JP2009510779A5 - - Google Patents
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- Publication number
- JP2009510779A5 JP2009510779A5 JP2008533451A JP2008533451A JP2009510779A5 JP 2009510779 A5 JP2009510779 A5 JP 2009510779A5 JP 2008533451 A JP2008533451 A JP 2008533451A JP 2008533451 A JP2008533451 A JP 2008533451A JP 2009510779 A5 JP2009510779 A5 JP 2009510779A5
- Authority
- JP
- Japan
- Prior art keywords
- alumina particles
- acid
- less
- polishing composition
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 31
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 28
- 239000002245 particle Substances 0.000 claims 28
- 239000000203 mixture Substances 0.000 claims 24
- 238000000034 method Methods 0.000 claims 15
- 239000000758 substrate Substances 0.000 claims 13
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims 8
- 239000012964 benzotriazole Substances 0.000 claims 8
- 150000007524 organic acids Chemical class 0.000 claims 8
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims 6
- 238000005260 corrosion Methods 0.000 claims 6
- 230000007797 corrosion Effects 0.000 claims 6
- 239000003112 inhibitor Substances 0.000 claims 6
- 150000003852 triazoles Chemical class 0.000 claims 6
- 239000000126 substance Substances 0.000 claims 5
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical compound [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 4
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 claims 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims 4
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 4
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 claims 4
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims 4
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 claims 4
- SXDBWCPKPHAZSM-UHFFFAOYSA-M bromate Inorganic materials [O-]Br(=O)=O SXDBWCPKPHAZSM-UHFFFAOYSA-M 0.000 claims 4
- SXDBWCPKPHAZSM-UHFFFAOYSA-N bromic acid Chemical compound OBr(=O)=O SXDBWCPKPHAZSM-UHFFFAOYSA-N 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 4
- 239000010949 copper Substances 0.000 claims 4
- WQYVRQLZKVEZGA-UHFFFAOYSA-N hypochlorite Chemical compound Cl[O-] WQYVRQLZKVEZGA-UHFFFAOYSA-N 0.000 claims 4
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims 4
- 239000007800 oxidant agent Substances 0.000 claims 4
- 239000011975 tartaric acid Substances 0.000 claims 4
- 235000002906 tartaric acid Nutrition 0.000 claims 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 4
- KGBFTABKELZLNU-UHFFFAOYSA-N (5-oxo-1,2,3,4,5lambda5-tetraoxaphospholan-5-yl) dihydrogen phosphate Chemical class OP(=O)(O)OP1(=O)OOOO1 KGBFTABKELZLNU-UHFFFAOYSA-N 0.000 claims 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims 2
- 125000001399 1,2,3-triazolyl group Chemical group N1N=NC(=C1)* 0.000 claims 2
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims 2
- NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical compound C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 claims 2
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 claims 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims 2
- 239000004471 Glycine Substances 0.000 claims 2
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 claims 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims 2
- 239000001361 adipic acid Substances 0.000 claims 2
- 235000011037 adipic acid Nutrition 0.000 claims 2
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims 2
- 235000003704 aspartic acid Nutrition 0.000 claims 2
- OQFSQFPPLPISGP-UHFFFAOYSA-N beta-carboxyaspartic acid Natural products OC(=O)C(N)C(C(O)=O)C(O)=O OQFSQFPPLPISGP-UHFFFAOYSA-N 0.000 claims 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims 2
- 229910001919 chlorite Inorganic materials 0.000 claims 2
- 229910052619 chlorite group Inorganic materials 0.000 claims 2
- QBWCMBCROVPCKQ-UHFFFAOYSA-N chlorous acid Chemical compound OCl=O QBWCMBCROVPCKQ-UHFFFAOYSA-N 0.000 claims 2
- 235000015165 citric acid Nutrition 0.000 claims 2
- 239000001530 fumaric acid Substances 0.000 claims 2
- 239000000174 gluconic acid Substances 0.000 claims 2
- 235000012208 gluconic acid Nutrition 0.000 claims 2
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 claims 2
- ICIWUVCWSCSTAQ-UHFFFAOYSA-M iodate Chemical compound [O-]I(=O)=O ICIWUVCWSCSTAQ-UHFFFAOYSA-M 0.000 claims 2
- 239000004310 lactic acid Substances 0.000 claims 2
- 235000014655 lactic acid Nutrition 0.000 claims 2
- 239000001630 malic acid Substances 0.000 claims 2
- 235000011090 malic acid Nutrition 0.000 claims 2
- KHIWWQKSHDUIBK-UHFFFAOYSA-N periodic acid Chemical compound OI(=O)(=O)=O KHIWWQKSHDUIBK-UHFFFAOYSA-N 0.000 claims 2
- -1 permanganate Chemical compound 0.000 claims 2
- 150000003839 salts Chemical class 0.000 claims 2
- BUFQZEHPOKLSTP-UHFFFAOYSA-M sodium;oxido hydrogen sulfate Chemical compound [Na+].OS(=O)(=O)O[O-] BUFQZEHPOKLSTP-UHFFFAOYSA-M 0.000 claims 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims 2
- 229910019142 PO4 Inorganic materials 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims 1
- 239000010452 phosphate Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/241,137 | 2005-09-30 | ||
| US11/241,137 US7955519B2 (en) | 2005-09-30 | 2005-09-30 | Composition and method for planarizing surfaces |
| PCT/US2006/036813 WO2007041004A2 (en) | 2005-09-30 | 2006-09-21 | Composition and method for planarizing surfaces |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009510779A JP2009510779A (ja) | 2009-03-12 |
| JP2009510779A5 true JP2009510779A5 (enExample) | 2009-08-27 |
| JP5188976B2 JP5188976B2 (ja) | 2013-04-24 |
Family
ID=37499360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008533451A Active JP5188976B2 (ja) | 2005-09-30 | 2006-09-21 | 表面を平坦化するための組成物及び方法 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7955519B2 (enExample) |
| EP (1) | EP1928964B1 (enExample) |
| JP (1) | JP5188976B2 (enExample) |
| KR (1) | KR101281932B1 (enExample) |
| CN (2) | CN101297009A (enExample) |
| IL (1) | IL190428A (enExample) |
| MY (1) | MY148917A (enExample) |
| SG (1) | SG166114A1 (enExample) |
| TW (1) | TWI326705B (enExample) |
| WO (1) | WO2007041004A2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5273710B2 (ja) * | 2007-11-27 | 2013-08-28 | メック株式会社 | エッチング剤 |
| MY177717A (en) * | 2013-10-18 | 2020-09-23 | Cmc Mat Inc | Polishing composition and method for nickel-phosphorous coated memory disks |
| CN110256968B (zh) * | 2019-05-29 | 2021-01-01 | 湖南皓志科技股份有限公司 | 一种用于铜抛光的氧化铝抛光液及其制备方法 |
| CN118064060B (zh) * | 2024-02-21 | 2025-11-11 | 中国机械总院集团海西(福建)分院有限公司 | 一种bak-4光学棱镜精抛用高分散性抛光液及其制备方法 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4657754A (en) * | 1985-11-21 | 1987-04-14 | Norton Company | Aluminum oxide powders and process |
| JPH01257563A (ja) * | 1988-04-08 | 1989-10-13 | Showa Denko Kk | アルミニウム磁気ディスク研磨用組成物 |
| US6046110A (en) * | 1995-06-08 | 2000-04-04 | Kabushiki Kaisha Toshiba | Copper-based metal polishing solution and method for manufacturing a semiconductor device |
| US5693239A (en) * | 1995-10-10 | 1997-12-02 | Rodel, Inc. | Polishing slurries comprising two abrasive components and methods for their use |
| US5710069A (en) * | 1996-08-26 | 1998-01-20 | Motorola, Inc. | Measuring slurry particle size during substrate polishing |
| WO2000039844A1 (fr) | 1998-12-28 | 2000-07-06 | Hitachi Chemical Company, Ltd. | Materiaux pour liquide de polissage de metal, liquide de polissage de metal, procede de preparation et procede de polissage connexes |
| JP3523107B2 (ja) * | 1999-03-17 | 2004-04-26 | 株式会社東芝 | Ｃｍｐ用スラリおよびｃｍｐ法 |
| JP4614497B2 (ja) * | 1999-07-13 | 2011-01-19 | 花王株式会社 | 研磨液組成物 |
| JP4391715B2 (ja) * | 1999-08-13 | 2009-12-24 | キャボット マイクロエレクトロニクス コーポレイション | 化学機械的研磨系 |
| US6855266B1 (en) * | 1999-08-13 | 2005-02-15 | Cabot Microelectronics Corporation | Polishing system with stopping compound and method of its use |
| US20020111027A1 (en) * | 1999-12-14 | 2002-08-15 | Vikas Sachan | Polishing compositions for noble metals |
| US20030006396A1 (en) * | 1999-12-14 | 2003-01-09 | Hongyu Wang | Polishing composition for CMP having abrasive particles |
| JP3602393B2 (ja) * | 1999-12-28 | 2004-12-15 | Ｎｅｃエレクトロニクス株式会社 | 化学的機械的研磨用スラリー |
| JP3490038B2 (ja) * | 1999-12-28 | 2004-01-26 | Ｎｅｃエレクトロニクス株式会社 | 金属配線形成方法 |
| TW572980B (en) * | 2000-01-12 | 2004-01-21 | Jsr Corp | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process |
| JP2002050595A (ja) * | 2000-08-04 | 2002-02-15 | Hitachi Ltd | 研磨方法、配線形成方法及び半導体装置の製造方法 |
| JP3768402B2 (ja) * | 2000-11-24 | 2006-04-19 | Ｎｅｃエレクトロニクス株式会社 | 化学的機械的研磨用スラリー |
| US7128825B2 (en) * | 2001-03-14 | 2006-10-31 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| US7232514B2 (en) | 2001-03-14 | 2007-06-19 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| SG144688A1 (en) * | 2001-07-23 | 2008-08-28 | Fujimi Inc | Polishing composition and polishing method employing it |
| US6821897B2 (en) | 2001-12-05 | 2004-11-23 | Cabot Microelectronics Corporation | Method for copper CMP using polymeric complexing agents |
| US7097541B2 (en) * | 2002-01-22 | 2006-08-29 | Cabot Microelectronics Corporation | CMP method for noble metals |
| FR2839125B1 (fr) * | 2002-04-30 | 2005-02-18 | France Reducteurs Sa | Mecanisme d'embrayage a cones |
| US6936543B2 (en) * | 2002-06-07 | 2005-08-30 | Cabot Microelectronics Corporation | CMP method utilizing amphiphilic nonionic surfactants |
| EP1544901B1 (en) * | 2002-09-25 | 2009-12-16 | Seimi Chemical Co., Ltd. | Polishing compound composition and polishing method |
| JP2004193495A (ja) * | 2002-12-13 | 2004-07-08 | Toshiba Corp | 化学的機械的研磨用スラリーおよびこれを用いた半導体装置の製造方法 |
| US6896591B2 (en) * | 2003-02-11 | 2005-05-24 | Cabot Microelectronics Corporation | Mixed-abrasive polishing composition and method for using the same |
| US20040198584A1 (en) * | 2003-04-02 | 2004-10-07 | Saint-Gobain Ceramics & Plastic, Inc. | Nanoporous ultrafine alpha-alumina powders and freeze drying process of preparing same |
| US7422730B2 (en) * | 2003-04-02 | 2008-09-09 | Saint-Gobain Ceramics & Plastics, Inc. | Nanoporous ultrafine α-alumina powders and sol-gel process of preparing same |
| US7968465B2 (en) | 2003-08-14 | 2011-06-28 | Dupont Air Products Nanomaterials Llc | Periodic acid compositions for polishing ruthenium/low K substrates |
| US7247566B2 (en) * | 2003-10-23 | 2007-07-24 | Dupont Air Products Nanomaterials Llc | CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers |
| US20050211950A1 (en) * | 2004-03-24 | 2005-09-29 | Cabot Microelectronics Corporation | Chemical-mechanical polishing composition and method for using the same |
| US7497938B2 (en) * | 2005-03-22 | 2009-03-03 | Cabot Microelectronics Corporation | Tribo-chronoamperometry as a tool for CMP application |
| US7311856B2 (en) * | 2005-03-30 | 2007-12-25 | Cabot Microelectronics Corporation | Polymeric inhibitors for enhanced planarization |
-
2005
- 2005-09-30 US US11/241,137 patent/US7955519B2/en active Active
-
2006
- 2006-09-21 SG SG201007173-6A patent/SG166114A1/en unknown
- 2006-09-21 CN CNA2006800396642A patent/CN101297009A/zh active Pending
- 2006-09-21 EP EP06803982.5A patent/EP1928964B1/en not_active Not-in-force
- 2006-09-21 WO PCT/US2006/036813 patent/WO2007041004A2/en not_active Ceased
- 2006-09-21 KR KR1020087010337A patent/KR101281932B1/ko active Active
- 2006-09-21 MY MYPI20080903A patent/MY148917A/en unknown
- 2006-09-21 JP JP2008533451A patent/JP5188976B2/ja active Active
- 2006-09-21 CN CN2013100999317A patent/CN103214972A/zh active Pending
- 2006-09-29 TW TW095136319A patent/TWI326705B/zh active
-
2008
- 2008-03-25 IL IL190428A patent/IL190428A/en not_active IP Right Cessation
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