JP2009503241A - 向上した機能を有する熱伝導性接着テープ - Google Patents

向上した機能を有する熱伝導性接着テープ Download PDF

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Publication number
JP2009503241A
JP2009503241A JP2008525205A JP2008525205A JP2009503241A JP 2009503241 A JP2009503241 A JP 2009503241A JP 2008525205 A JP2008525205 A JP 2008525205A JP 2008525205 A JP2008525205 A JP 2008525205A JP 2009503241 A JP2009503241 A JP 2009503241A
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JP
Japan
Prior art keywords
adhesive
adhesive layer
filler
adhesive tape
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2008525205A
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English (en)
Japanese (ja)
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JP2009503241A5 (https=
Inventor
キム，ユー−フーン
ムーン，スンピル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2009503241A publication Critical patent/JP2009503241A/ja
Publication of JP2009503241A5 publication Critical patent/JP2009503241A5/ja
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249954—With chemically effective material or specified gas other than air, N, or carbon dioxide in void-containing component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2008525205A 2005-08-05 2006-08-03 向上した機能を有する熱伝導性接着テープ Ceased JP2009503241A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050071620A KR100700346B1 (ko) 2005-08-05 2005-08-05 기능성을 갖는 방열 점착테이프
PCT/US2006/030352 WO2007019261A1 (en) 2005-08-05 2006-08-03 Heat-transferring adhesive tape with improved functionality

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013025832A Division JP2013136766A (ja) 2005-08-05 2013-02-13 向上した機能を有する熱伝導性接着テープ

Publications (2)

Publication Number Publication Date
JP2009503241A true JP2009503241A (ja) 2009-01-29
JP2009503241A5 JP2009503241A5 (https=) 2009-09-17

Family

ID=37387444

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008525205A Ceased JP2009503241A (ja) 2005-08-05 2006-08-03 向上した機能を有する熱伝導性接着テープ
JP2013025832A Withdrawn JP2013136766A (ja) 2005-08-05 2013-02-13 向上した機能を有する熱伝導性接着テープ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2013025832A Withdrawn JP2013136766A (ja) 2005-08-05 2013-02-13 向上した機能を有する熱伝導性接着テープ

Country Status (8)

Country Link
US (1) US20080206544A1 (https=)
EP (1) EP1922377B1 (https=)
JP (2) JP2009503241A (https=)
KR (1) KR100700346B1 (https=)
CN (1) CN101243151A (https=)
AT (1) ATE528365T1 (https=)
TW (1) TWI391461B (https=)
WO (1) WO2007019261A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011096287A1 (ja) * 2010-02-04 2011-08-11 日東電工株式会社 熱伝導性両面粘着シート
CN105549324A (zh) * 2014-10-28 2016-05-04 株式会社Lg化学 光固化和热固化树脂组合物和干膜型阻焊剂
KR101740288B1 (ko) 2015-05-15 2017-05-29 한국패션산업연구원 재봉기용 보조패드
WO2021006185A1 (ja) * 2019-07-05 2021-01-14 昭和電工マテリアルズ株式会社 電子部品用キャリアフィルム及びキャリアフィルムの製造方法
US11479699B2 (en) 2018-02-02 2022-10-25 Lg Chem, Ltd. Adhesive film for semiconductor

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KR100853711B1 (ko) * 2007-02-14 2008-08-25 최훈석 변형이 유연한 히트 싱크와 이의 제조방법
KR101040713B1 (ko) 2007-06-05 2011-06-10 주식회사 엘지화학 전자파 저감용 조성물 및 이를 포함하는 시트
EP2352786A1 (en) * 2008-08-05 2011-08-10 World Properties, Inc. Conductive polymer foams, method of manufacture, and articles thereof
KR20110084282A (ko) * 2008-11-07 2011-07-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전도성 라미네이트 조립체
JPWO2010073880A1 (ja) * 2008-12-25 2012-06-14 日本ゼオン株式会社 熱伝導性感圧接着性積層シート及び電子部品
TWI444449B (zh) * 2010-11-02 2014-07-11 Ｌｇ化學公司 黏著膜及使用其包覆有機電子裝置之方法
KR101377138B1 (ko) * 2011-04-15 2014-03-21 주식회사 성세인터내셔날 점착력 보강용 무기재 테이프 및 그 제조방법과 점착력 보강용 무기재 테이프를 이용한 점착테이프
KR101362077B1 (ko) * 2011-04-28 2014-02-17 주식회사 솔루에타 전도성 섬유를 이용한 방열테이프 및 그 제조방법
WO2012148218A2 (ko) * 2011-04-28 2012-11-01 ㈜솔루에타 수평열전 테이프 및 그 제조방법
WO2013172633A1 (ko) * 2012-05-14 2013-11-21 주식회사 엘지화학 점착 제품의 제조 방법
CN102757740B (zh) * 2012-07-04 2014-07-02 北京康得新复合材料股份有限公司 双向拉伸数码预涂膜及其制备方法
KR101530591B1 (ko) * 2014-04-07 2015-06-22 율촌화학 주식회사 전사 인쇄를 위한 무 기재 점착 테이프 및 그의 제조방법
KR101640218B1 (ko) * 2014-06-26 2016-07-18 파낙스 이텍(주) 전도성 실리콘 수지 조성물 및 이로부터 제조된 전자파 차폐용 가스켓
WO2016028746A1 (en) * 2014-08-18 2016-02-25 Avery Dennison Corporation Adhesive tapes and heat spreader assemblies
CN107001877B (zh) 2014-10-13 2022-10-14 艾利丹尼森公司 可焊接的和减振硅氧烷粘合剂
WO2016117718A1 (en) * 2015-01-20 2016-07-28 Chang Sung Co., Ltd. Electromagnetic wave shielding and absorbing sheet and manufacturing method of the same
KR20160139203A (ko) 2015-05-27 2016-12-07 이영옥 방열테이프 점착제 및 이를 이용하여 제조된 방열테이프
KR20180069193A (ko) * 2016-12-14 2018-06-25 주식회사 영우 전자기파 충진제의 효율이 향상된 uv 경화형 점착 시트 및 이의 제조방법
KR101906806B1 (ko) * 2016-12-14 2018-10-12 주식회사 영우 전자기파 흡수 이방성을 나타내는 점착 테이프 및 이의 제조방법
KR101907910B1 (ko) * 2016-12-29 2018-10-17 주식회사 영우 경화수축율이 작은 자외선 경화형 점착 조성물을 포함하는 점착 테이프 및 이의 제조방법
KR102171958B1 (ko) * 2017-05-22 2020-10-30 주식회사 엘지화학 다층 점착 테이프
CN107201184B (zh) * 2017-07-14 2020-08-11 东莞市纳利光学材料有限公司 一种复合结构散热膜及其制造工艺
MX2020006022A (es) 2017-12-14 2020-08-17 Avery Dennison Corp Adhesivo sensible a la presion con amplio intervalo de temperaturas y frecuencias de amortiguacion.
EP3569669A1 (en) * 2018-05-14 2019-11-20 3M Innovative Properties Company Method of manufacturing an electronic control device
JP6461414B1 (ja) * 2018-08-02 2019-01-30 清二 加川 電磁波吸収複合シート
KR102170378B1 (ko) * 2019-02-19 2020-10-27 테사 소시에타스 유로파에아 Uv 경화 방식을 이용한 다층구조형 기능성 고방열 점착테이프의 제조방법
JP6737979B1 (ja) 2019-06-10 2020-08-12 富士高分子工業株式会社 電磁波吸収性熱伝導性組成物及びそのシート
KR102527176B1 (ko) 2019-06-10 2023-04-28 후지고분시고오교오가부시끼가이샤 전자파흡수성 열전도성 조성물 및 그 시트
KR20210071277A (ko) 2019-12-06 2021-06-16 주식회사 베이스원 코퍼레이션 전자파 차단, 내충격성 및 열전도성이 향상된 복합 기능성 시트
CN111040696A (zh) * 2019-12-13 2020-04-21 郑棚 高导热磁屏蔽高强度防水灌封胶及其制备方法
CN112374765A (zh) * 2020-12-01 2021-02-19 合肥鼎中智能科技有限公司 一种辅助真空镀膜玻璃生产的装置
KR102895681B1 (ko) * 2021-04-08 2025-12-04 주식회사 대신테크젠 무선 원격 시스템 적용 전자파차폐 접착제 조성물
TW202346528A (zh) * 2022-03-22 2023-12-01 德商漢高股份有限及兩合公司 熱介面材料
WO2023222200A1 (en) * 2022-05-17 2023-11-23 Lohmann Gmbh & Co.Kg Adhesive tape
KR102728049B1 (ko) * 2023-07-26 2024-11-07 김시형 수직방향의 열전도도가 향상된 방열 시트의 제조방법
CN118201337B (zh) * 2024-05-16 2024-08-16 浙江大华技术股份有限公司 吸波散热器及其制备方法、电子设备

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JP2001348542A (ja) * 2000-06-07 2001-12-18 Mochida Shoko Kk 放熱シート及びその製造方法
JP2002317064A (ja) * 2001-04-20 2002-10-31 Sekisui Chem Co Ltd 熱伝導材
JP2003238908A (ja) * 2002-02-14 2003-08-27 Nitto Denko Corp 感圧性接着シート
WO2004108851A1 (en) * 2003-05-30 2004-12-16 3M Innovative Properties Company Thermally conductive foam interface materials

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US5213868A (en) * 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same
US7063887B2 (en) * 2002-02-04 2006-06-20 3M Innovative Properties Company Stretch releasable foams, articles including same and methods for the manufacture thereof
TW200502342A (en) * 2003-07-01 2005-01-16 Delta Electronics Inc Anti-electro magnetic interference filling adhesive
KR100669366B1 (ko) * 2003-10-21 2007-01-15 삼성에스디아이 주식회사 다공성 열전달 시트를 갖는 플라즈마 디스플레이 장치

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2001348542A (ja) * 2000-06-07 2001-12-18 Mochida Shoko Kk 放熱シート及びその製造方法
JP2002317064A (ja) * 2001-04-20 2002-10-31 Sekisui Chem Co Ltd 熱伝導材
JP2003238908A (ja) * 2002-02-14 2003-08-27 Nitto Denko Corp 感圧性接着シート
WO2004108851A1 (en) * 2003-05-30 2004-12-16 3M Innovative Properties Company Thermally conductive foam interface materials

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011096287A1 (ja) * 2010-02-04 2011-08-11 日東電工株式会社 熱伝導性両面粘着シート
JP2011162582A (ja) * 2010-02-04 2011-08-25 Nitto Denko Corp 熱伝導性両面粘着シート
CN102753637A (zh) * 2010-02-04 2012-10-24 日东电工株式会社 导热性双面粘合片
CN105549324A (zh) * 2014-10-28 2016-05-04 株式会社Lg化学 光固化和热固化树脂组合物和干膜型阻焊剂
JP2016084473A (ja) * 2014-10-28 2016-05-19 エルジー・ケム・リミテッド 光硬化性および熱硬化性を有する樹脂組成物と、ドライフィルムソルダレジスト
CN105549324B (zh) * 2014-10-28 2019-10-22 株式会社Lg化学 光固化和热固化树脂组合物和干膜型阻焊剂
KR101740288B1 (ko) 2015-05-15 2017-05-29 한국패션산업연구원 재봉기용 보조패드
US11479699B2 (en) 2018-02-02 2022-10-25 Lg Chem, Ltd. Adhesive film for semiconductor
WO2021006185A1 (ja) * 2019-07-05 2021-01-14 昭和電工マテリアルズ株式会社 電子部品用キャリアフィルム及びキャリアフィルムの製造方法
CN114096413A (zh) * 2019-07-05 2022-02-25 昭和电工材料株式会社 电子零件用载体膜及载体膜的制造方法

Also Published As

Publication number Publication date
JP2013136766A (ja) 2013-07-11
KR20070016718A (ko) 2007-02-08
WO2007019261A1 (en) 2007-02-15
ATE528365T1 (de) 2011-10-15
EP1922377A1 (en) 2008-05-21
TWI391461B (zh) 2013-04-01
US20080206544A1 (en) 2008-08-28
KR100700346B1 (ko) 2007-03-29
TW200724640A (en) 2007-07-01
CN101243151A (zh) 2008-08-13
EP1922377B1 (en) 2011-10-12

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