009529238 A5 JP 2009529238A5 JP 2008558291 A JP2008558291 A JP 2008558291A JP 2008558291 A JP2008558291 A JP 2008558291A JP 2009529238 A5 JP2009529238 A5 JP 2009529238A5
Authority
JP
Japan
Prior art keywords
signal
guard
substrate
conductive
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008558291A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009529238A (ja
JP5189995B2 (ja
Filing date
Publication date
Priority claimed from US11/308,094 external-priority patent/US7956633B2/en
Application filed filed Critical
Publication of JP2009529238A publication Critical patent/JP2009529238A/ja
Publication of JP2009529238A5 publication Critical patent/JP2009529238A5/ja
Application granted granted Critical
Publication of JP5189995B2 publication Critical patent/JP5189995B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008558291A 2006-03-06 2007-02-22 積重ねガード構造 Expired - Fee Related JP5189995B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/308,094 2006-03-06
US11/308,094 US7956633B2 (en) 2006-03-06 2006-03-06 Stacked guard structures
PCT/US2007/004668 WO2007102998A2 (en) 2006-03-06 2007-02-22 Stacked guard structures

Publications (3)

Publication Number Publication Date
JP2009529238A JP2009529238A (ja) 2009-08-13
JP2009529238A5 true JP2009529238A5 (enExample) 2010-03-18
JP5189995B2 JP5189995B2 (ja) 2013-04-24

Family

ID=38470927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008558291A Expired - Fee Related JP5189995B2 (ja) 2006-03-06 2007-02-22 積重ねガード構造

Country Status (7)

Country Link
US (1) US7956633B2 (enExample)
EP (1) EP1996954A2 (enExample)
JP (1) JP5189995B2 (enExample)
KR (1) KR20080100458A (enExample)
CN (1) CN101395486A (enExample)
TW (1) TWI430411B (enExample)
WO (1) WO2007102998A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7724004B2 (en) * 2005-12-21 2010-05-25 Formfactor, Inc. Probing apparatus with guarded signal traces
US8130005B2 (en) * 2006-12-14 2012-03-06 Formfactor, Inc. Electrical guard structures for protecting a signal trace from electrical interference
US8362797B2 (en) * 2009-08-25 2013-01-29 Advanced Inquiry Systems, Inc. Maintaining a wafer/wafer translator pair in an attached state free of a gasket disposed therebetween
US9176186B2 (en) 2009-08-25 2015-11-03 Translarity, Inc. Maintaining a wafer/wafer translator pair in an attached state free of a gasket disposed
TW201122493A (en) * 2009-12-24 2011-07-01 Premtek Int Inc Microprobe structure and method of making the same
ITMI20120453A1 (it) * 2012-03-22 2013-09-23 Technoprobe Spa Struttura di connessione di tipo ibrido
KR20140110443A (ko) * 2013-03-08 2014-09-17 삼성전자주식회사 프로브 카드
US9911563B2 (en) * 2013-07-31 2018-03-06 Analog Devices Global MEMS switch device and method of fabrication
JP6548849B1 (ja) * 2018-08-27 2019-07-24 三菱電機株式会社 光モジュール

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4189825A (en) * 1975-06-04 1980-02-26 Raytheon Company Integrated test and assembly device
JPS6032401A (ja) * 1983-08-03 1985-02-19 Nec Corp 帯域濾波器
JPS617101U (ja) * 1984-06-18 1986-01-17 ティーディーケイ株式会社 ストリツプライン型フイルタ
JPS61114601A (ja) * 1984-11-08 1986-06-02 Matsushita Electric Ind Co Ltd フイルタ装置
US5103557A (en) * 1988-05-16 1992-04-14 Leedy Glenn J Making and testing an integrated circuit using high density probe points
DE69416200T2 (de) * 1993-06-16 1999-06-02 Nitto Denko Corp., Ibaraki, Osaka Sondenkonstruktion
US5416429A (en) * 1994-05-23 1995-05-16 Wentworth Laboratories, Inc. Probe assembly for testing integrated circuits
US5621333A (en) * 1995-05-19 1997-04-15 Microconnect, Inc. Contact device for making connection to an electronic circuit device
US6034533A (en) 1997-06-10 2000-03-07 Tervo; Paul A. Low-current pogo probe card
US6292003B1 (en) * 1998-07-01 2001-09-18 Xilinx, Inc. Apparatus and method for testing chip scale package integrated circuits
US6215320B1 (en) * 1998-10-23 2001-04-10 Teradyne, Inc. High density printed circuit board
US6268015B1 (en) * 1998-12-02 2001-07-31 Formfactor Method of making and using lithographic contact springs
US6351133B1 (en) * 1999-03-31 2002-02-26 Adoamtest Corp. Packaging and interconnection of contact structure
JP2000307312A (ja) * 1999-04-15 2000-11-02 Nec Corp 回路特性の調整方法
JP2001007525A (ja) * 1999-06-24 2001-01-12 Kyocera Corp 多層配線基板
JP3710652B2 (ja) * 1999-08-03 2005-10-26 三菱電機株式会社 ストリップライン給電装置
DE10023736A1 (de) * 2000-05-15 2001-11-22 Harting Elektrooptische Bauteile Gmbh & Co Kg Leiterplatte sowie Verfahren zur Herstellung einer Leiterplatte
US20050068054A1 (en) * 2000-05-23 2005-03-31 Sammy Mok Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies
JP3487283B2 (ja) * 2000-10-31 2004-01-13 三菱電機株式会社 差動ストリップ線路垂直変換器および光モジュール
US6657130B2 (en) * 2001-09-20 2003-12-02 International Business Machines Corporation Electrical and physical design integration method and apparatus for providing interconnections on first level ceramic chip carrier packages
TW565529B (en) * 2002-01-24 2003-12-11 Scs Hightech Inc Probe card and method for testing the proceed function or speed of electronic devices
US7724004B2 (en) 2005-12-21 2010-05-25 Formfactor, Inc. Probing apparatus with guarded signal traces
US8130005B2 (en) 2006-12-14 2012-03-06 Formfactor, Inc. Electrical guard structures for protecting a signal trace from electrical interference

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