DE112006003019T5 - Elektronikmontagevorrichtung mit eingebauter Lötpastenprüfung - Google Patents

Elektronikmontagevorrichtung mit eingebauter Lötpastenprüfung Download PDF

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Publication number
DE112006003019T5
DE112006003019T5 DE112006003019T DE112006003019T DE112006003019T5 DE 112006003019 T5 DE112006003019 T5 DE 112006003019T5 DE 112006003019 T DE112006003019 T DE 112006003019T DE 112006003019 T DE112006003019 T DE 112006003019T DE 112006003019 T5 DE112006003019 T5 DE 112006003019T5
Authority
DE
Germany
Prior art keywords
placement
solder paste
component
machine according
metric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112006003019T
Other languages
German (de)
English (en)
Inventor
David W. Minneapolis Duquette
Swaminathan Wilmington Manickam
John P. Minneapolis Konicek
Steven K. St. Louis Park Case
Eric P. Hopkins Rudd
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cyberoptics Corp
Original Assignee
Cyberoptics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cyberoptics Corp filed Critical Cyberoptics Corp
Publication of DE112006003019T5 publication Critical patent/DE112006003019T5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/532—Conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
DE112006003019T 2005-10-31 2006-10-31 Elektronikmontagevorrichtung mit eingebauter Lötpastenprüfung Withdrawn DE112006003019T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US73184805P 2005-10-31 2005-10-31
US60/731,848 2005-10-31
PCT/US2006/042337 WO2007053557A1 (en) 2005-10-31 2006-10-31 Electronics assembly machine with embedded solder paste inspection

Publications (1)

Publication Number Publication Date
DE112006003019T5 true DE112006003019T5 (de) 2008-10-23

Family

ID=37762333

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112006003019T Withdrawn DE112006003019T5 (de) 2005-10-31 2006-10-31 Elektronikmontagevorrichtung mit eingebauter Lötpastenprüfung

Country Status (4)

Country Link
US (1) US20070130755A1 (https=)
JP (1) JP2009514234A (https=)
DE (1) DE112006003019T5 (https=)
WO (1) WO2007053557A1 (https=)

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DE112017007435B4 (de) * 2017-04-13 2025-07-10 Ckd Corporation Komponentenbestückungssystem und klebemitteluntersuchungsvorrichtung

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JP4793187B2 (ja) * 2006-09-11 2011-10-12 パナソニック株式会社 電子部品実装システムおよび電子部品実装方法
US20090250246A1 (en) * 2008-04-07 2009-10-08 Andrew Yaung Solder by numbers, a method and system for populating printed circuit boards
US8385404B2 (en) 2008-09-11 2013-02-26 Google Inc. System and method for video encoding using constructed reference frame
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US8638854B1 (en) 2011-04-07 2014-01-28 Google Inc. Apparatus and method for creating an alternate reference frame for video compression using maximal differences
US9154799B2 (en) 2011-04-07 2015-10-06 Google Inc. Encoding and decoding motion via image segmentation
TW201301412A (zh) * 2011-06-20 2013-01-01 華新麗華股份有限公司 晶片結合方法
US9609341B1 (en) 2012-04-23 2017-03-28 Google Inc. Video data encoding and decoding using reference picture lists
WO2013162980A2 (en) 2012-04-23 2013-10-31 Google Inc. Managing multi-reference picture buffers for video data coding
US9014266B1 (en) 2012-06-05 2015-04-21 Google Inc. Decimated sliding windows for multi-reference prediction in video coding
US9756331B1 (en) 2013-06-17 2017-09-05 Google Inc. Advance coded reference prediction
JP6199798B2 (ja) * 2014-04-30 2017-09-20 ヤマハ発動機株式会社 電子部品装着装置
WO2019103051A1 (ja) * 2017-11-21 2019-05-31 株式会社ハリーズ 電子部品取付装置及び電子装置の製造方法
CN114799516B (zh) * 2022-04-15 2023-03-07 南京航空航天大学 一种三维立体电路智能组装焊接系统及其工作方法

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