JP2009524237A - プロービング・システムにおける改良した安定のための方法及び装置 - Google Patents

プロービング・システムにおける改良した安定のための方法及び装置 Download PDF

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Publication number
JP2009524237A
JP2009524237A JP2008551251A JP2008551251A JP2009524237A JP 2009524237 A JP2009524237 A JP 2009524237A JP 2008551251 A JP2008551251 A JP 2008551251A JP 2008551251 A JP2008551251 A JP 2008551251A JP 2009524237 A JP2009524237 A JP 2009524237A
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actuation force
relative
acceleration
component
sensor
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Japanese (ja)
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JP2009524237A5 (enExample
Inventor
ウダイ，ナヤック
キャスラー，リチャード・ジェイムズ・ジェイアール
ジェダ，マックス
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エレクトログラス・インコーポレーテッド
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Publication of JP2009524237A5 publication Critical patent/JP2009524237A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Telephone Function (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2008551251A 2006-01-18 2006-10-30 プロービング・システムにおける改良した安定のための方法及び装置 Pending JP2009524237A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/335,081 US7352198B2 (en) 2006-01-18 2006-01-18 Methods and apparatuses for improved stabilization in a probing system
PCT/US2006/042343 WO2007084205A1 (en) 2006-01-18 2006-10-30 Methods and apparatuses for improved stabilization in a probing system

Publications (2)

Publication Number Publication Date
JP2009524237A true JP2009524237A (ja) 2009-06-25
JP2009524237A5 JP2009524237A5 (enExample) 2010-01-14

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ID=37875700

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JP2008551251A Pending JP2009524237A (ja) 2006-01-18 2006-10-30 プロービング・システムにおける改良した安定のための方法及び装置

Country Status (6)

Country Link
US (3) US7352198B2 (enExample)
JP (1) JP2009524237A (enExample)
KR (1) KR101297262B1 (enExample)
CN (1) CN101297205A (enExample)
TW (1) TWI442067B (enExample)
WO (1) WO2007084205A1 (enExample)

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US8120304B2 (en) 2008-12-12 2012-02-21 Formfactor, Inc. Method for improving motion times of a stage
US8519728B2 (en) * 2008-12-12 2013-08-27 Formfactor, Inc. Compliance control methods and apparatuses
US8902062B2 (en) * 2011-01-27 2014-12-02 Honeywell International Inc. Systems and methods for detection of device displacement and tampering
CN102495344B (zh) * 2011-11-11 2014-12-17 深圳市矽电半导体设备有限公司 一种晶粒探测方法和系统
US9395404B2 (en) * 2012-12-14 2016-07-19 Infineon Technologies Ag Method for testing semiconductor chips or semiconductor chip modules
US9478237B2 (en) 2013-09-18 2016-10-25 Seagate Technology Llc Work piece contact pad with centering feature
TWI515442B (zh) * 2013-12-13 2016-01-01 Mpi Corp Electrical testing machine
US9459886B2 (en) * 2014-08-06 2016-10-04 Texas Instruments Incorporated Autonomous sleep mode
US10060475B2 (en) * 2014-12-24 2018-08-28 Teradyne, Inc. Braking system
KR102544684B1 (ko) * 2016-01-30 2023-06-19 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 시스템 아이솔레이션 및 광학계 베이 실링
US11125814B2 (en) * 2017-02-22 2021-09-21 Sintokogio, Ltd. Test system
CN109451763B (zh) 2018-05-16 2019-11-08 长江存储科技有限责任公司 用于晶圆键合对准补偿的方法和系统
US20240094261A1 (en) * 2020-08-12 2024-03-21 Microfabrica Inc. Probe Arrays and Improved Methods for Making and Using Longitudinal Deformation of Probe Preforms
KR102819345B1 (ko) 2020-11-17 2025-06-11 세메스 주식회사 주행 장치 및 이를 이용한 약액 토출 장치
EP4027150A1 (en) * 2021-01-07 2022-07-13 Afore Oy Testing device and method for reducing vibration in a testing device
CN114000192B (zh) * 2021-10-29 2023-10-13 北京北方华创微电子装备有限公司 半导体工艺设备以及晶圆位置状态的监测方法
TWI794002B (zh) * 2022-01-28 2023-02-21 緯創資通股份有限公司 多媒體系統以及多媒體操作方法
KR102766445B1 (ko) * 2022-05-19 2025-02-12 주식회사 쎄믹스 프로버 진단 시스템
KR102725022B1 (ko) * 2024-01-23 2024-11-01 주식회사 프로이천 3축방향 회전의 구속에 의해 프로브블록의 흔들림이 방지된 프로브 검사장치

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JPH01284793A (ja) * 1988-05-11 1989-11-16 Canon Inc 基板支持装置
US5814733A (en) * 1996-09-12 1998-09-29 Motorola, Inc. Method of characterizing dynamics of a workpiece handling system
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JP2001102279A (ja) * 1999-09-27 2001-04-13 Nikon Corp ステージ装置および露光装置
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JP2004152916A (ja) * 2002-10-29 2004-05-27 Nec Corp 半導体デバイス検査装置及び検査方法
JP2005300381A (ja) * 2004-04-13 2005-10-27 Seiko Epson Corp プローブ検査装置及びプローブ検査装置本体

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01284793A (ja) * 1988-05-11 1989-11-16 Canon Inc 基板支持装置
US5814733A (en) * 1996-09-12 1998-09-29 Motorola, Inc. Method of characterizing dynamics of a workpiece handling system
JPH11162828A (ja) * 1997-11-21 1999-06-18 Nikon Corp 投影露光装置及び投影露光方法
JPH11190762A (ja) * 1997-12-26 1999-07-13 Micronics Japan Co Ltd マニュアルプローバ
JPH11251381A (ja) * 1998-03-02 1999-09-17 Micronics Japan Co Ltd マニュアルプローバ
JP2000216084A (ja) * 1998-11-19 2000-08-04 Nikon Corp 投影露光装置
JP2001102279A (ja) * 1999-09-27 2001-04-13 Nikon Corp ステージ装置および露光装置
JP2001110717A (ja) * 1999-10-13 2001-04-20 Nikon Corp ステージ装置およびステージ制御方法並びに露光装置
JP2004152916A (ja) * 2002-10-29 2004-05-27 Nec Corp 半導体デバイス検査装置及び検査方法
JP2005300381A (ja) * 2004-04-13 2005-10-27 Seiko Epson Corp プローブ検査装置及びプローブ検査装置本体

Also Published As

Publication number Publication date
WO2007084205A1 (en) 2007-07-26
CN101297205A (zh) 2008-10-29
US7877528B2 (en) 2011-01-25
TWI442067B (zh) 2014-06-21
TW200745570A (en) 2007-12-16
US20070164760A1 (en) 2007-07-19
KR101297262B1 (ko) 2013-08-16
US7352198B2 (en) 2008-04-01
US20100087147A1 (en) 2010-04-08
US20080100321A1 (en) 2008-05-01
US7622939B2 (en) 2009-11-24
KR20080093409A (ko) 2008-10-21

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