JP2009514234A5 - - Google Patents

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Publication number
JP2009514234A5
JP2009514234A5 JP2008538086A JP2008538086A JP2009514234A5 JP 2009514234 A5 JP2009514234 A5 JP 2009514234A5 JP 2008538086 A JP2008538086 A JP 2008538086A JP 2008538086 A JP2008538086 A JP 2008538086A JP 2009514234 A5 JP2009514234 A5 JP 2009514234A5
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JP
Japan
Prior art keywords
placement
pick
solder paste
place machine
reference value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008538086A
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English (en)
Japanese (ja)
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JP2009514234A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2006/042337 external-priority patent/WO2007053557A1/en
Publication of JP2009514234A publication Critical patent/JP2009514234A/ja
Publication of JP2009514234A5 publication Critical patent/JP2009514234A5/ja
Pending legal-status Critical Current

Links

JP2008538086A 2005-10-31 2006-10-31 組み込み型半田ペースト検査を備える電子アセンブリマシン Pending JP2009514234A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US73184805P 2005-10-31 2005-10-31
PCT/US2006/042337 WO2007053557A1 (en) 2005-10-31 2006-10-31 Electronics assembly machine with embedded solder paste inspection

Publications (2)

Publication Number Publication Date
JP2009514234A JP2009514234A (ja) 2009-04-02
JP2009514234A5 true JP2009514234A5 (https=) 2009-11-26

Family

ID=37762333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008538086A Pending JP2009514234A (ja) 2005-10-31 2006-10-31 組み込み型半田ペースト検査を備える電子アセンブリマシン

Country Status (4)

Country Link
US (1) US20070130755A1 (https=)
JP (1) JP2009514234A (https=)
DE (1) DE112006003019T5 (https=)
WO (1) WO2007053557A1 (https=)

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CN114799516B (zh) * 2022-04-15 2023-03-07 南京航空航天大学 一种三维立体电路智能组装焊接系统及其工作方法

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