WO2007019261A1 - Heat-transferring adhesive tape with improved functionality - Google Patents

Heat-transferring adhesive tape with improved functionality Download PDF

Info

Publication number
WO2007019261A1
WO2007019261A1 PCT/US2006/030352 US2006030352W WO2007019261A1 WO 2007019261 A1 WO2007019261 A1 WO 2007019261A1 US 2006030352 W US2006030352 W US 2006030352W WO 2007019261 A1 WO2007019261 A1 WO 2007019261A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive layer
adhesive
adhesive tape
filler
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2006/030352
Other languages
English (en)
French (fr)
Inventor
You-Hoon Kim
Sungpil Moon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to US11/996,158 priority Critical patent/US20080206544A1/en
Priority to AT06800729T priority patent/ATE528365T1/de
Priority to JP2008525205A priority patent/JP2009503241A/ja
Priority to EP20060800729 priority patent/EP1922377B1/en
Publication of WO2007019261A1 publication Critical patent/WO2007019261A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249954—With chemically effective material or specified gas other than air, N, or carbon dioxide in void-containing component

Definitions

  • FIG. 8a is a schematic view showing how electromagnetic waves are generated and emitted (see the left side) and how electromagnetic waves are shielded (see the right side) in a PDP, to which the adhesive tape according to the present invention is applied;
  • the first adhesive layer imparts fundamental physical properties, including adhesion strength, adhesion maintenance, flexibility and heat conductivity, to the adhesive tape, while the second adhesive layer imparts a certain functionality to the adhesive tape.
  • the second adhesive layer forming the adhesive tape according to the present invention has a non-porous structure. In other words, unlike the first adhesive layer, the second adhesive layer is not subjected to a step of forming a porous structure during the preparation thereof.
  • Non-limiting examples of the polar comonomer coplymerizable with the (meth)acrylate monomer include carboxyl group-containing monomers such as
  • the adhesive tape according to the present invention can be obtained by the method including the steps of: i) forming a first adhesive layer having a porous structure and containing a heat conductive filler; ii) coating a composition for forming a second adhesive layer, containing an adhesive polymer resin and at least one filler selected from the group consisting of a heat (conductive filler, an electromagnetic wave shielding filler and an electromagnetic wave absorbing filler, on a release sheet and curing the composition to form a second adhesive layer; and iii) laminating the second adhesive layer of step ii) on the first adhesive layer of step i).
  • the method may further include a step of laminating a primer layer 3 between the first adhesive layer and the second adhesive layer in order to enhance the interlayer adhesion strength, so that the first adhesive layer and the second adhesive layer can be laminated with the primer layer interposed between both adhesive layers (see FIG. 2).
  • the adhesive tapes according to the present invention show excellent wettability. Because the second adhesive layer of the adhesive tape according to the present invention contain a functional filler, the adhesive tape shows excellent heat conductivity (Ex. 1) and electromagnetic wave absorbing property (Ex. 2), in addition to excellent wettability. In general, electromagnetic wave shielding property can be evaluated in terms of surface resistance. As the surface resistance decreases, electromagnetic wave shielding property increases.
  • the adhesive tape according to the present invention in particular the adhesive tape according to Example 3, which is provided to improve the electromagnetic wave shielding property, shows a low surface resistance while it contains a porous structured layer (first adhesive layer), and thus provides excellent electromagnetic wave shielding property.
  • the adhesive tape according to the present invention includes a laminate of a first adhesive layer having a porous structure and showing heat conductivity with a second adhesive layer having a desired functionality.
  • the first adhesive layer imparts wettability as well as heat conductivity to the adhesive tape, so that the adhesive tape can provide excellent adhesive property and workability.
  • the second adhesive layer imparts heat conductivity, electromagnetic wave shielding property and electromagnetic wave absorbing property to the adhesive tape. Therefore, the adhesive tape according to the present invention may be useful for the manufacture of electronic products, such as a plasma display panel, requiring an adhesive having electromagnetic wave-related functionalities in addition to heat conductivity and adhesive property.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
PCT/US2006/030352 2005-08-05 2006-08-03 Heat-transferring adhesive tape with improved functionality Ceased WO2007019261A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US11/996,158 US20080206544A1 (en) 2005-08-05 2006-08-03 Heat-Transferring Adhesive Tape With Improved Functionality
AT06800729T ATE528365T1 (de) 2005-08-05 2006-08-03 Thermotransferklebeband mit verbesserter funktionalität
JP2008525205A JP2009503241A (ja) 2005-08-05 2006-08-03 向上した機能を有する熱伝導性接着テープ
EP20060800729 EP1922377B1 (en) 2005-08-05 2006-08-03 Heat-transferring adhesive tape with improved functionality

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050071620A KR100700346B1 (ko) 2005-08-05 2005-08-05 기능성을 갖는 방열 점착테이프
KR10-2005-0071620 2005-08-05

Publications (1)

Publication Number Publication Date
WO2007019261A1 true WO2007019261A1 (en) 2007-02-15

Family

ID=37387444

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/030352 Ceased WO2007019261A1 (en) 2005-08-05 2006-08-03 Heat-transferring adhesive tape with improved functionality

Country Status (8)

Country Link
US (1) US20080206544A1 (https=)
EP (1) EP1922377B1 (https=)
JP (2) JP2009503241A (https=)
KR (1) KR100700346B1 (https=)
CN (1) CN101243151A (https=)
AT (1) ATE528365T1 (https=)
TW (1) TWI391461B (https=)
WO (1) WO2007019261A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010073880A1 (ja) * 2008-12-25 2010-07-01 日本ゼオン株式会社 熱伝導性感圧接着性積層シート及び電子部品
EP2637229A4 (en) * 2010-11-02 2014-06-18 Lg Chemical Ltd Adhesive film and method for encapsulating an organic electrical device therefor
WO2023222200A1 (en) * 2022-05-17 2023-11-23 Lohmann Gmbh & Co.Kg Adhesive tape

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KR100853711B1 (ko) * 2007-02-14 2008-08-25 최훈석 변형이 유연한 히트 싱크와 이의 제조방법
KR101040713B1 (ko) 2007-06-05 2011-06-10 주식회사 엘지화학 전자파 저감용 조성물 및 이를 포함하는 시트
EP2352786A1 (en) * 2008-08-05 2011-08-10 World Properties, Inc. Conductive polymer foams, method of manufacture, and articles thereof
KR20110084282A (ko) * 2008-11-07 2011-07-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전도성 라미네이트 조립체
JP5651344B2 (ja) * 2010-02-04 2015-01-14 日東電工株式会社 熱伝導性両面粘着シート
KR101377138B1 (ko) * 2011-04-15 2014-03-21 주식회사 성세인터내셔날 점착력 보강용 무기재 테이프 및 그 제조방법과 점착력 보강용 무기재 테이프를 이용한 점착테이프
KR101362077B1 (ko) * 2011-04-28 2014-02-17 주식회사 솔루에타 전도성 섬유를 이용한 방열테이프 및 그 제조방법
WO2012148218A2 (ko) * 2011-04-28 2012-11-01 ㈜솔루에타 수평열전 테이프 및 그 제조방법
WO2013172633A1 (ko) * 2012-05-14 2013-11-21 주식회사 엘지화학 점착 제품의 제조 방법
CN102757740B (zh) * 2012-07-04 2014-07-02 北京康得新复合材料股份有限公司 双向拉伸数码预涂膜及其制备方法
KR101530591B1 (ko) * 2014-04-07 2015-06-22 율촌화학 주식회사 전사 인쇄를 위한 무 기재 점착 테이프 및 그의 제조방법
KR101640218B1 (ko) * 2014-06-26 2016-07-18 파낙스 이텍(주) 전도성 실리콘 수지 조성물 및 이로부터 제조된 전자파 차폐용 가스켓
WO2016028746A1 (en) * 2014-08-18 2016-02-25 Avery Dennison Corporation Adhesive tapes and heat spreader assemblies
CN107001877B (zh) 2014-10-13 2022-10-14 艾利丹尼森公司 可焊接的和减振硅氧烷粘合剂
KR101792755B1 (ko) * 2014-10-28 2017-11-01 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
WO2016117718A1 (en) * 2015-01-20 2016-07-28 Chang Sung Co., Ltd. Electromagnetic wave shielding and absorbing sheet and manufacturing method of the same
KR101740288B1 (ko) 2015-05-15 2017-05-29 한국패션산업연구원 재봉기용 보조패드
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KR20180069193A (ko) * 2016-12-14 2018-06-25 주식회사 영우 전자기파 충진제의 효율이 향상된 uv 경화형 점착 시트 및 이의 제조방법
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KR101907910B1 (ko) * 2016-12-29 2018-10-17 주식회사 영우 경화수축율이 작은 자외선 경화형 점착 조성물을 포함하는 점착 테이프 및 이의 제조방법
KR102171958B1 (ko) * 2017-05-22 2020-10-30 주식회사 엘지화학 다층 점착 테이프
CN107201184B (zh) * 2017-07-14 2020-08-11 东莞市纳利光学材料有限公司 一种复合结构散热膜及其制造工艺
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KR102213777B1 (ko) * 2018-02-02 2021-02-08 주식회사 엘지화학 반도체용 접착 필름
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010073880A1 (ja) * 2008-12-25 2010-07-01 日本ゼオン株式会社 熱伝導性感圧接着性積層シート及び電子部品
JPWO2010073880A1 (ja) * 2008-12-25 2012-06-14 日本ゼオン株式会社 熱伝導性感圧接着性積層シート及び電子部品
EP2637229A4 (en) * 2010-11-02 2014-06-18 Lg Chemical Ltd Adhesive film and method for encapsulating an organic electrical device therefor
US9105648B2 (en) 2010-11-02 2015-08-11 Lg Chem, Ltd. Adhesive and method of encapsulating organic electronic device using the same
US10062855B2 (en) 2010-11-02 2018-08-28 Lg Chem, Ltd. Adhesive and method of encapsulating organic electronic device using the same
US10622573B2 (en) 2010-11-02 2020-04-14 Lg Chem, Ltd. Adhesive and method of encapsulating organic electronic device using the same
US11142669B2 (en) 2010-11-02 2021-10-12 Lg Chem, Ltd. Adhesive and method of encapsulating organic electronic device using the same
WO2023222200A1 (en) * 2022-05-17 2023-11-23 Lohmann Gmbh & Co.Kg Adhesive tape

Also Published As

Publication number Publication date
JP2013136766A (ja) 2013-07-11
KR20070016718A (ko) 2007-02-08
ATE528365T1 (de) 2011-10-15
EP1922377A1 (en) 2008-05-21
TWI391461B (zh) 2013-04-01
US20080206544A1 (en) 2008-08-28
KR100700346B1 (ko) 2007-03-29
TW200724640A (en) 2007-07-01
CN101243151A (zh) 2008-08-13
JP2009503241A (ja) 2009-01-29
EP1922377B1 (en) 2011-10-12

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