KR101281932B1 - 표면 평탄화를 위한 조성물 및 방법 - Google Patents

표면 평탄화를 위한 조성물 및 방법 Download PDF

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KR101281932B1
KR101281932B1 KR1020087010337A KR20087010337A KR101281932B1 KR 101281932 B1 KR101281932 B1 KR 101281932B1 KR 1020087010337 A KR1020087010337 A KR 1020087010337A KR 20087010337 A KR20087010337 A KR 20087010337A KR 101281932 B1 KR101281932 B1 KR 101281932B1
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South Korea
Prior art keywords
acid
alumina particles
less
polishing composition
substrate
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Korean (ko)
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KR20080061386A (ko
Inventor
유천 왕
제이슨 아지오
빈 루
존 파커
렌지 추
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캐보트 마이크로일렉트로닉스 코포레이션
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Publication of KR20080061386A publication Critical patent/KR20080061386A/ko
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
KR1020087010337A 2005-09-30 2006-09-21 표면 평탄화를 위한 조성물 및 방법 Active KR101281932B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/241,137 2005-09-30
US11/241,137 US7955519B2 (en) 2005-09-30 2005-09-30 Composition and method for planarizing surfaces
PCT/US2006/036813 WO2007041004A2 (en) 2005-09-30 2006-09-21 Composition and method for planarizing surfaces

Publications (2)

Publication Number Publication Date
KR20080061386A KR20080061386A (ko) 2008-07-02
KR101281932B1 true KR101281932B1 (ko) 2013-07-03

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ID=37499360

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Application Number Title Priority Date Filing Date
KR1020087010337A Active KR101281932B1 (ko) 2005-09-30 2006-09-21 표면 평탄화를 위한 조성물 및 방법

Country Status (10)

Country Link
US (1) US7955519B2 (enExample)
EP (1) EP1928964B1 (enExample)
JP (1) JP5188976B2 (enExample)
KR (1) KR101281932B1 (enExample)
CN (2) CN101297009A (enExample)
IL (1) IL190428A (enExample)
MY (1) MY148917A (enExample)
SG (1) SG166114A1 (enExample)
TW (1) TWI326705B (enExample)
WO (1) WO2007041004A2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5273710B2 (ja) * 2007-11-27 2013-08-28 メック株式会社 エッチング剤
MY177717A (en) * 2013-10-18 2020-09-23 Cmc Mat Inc Polishing composition and method for nickel-phosphorous coated memory disks
CN110256968B (zh) * 2019-05-29 2021-01-01 湖南皓志科技股份有限公司 一种用于铜抛光的氧化铝抛光液及其制备方法
CN118064060B (zh) * 2024-02-21 2025-11-11 中国机械总院集团海西(福建)分院有限公司 一种bak-4光学棱镜精抛用高分散性抛光液及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005019364A1 (en) * 2003-08-14 2005-03-03 Ekc Technology, Inc. Periodic acid compositions for polishing ruthenium/high k substrates

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WO2000039844A1 (fr) 1998-12-28 2000-07-06 Hitachi Chemical Company, Ltd. Materiaux pour liquide de polissage de metal, liquide de polissage de metal, procede de preparation et procede de polissage connexes
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WO2005019364A1 (en) * 2003-08-14 2005-03-03 Ekc Technology, Inc. Periodic acid compositions for polishing ruthenium/high k substrates

Also Published As

Publication number Publication date
US7955519B2 (en) 2011-06-07
CN101297009A (zh) 2008-10-29
WO2007041004A3 (en) 2007-06-21
KR20080061386A (ko) 2008-07-02
JP5188976B2 (ja) 2013-04-24
SG166114A1 (en) 2010-11-29
IL190428A (en) 2012-04-30
EP1928964A2 (en) 2008-06-11
WO2007041004A2 (en) 2007-04-12
MY148917A (en) 2013-06-14
US20070075040A1 (en) 2007-04-05
IL190428A0 (en) 2008-11-03
EP1928964B1 (en) 2016-12-21
CN103214972A (zh) 2013-07-24
TWI326705B (en) 2010-07-01
TW200722510A (en) 2007-06-16
JP2009510779A (ja) 2009-03-12

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