KR100700346B1 - 기능성을 갖는 방열 점착테이프 - Google Patents

기능성을 갖는 방열 점착테이프 Download PDF

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Publication number
KR100700346B1
KR100700346B1 KR1020050071620A KR20050071620A KR100700346B1 KR 100700346 B1 KR100700346 B1 KR 100700346B1 KR 1020050071620 A KR1020050071620 A KR 1020050071620A KR 20050071620 A KR20050071620 A KR 20050071620A KR 100700346 B1 KR100700346 B1 KR 100700346B1
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KR
South Korea
Prior art keywords
sensitive adhesive
adhesive layer
pressure
filler
pressure sensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020050071620A
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English (en)
Korean (ko)
Other versions
KR20070016718A (ko
Inventor
문성필
김유훈
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR1020050071620A priority Critical patent/KR100700346B1/ko
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 캄파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 캄파니
Priority to JP2008525205A priority patent/JP2009503241A/ja
Priority to US11/996,158 priority patent/US20080206544A1/en
Priority to AT06800729T priority patent/ATE528365T1/de
Priority to CNA2006800305376A priority patent/CN101243151A/zh
Priority to EP20060800729 priority patent/EP1922377B1/en
Priority to PCT/US2006/030352 priority patent/WO2007019261A1/en
Priority to TW95128737A priority patent/TWI391461B/zh
Publication of KR20070016718A publication Critical patent/KR20070016718A/ko
Application granted granted Critical
Publication of KR100700346B1 publication Critical patent/KR100700346B1/ko
Priority to JP2013025832A priority patent/JP2013136766A/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/10Adhesives in the form of films or foils without carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/20Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • Y10T428/249953Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249954With chemically effective material or specified gas other than air, N, or carbon dioxide in void-containing component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020050071620A 2005-08-05 2005-08-05 기능성을 갖는 방열 점착테이프 Expired - Fee Related KR100700346B1 (ko)

Priority Applications (9)

Application Number Priority Date Filing Date Title
KR1020050071620A KR100700346B1 (ko) 2005-08-05 2005-08-05 기능성을 갖는 방열 점착테이프
US11/996,158 US20080206544A1 (en) 2005-08-05 2006-08-03 Heat-Transferring Adhesive Tape With Improved Functionality
AT06800729T ATE528365T1 (de) 2005-08-05 2006-08-03 Thermotransferklebeband mit verbesserter funktionalität
CNA2006800305376A CN101243151A (zh) 2005-08-05 2006-08-03 具有改善功能的传热粘合带
JP2008525205A JP2009503241A (ja) 2005-08-05 2006-08-03 向上した機能を有する熱伝導性接着テープ
EP20060800729 EP1922377B1 (en) 2005-08-05 2006-08-03 Heat-transferring adhesive tape with improved functionality
PCT/US2006/030352 WO2007019261A1 (en) 2005-08-05 2006-08-03 Heat-transferring adhesive tape with improved functionality
TW95128737A TWI391461B (zh) 2005-08-05 2006-08-04 具改良功能性之傳熱膠帶
JP2013025832A JP2013136766A (ja) 2005-08-05 2013-02-13 向上した機能を有する熱伝導性接着テープ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050071620A KR100700346B1 (ko) 2005-08-05 2005-08-05 기능성을 갖는 방열 점착테이프

Publications (2)

Publication Number Publication Date
KR20070016718A KR20070016718A (ko) 2007-02-08
KR100700346B1 true KR100700346B1 (ko) 2007-03-29

Family

ID=37387444

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050071620A Expired - Fee Related KR100700346B1 (ko) 2005-08-05 2005-08-05 기능성을 갖는 방열 점착테이프

Country Status (8)

Country Link
US (1) US20080206544A1 (https=)
EP (1) EP1922377B1 (https=)
JP (2) JP2009503241A (https=)
KR (1) KR100700346B1 (https=)
CN (1) CN101243151A (https=)
AT (1) ATE528365T1 (https=)
TW (1) TWI391461B (https=)
WO (1) WO2007019261A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101040713B1 (ko) 2007-06-05 2011-06-10 주식회사 엘지화학 전자파 저감용 조성물 및 이를 포함하는 시트
KR101377138B1 (ko) * 2011-04-15 2014-03-21 주식회사 성세인터내셔날 점착력 보강용 무기재 테이프 및 그 제조방법과 점착력 보강용 무기재 테이프를 이용한 점착테이프
KR101530591B1 (ko) * 2014-04-07 2015-06-22 율촌화학 주식회사 전사 인쇄를 위한 무 기재 점착 테이프 및 그의 제조방법
KR20160139203A (ko) 2015-05-27 2016-12-07 이영옥 방열테이프 점착제 및 이를 이용하여 제조된 방열테이프
WO2023183390A1 (en) * 2022-03-22 2023-09-28 Henkel Ag & Co. Kgaa Thermal interface material

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100853711B1 (ko) * 2007-02-14 2008-08-25 최훈석 변형이 유연한 히트 싱크와 이의 제조방법
EP2352786A1 (en) * 2008-08-05 2011-08-10 World Properties, Inc. Conductive polymer foams, method of manufacture, and articles thereof
KR20110084282A (ko) * 2008-11-07 2011-07-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전도성 라미네이트 조립체
JPWO2010073880A1 (ja) * 2008-12-25 2012-06-14 日本ゼオン株式会社 熱伝導性感圧接着性積層シート及び電子部品
JP5651344B2 (ja) * 2010-02-04 2015-01-14 日東電工株式会社 熱伝導性両面粘着シート
TWI444449B (zh) * 2010-11-02 2014-07-11 Lg化學公司 黏著膜及使用其包覆有機電子裝置之方法
KR101362077B1 (ko) * 2011-04-28 2014-02-17 주식회사 솔루에타 전도성 섬유를 이용한 방열테이프 및 그 제조방법
WO2012148218A2 (ko) * 2011-04-28 2012-11-01 ㈜솔루에타 수평열전 테이프 및 그 제조방법
WO2013172633A1 (ko) * 2012-05-14 2013-11-21 주식회사 엘지화학 점착 제품의 제조 방법
CN102757740B (zh) * 2012-07-04 2014-07-02 北京康得新复合材料股份有限公司 双向拉伸数码预涂膜及其制备方法
KR101640218B1 (ko) * 2014-06-26 2016-07-18 파낙스 이텍(주) 전도성 실리콘 수지 조성물 및 이로부터 제조된 전자파 차폐용 가스켓
WO2016028746A1 (en) * 2014-08-18 2016-02-25 Avery Dennison Corporation Adhesive tapes and heat spreader assemblies
CN107001877B (zh) 2014-10-13 2022-10-14 艾利丹尼森公司 可焊接的和减振硅氧烷粘合剂
KR101792755B1 (ko) * 2014-10-28 2017-11-01 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
WO2016117718A1 (en) * 2015-01-20 2016-07-28 Chang Sung Co., Ltd. Electromagnetic wave shielding and absorbing sheet and manufacturing method of the same
KR101740288B1 (ko) 2015-05-15 2017-05-29 한국패션산업연구원 재봉기용 보조패드
KR20180069193A (ko) * 2016-12-14 2018-06-25 주식회사 영우 전자기파 충진제의 효율이 향상된 uv 경화형 점착 시트 및 이의 제조방법
KR101906806B1 (ko) * 2016-12-14 2018-10-12 주식회사 영우 전자기파 흡수 이방성을 나타내는 점착 테이프 및 이의 제조방법
KR101907910B1 (ko) * 2016-12-29 2018-10-17 주식회사 영우 경화수축율이 작은 자외선 경화형 점착 조성물을 포함하는 점착 테이프 및 이의 제조방법
KR102171958B1 (ko) * 2017-05-22 2020-10-30 주식회사 엘지화학 다층 점착 테이프
CN107201184B (zh) * 2017-07-14 2020-08-11 东莞市纳利光学材料有限公司 一种复合结构散热膜及其制造工艺
MX2020006022A (es) 2017-12-14 2020-08-17 Avery Dennison Corp Adhesivo sensible a la presion con amplio intervalo de temperaturas y frecuencias de amortiguacion.
KR102213777B1 (ko) * 2018-02-02 2021-02-08 주식회사 엘지화학 반도체용 접착 필름
EP3569669A1 (en) * 2018-05-14 2019-11-20 3M Innovative Properties Company Method of manufacturing an electronic control device
JP6461414B1 (ja) * 2018-08-02 2019-01-30 清二 加川 電磁波吸収複合シート
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JP6737979B1 (ja) 2019-06-10 2020-08-12 富士高分子工業株式会社 電磁波吸収性熱伝導性組成物及びそのシート
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TWI844699B (zh) * 2019-07-05 2024-06-11 日商力森諾科股份有限公司 電子零件用載體膜及載體膜的製造方法
KR20210071277A (ko) 2019-12-06 2021-06-16 주식회사 베이스원 코퍼레이션 전자파 차단, 내충격성 및 열전도성이 향상된 복합 기능성 시트
CN111040696A (zh) * 2019-12-13 2020-04-21 郑棚 高导热磁屏蔽高强度防水灌封胶及其制备方法
CN112374765A (zh) * 2020-12-01 2021-02-19 合肥鼎中智能科技有限公司 一种辅助真空镀膜玻璃生产的装置
KR102895681B1 (ko) * 2021-04-08 2025-12-04 주식회사 대신테크젠 무선 원격 시스템 적용 전자파차폐 접착제 조성물
WO2023222200A1 (en) * 2022-05-17 2023-11-23 Lohmann Gmbh & Co.Kg Adhesive tape
KR102728049B1 (ko) * 2023-07-26 2024-11-07 김시형 수직방향의 열전도도가 향상된 방열 시트의 제조방법
CN118201337B (zh) * 2024-05-16 2024-08-16 浙江大华技术股份有限公司 吸波散热器及其制备方法、电子设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010110652A (ko) * 2000-06-07 2001-12-13 추후기재 방열 시트 및 그 제조 방법
KR20050038274A (ko) * 2003-10-21 2005-04-27 삼성에스디아이 주식회사 다공성 열전달 시트를 갖는 플라즈마 디스플레이 장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5213868A (en) * 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same
JP2002317064A (ja) * 2001-04-20 2002-10-31 Sekisui Chem Co Ltd 熱伝導材
US7063887B2 (en) * 2002-02-04 2006-06-20 3M Innovative Properties Company Stretch releasable foams, articles including same and methods for the manufacture thereof
JP2003238908A (ja) * 2002-02-14 2003-08-27 Nitto Denko Corp 感圧性接着シート
US7744991B2 (en) * 2003-05-30 2010-06-29 3M Innovative Properties Company Thermally conducting foam interface materials
TW200502342A (en) * 2003-07-01 2005-01-16 Delta Electronics Inc Anti-electro magnetic interference filling adhesive

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010110652A (ko) * 2000-06-07 2001-12-13 추후기재 방열 시트 및 그 제조 방법
KR20050038274A (ko) * 2003-10-21 2005-04-27 삼성에스디아이 주식회사 다공성 열전달 시트를 갖는 플라즈마 디스플레이 장치

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
1020010110652
1020050038274

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101040713B1 (ko) 2007-06-05 2011-06-10 주식회사 엘지화학 전자파 저감용 조성물 및 이를 포함하는 시트
KR101377138B1 (ko) * 2011-04-15 2014-03-21 주식회사 성세인터내셔날 점착력 보강용 무기재 테이프 및 그 제조방법과 점착력 보강용 무기재 테이프를 이용한 점착테이프
KR101530591B1 (ko) * 2014-04-07 2015-06-22 율촌화학 주식회사 전사 인쇄를 위한 무 기재 점착 테이프 및 그의 제조방법
KR20160139203A (ko) 2015-05-27 2016-12-07 이영옥 방열테이프 점착제 및 이를 이용하여 제조된 방열테이프
WO2023183390A1 (en) * 2022-03-22 2023-09-28 Henkel Ag & Co. Kgaa Thermal interface material

Also Published As

Publication number Publication date
JP2013136766A (ja) 2013-07-11
KR20070016718A (ko) 2007-02-08
WO2007019261A1 (en) 2007-02-15
ATE528365T1 (de) 2011-10-15
EP1922377A1 (en) 2008-05-21
TWI391461B (zh) 2013-04-01
US20080206544A1 (en) 2008-08-28
TW200724640A (en) 2007-07-01
CN101243151A (zh) 2008-08-13
JP2009503241A (ja) 2009-01-29
EP1922377B1 (en) 2011-10-12

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