JP2009506577A - ランダム・アクセス電気的プログラム可能なeヒューズrom - Google Patents
ランダム・アクセス電気的プログラム可能なeヒューズrom Download PDFInfo
- Publication number
- JP2009506577A JP2009506577A JP2008529166A JP2008529166A JP2009506577A JP 2009506577 A JP2009506577 A JP 2009506577A JP 2008529166 A JP2008529166 A JP 2008529166A JP 2008529166 A JP2008529166 A JP 2008529166A JP 2009506577 A JP2009506577 A JP 2009506577A
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- programmable device
- voltage
- resistance
- efuse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000015654 memory Effects 0.000 claims abstract description 29
- 229910021332 silicide Inorganic materials 0.000 claims description 18
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 230000004907 flux Effects 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 229910021334 nickel silicide Inorganic materials 0.000 claims description 3
- RUFLMLWJRZAWLJ-UHFFFAOYSA-N nickel silicide Chemical group [Ni]=[Si]=[Ni] RUFLMLWJRZAWLJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000005516 engineering process Methods 0.000 abstract description 8
- 238000005457 optimization Methods 0.000 abstract 1
- 210000004027 cell Anatomy 0.000 description 19
- 238000013461 design Methods 0.000 description 18
- 238000005520 cutting process Methods 0.000 description 15
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 7
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 7
- 229920005591 polysilicon Polymers 0.000 description 7
- 238000012546 transfer Methods 0.000 description 6
- 238000003491 array Methods 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 210000000352 storage cell Anatomy 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000013100 final test Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 244000144972 livestock Species 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/16—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/16—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
- G11C17/165—Memory cells which are electrically programmed to cause a change in resistance, e.g. to permit multiple resistance steps to be programmed rather than conduct to or from non-conduct change of fuses and antifuses
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/18—Auxiliary circuits, e.g. for writing into memory
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/02—Detection or location of defective auxiliary circuits, e.g. defective refresh counters
- G11C29/026—Detection or location of defective auxiliary circuits, e.g. defective refresh counters in sense amplifiers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/02—Detection or location of defective auxiliary circuits, e.g. defective refresh counters
- G11C29/027—Detection or location of defective auxiliary circuits, e.g. defective refresh counters in fuses
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/06—Sense amplifiers; Associated circuits, e.g. timing or triggering circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/18—Bit line organisation; Bit line lay-out
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2229/00—Indexing scheme relating to checking stores for correct operation, subsequent repair or testing stores during standby or offline operation
- G11C2229/70—Indexing scheme relating to G11C29/70, for implementation aspects of redundancy repair
- G11C2229/76—Storage technology used for the repair
- G11C2229/763—E-fuses, e.g. electric fuses or antifuses, floating gate transistors
Landscapes
- Read Only Memory (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US71239405P | 2005-08-31 | 2005-08-31 | |
| PCT/US2006/033536 WO2007027607A2 (en) | 2005-08-31 | 2006-08-30 | Random access electrically programmable-e-fuse rom |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012099631A Division JP2012178587A (ja) | 2005-08-31 | 2012-04-25 | ランダム・アクセス電気的プログラム可能なeヒューズrom |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009506577A true JP2009506577A (ja) | 2009-02-12 |
| JP2009506577A5 JP2009506577A5 (enExample) | 2009-03-26 |
Family
ID=37809409
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008529166A Pending JP2009506577A (ja) | 2005-08-31 | 2006-08-30 | ランダム・アクセス電気的プログラム可能なeヒューズrom |
| JP2012099631A Pending JP2012178587A (ja) | 2005-08-31 | 2012-04-25 | ランダム・アクセス電気的プログラム可能なeヒューズrom |
| JP2014143116A Active JP5885315B2 (ja) | 2005-08-31 | 2014-07-11 | ランダム・アクセス電気的プログラム可能なeヒューズrom |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012099631A Pending JP2012178587A (ja) | 2005-08-31 | 2012-04-25 | ランダム・アクセス電気的プログラム可能なeヒューズrom |
| JP2014143116A Active JP5885315B2 (ja) | 2005-08-31 | 2014-07-11 | ランダム・アクセス電気的プログラム可能なeヒューズrom |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7817455B2 (enExample) |
| EP (1) | EP1920441A4 (enExample) |
| JP (3) | JP2009506577A (enExample) |
| KR (1) | KR101211213B1 (enExample) |
| CN (1) | CN101253573B (enExample) |
| WO (1) | WO2007027607A2 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010262726A (ja) * | 2009-04-30 | 2010-11-18 | Hynix Semiconductor Inc | ヒューズ回路及びそれを備える半導体装置 |
| JP2011108777A (ja) * | 2009-11-16 | 2011-06-02 | Renesas Electronics Corp | 半導体装置 |
| US9691499B1 (en) | 2016-02-08 | 2017-06-27 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4127678B2 (ja) * | 2004-02-27 | 2008-07-30 | 株式会社東芝 | 半導体装置及びそのプログラミング方法 |
| US7710813B1 (en) * | 2008-03-05 | 2010-05-04 | Xilinx, Inc. | Electronic fuse array |
| KR100974181B1 (ko) * | 2008-04-18 | 2010-08-05 | 창원대학교 산학협력단 | Otp 메모리 장치 |
| US8411482B2 (en) * | 2008-08-20 | 2013-04-02 | Intel Corporation | Programmable read only memory |
| US8305814B2 (en) * | 2008-11-17 | 2012-11-06 | Texas Instruments Incorporated | Sense amplifier with precharge delay circuit connected to output |
| CN102308338B (zh) * | 2009-02-06 | 2015-08-05 | 赛鼎矽公司 | 高可靠性的otp存储器 |
| US8400813B2 (en) * | 2009-02-10 | 2013-03-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | One-time programmable fuse with ultra low programming current |
| US8234543B2 (en) * | 2009-03-06 | 2012-07-31 | Via Technologies, Inc. | Detection and correction of fuse re-growth in a microprocessor |
| KR101127446B1 (ko) | 2009-06-05 | 2012-03-23 | 매그나칩 반도체 유한회사 | 비휘발성 메모리 장치의 단위 셀 및 이를 구비한 비휘발성 메모리 장치 |
| US8050129B2 (en) * | 2009-06-25 | 2011-11-01 | Mediatek Inc. | E-fuse apparatus for controlling reference voltage required for programming/reading e-fuse macro in an integrated circuit via switch device in the same integrated circuit |
| US8411483B2 (en) * | 2009-07-10 | 2013-04-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Testing one time programming devices |
| US8276032B2 (en) * | 2009-08-07 | 2012-09-25 | Via Technologies, Inc. | Detection of uncorrectable re-grown fuses in a microprocessor |
| US9741658B2 (en) * | 2009-10-30 | 2017-08-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electrical fuse structure and method of formation |
| TWI469149B (zh) * | 2010-04-09 | 2015-01-11 | Realtek Semiconductor Corp | 電子熔絲系統 |
| US8331126B2 (en) | 2010-06-28 | 2012-12-11 | Qualcomm Incorporated | Non-volatile memory with split write and read bitlines |
| US8569734B2 (en) | 2010-08-04 | 2013-10-29 | Micron Technology, Inc. | Forming resistive random access memories together with fuse arrays |
| US8194490B2 (en) * | 2010-09-08 | 2012-06-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electrical fuse memory arrays |
| US8492286B2 (en) * | 2010-11-22 | 2013-07-23 | International Business Machines Corporation | Method of forming E-fuse in replacement metal gate manufacturing process |
| US10110380B2 (en) * | 2011-03-28 | 2018-10-23 | Nxp B.V. | Secure dynamic on chip key programming |
| US8736278B2 (en) * | 2011-07-29 | 2014-05-27 | Tessera Inc. | System and method for testing fuse blow reliability for integrated circuits |
| KR101847541B1 (ko) | 2012-01-18 | 2018-04-11 | 에스케이하이닉스 주식회사 | 반도체 메모리 장치의 메모리 셀 구조 및 그의 구동 방법 |
| US8780604B2 (en) | 2012-06-28 | 2014-07-15 | International Business Machines Corporation | State sensing system for eFuse memory |
| US8861297B2 (en) | 2012-10-04 | 2014-10-14 | Micron Technology, Inc. | Apparatuses and methods for sensing fuse states |
| US9053889B2 (en) * | 2013-03-05 | 2015-06-09 | International Business Machines Corporation | Electronic fuse cell and array |
| US9355739B2 (en) | 2013-11-20 | 2016-05-31 | Globalfoundries Inc. | Bitline circuits for embedded charge trap multi-time-programmable-read-only-memory |
| US9025386B1 (en) | 2013-11-20 | 2015-05-05 | International Business Machines Corporation | Embedded charge trap multi-time-programmable-read-only-memory for high performance logic technology |
| US9503091B2 (en) | 2013-11-20 | 2016-11-22 | Globalfoundries Inc. | Wordline decoder circuits for embedded charge trap multi-time-programmable-read-only-memory |
| CN103745750A (zh) * | 2013-12-25 | 2014-04-23 | 苏州宽温电子科技有限公司 | 一种基于熔丝特性的改进的差分架构otp存储单元 |
| KR102150469B1 (ko) * | 2014-04-04 | 2020-09-02 | 에스케이하이닉스 주식회사 | 저항성 메모리 장치 |
| CN105261399B (zh) * | 2015-11-16 | 2018-05-18 | 西安紫光国芯半导体有限公司 | 提高备用存储阵列利用效率的方法 |
| US9786357B2 (en) | 2016-02-17 | 2017-10-10 | Apple Inc. | Bit-cell voltage distribution system |
| CN107293331A (zh) * | 2016-04-13 | 2017-10-24 | 中芯国际集成电路制造(上海)有限公司 | 一种电可编程熔丝存储数据的读取电路及电子装置 |
| US9870810B2 (en) | 2016-05-18 | 2018-01-16 | Sidense Corp. | Method and system for power signature suppression in memory devices |
| CN106098100B (zh) * | 2016-06-20 | 2019-12-10 | 乐鑫信息科技(上海)股份有限公司 | 一种otp rom的单向比特错误纠正方法 |
| CN108109666A (zh) * | 2016-11-25 | 2018-06-01 | 中芯国际集成电路制造(上海)有限公司 | 电熔丝电路和防止电熔丝误烧写的方法 |
| US10026690B1 (en) * | 2017-07-18 | 2018-07-17 | Nanya Technology Corporation | Fuse blowing method and fuse blowing system |
| US10373698B1 (en) | 2018-04-30 | 2019-08-06 | Micron Technology, Inc. | Electronic device with a fuse array mechanism |
| US10811353B2 (en) * | 2018-10-22 | 2020-10-20 | International Business Machines Corporation | Sub-ground rule e-Fuse structure |
| US11145379B2 (en) | 2019-10-29 | 2021-10-12 | Key Foundry Co., Ltd. | Electronic fuse cell array structure |
| KR102284263B1 (ko) | 2019-10-29 | 2021-07-30 | 주식회사 키 파운드리 | 이-퓨즈 셀 및 이를 포함하는 비휘발성 메모리 장치 |
| CN113327641B (zh) * | 2020-02-28 | 2024-05-03 | 中芯国际集成电路制造(上海)有限公司 | eFuse存储单元、eFuse存储阵列及其使用方法、eFuse系统 |
| US11164610B1 (en) | 2020-06-05 | 2021-11-02 | Qualcomm Incorporated | Memory device with built-in flexible double redundancy |
| US11177010B1 (en) | 2020-07-13 | 2021-11-16 | Qualcomm Incorporated | Bitcell for data redundancy |
| CN111881640B (zh) * | 2020-07-31 | 2024-11-08 | 上海华力微电子有限公司 | 电可编程熔丝系统及其编程方法、读取方法 |
| CN112992245B (zh) * | 2020-12-25 | 2024-11-19 | 上海华力微电子有限公司 | efuse单元结构、efuse单元的双列结构及efuse单元结构的应用电路 |
| US12388015B2 (en) | 2022-11-10 | 2025-08-12 | Globalfoundries U.S. Inc. | E-fuse with metal fill |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08316427A (ja) * | 1995-05-22 | 1996-11-29 | Seiko Epson Corp | 半導体集積回路装置 |
| JPH0917878A (ja) * | 1995-06-30 | 1997-01-17 | Samsung Electron Co Ltd | 半導体装置のヒューズ素子 |
| JP2004515061A (ja) * | 2000-11-27 | 2004-05-20 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Mosデバイスベースのセル構造を有するポリヒューズrom、及びそれに対する読出しと書込みの方法 |
| WO2004097898A2 (en) * | 2003-04-29 | 2004-11-11 | Freescale Semiconductor, Inc. | Fuse and method for forming |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0054740A2 (en) | 1980-12-23 | 1982-06-30 | American Microsystems, Incorporated | Zener diode burn prom |
| JPS58157A (ja) * | 1981-06-25 | 1983-01-05 | Fujitsu Ltd | 半導体装置 |
| US4872140A (en) * | 1987-05-19 | 1989-10-03 | Gazelle Microcircuits, Inc. | Laser programmable memory array |
| US5708291A (en) | 1995-09-29 | 1998-01-13 | Intel Corporation | Silicide agglomeration fuse device |
| JP2760326B2 (ja) | 1995-09-30 | 1998-05-28 | 日本電気株式会社 | 半導体記憶装置 |
| JP3561112B2 (ja) * | 1997-06-16 | 2004-09-02 | 株式会社東芝 | 半導体集積回路装置 |
| JP3311979B2 (ja) * | 1997-12-12 | 2002-08-05 | 株式会社東芝 | 半導体集積回路装置 |
| US6088256A (en) * | 1998-09-25 | 2000-07-11 | Stmicroelectronics, Inc. | Integrated circuit with electrically programmable fuse resistor |
| JP4248658B2 (ja) * | 1999-02-12 | 2009-04-02 | セイコーインスツル株式会社 | フューズトリミング回路 |
| KR19990068298A (ko) | 1999-03-12 | 1999-09-06 | 정명우 | 장미씨기름을함유하는치약조성물 |
| US6208549B1 (en) * | 2000-02-24 | 2001-03-27 | Xilinx, Inc. | One-time programmable poly-fuse circuit for implementing non-volatile functions in a standard sub 0.35 micron CMOS |
| JP3550533B2 (ja) * | 2000-07-06 | 2004-08-04 | 株式会社日立製作所 | 磁界センサー、磁気ヘッド、磁気記録再生装置及び磁気記憶素子 |
| US6756255B1 (en) * | 2001-12-10 | 2004-06-29 | Advanced Micro Devices, Inc. | CMOS process with an integrated, high performance, silicide agglomeration fuse |
| FR2836752A1 (fr) | 2002-02-11 | 2003-09-05 | St Microelectronics Sa | Cellule memoire a programmation unique |
| JP3758644B2 (ja) * | 2002-05-31 | 2006-03-22 | セイコーエプソン株式会社 | 印刷装置用の情報管理装置および情報管理方法並びにプログラム |
| US6710640B1 (en) * | 2002-09-19 | 2004-03-23 | Infineon Technologies Ag | Active well-bias transistor for programming a fuse |
| JP2005109976A (ja) * | 2003-09-30 | 2005-04-21 | Kyocera Mita Corp | 画像読取装置 |
| JP4127678B2 (ja) * | 2004-02-27 | 2008-07-30 | 株式会社東芝 | 半導体装置及びそのプログラミング方法 |
| JP4817701B2 (ja) | 2005-04-06 | 2011-11-16 | 株式会社東芝 | 半導体装置 |
| US7288804B2 (en) * | 2006-03-09 | 2007-10-30 | International Business Machines Corporation | Electrically programmable π-shaped fuse structures and methods of fabrication thereof |
| US7432755B1 (en) * | 2007-12-03 | 2008-10-07 | International Business Machines Corporation | Programming current stabilized electrical fuse programming circuit and method |
-
2006
- 2006-08-30 EP EP06802479A patent/EP1920441A4/en not_active Withdrawn
- 2006-08-30 JP JP2008529166A patent/JP2009506577A/ja active Pending
- 2006-08-30 US US12/065,202 patent/US7817455B2/en active Active
- 2006-08-30 CN CN200680031533XA patent/CN101253573B/zh active Active
- 2006-08-30 WO PCT/US2006/033536 patent/WO2007027607A2/en not_active Ceased
- 2006-08-30 KR KR1020087004562A patent/KR101211213B1/ko active Active
-
2012
- 2012-04-25 JP JP2012099631A patent/JP2012178587A/ja active Pending
-
2014
- 2014-07-11 JP JP2014143116A patent/JP5885315B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08316427A (ja) * | 1995-05-22 | 1996-11-29 | Seiko Epson Corp | 半導体集積回路装置 |
| JPH0917878A (ja) * | 1995-06-30 | 1997-01-17 | Samsung Electron Co Ltd | 半導体装置のヒューズ素子 |
| JP2004515061A (ja) * | 2000-11-27 | 2004-05-20 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Mosデバイスベースのセル構造を有するポリヒューズrom、及びそれに対する読出しと書込みの方法 |
| WO2004097898A2 (en) * | 2003-04-29 | 2004-11-11 | Freescale Semiconductor, Inc. | Fuse and method for forming |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010262726A (ja) * | 2009-04-30 | 2010-11-18 | Hynix Semiconductor Inc | ヒューズ回路及びそれを備える半導体装置 |
| JP2011108777A (ja) * | 2009-11-16 | 2011-06-02 | Renesas Electronics Corp | 半導体装置 |
| US9691499B1 (en) | 2016-02-08 | 2017-06-27 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101211213B1 (ko) | 2012-12-11 |
| EP1920441A2 (en) | 2008-05-14 |
| US7817455B2 (en) | 2010-10-19 |
| US20080316789A1 (en) | 2008-12-25 |
| JP5885315B2 (ja) | 2016-03-15 |
| KR20080049717A (ko) | 2008-06-04 |
| WO2007027607A3 (en) | 2007-08-16 |
| CN101253573A (zh) | 2008-08-27 |
| JP2012178587A (ja) | 2012-09-13 |
| CN101253573B (zh) | 2012-04-18 |
| JP2014220514A (ja) | 2014-11-20 |
| EP1920441A4 (en) | 2009-04-29 |
| WO2007027607A2 (en) | 2007-03-08 |
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