ATE528365T1 - Thermotransferklebeband mit verbesserter funktionalität - Google Patents

Thermotransferklebeband mit verbesserter funktionalität

Info

Publication number
ATE528365T1
ATE528365T1 AT06800729T AT06800729T ATE528365T1 AT E528365 T1 ATE528365 T1 AT E528365T1 AT 06800729 T AT06800729 T AT 06800729T AT 06800729 T AT06800729 T AT 06800729T AT E528365 T1 ATE528365 T1 AT E528365T1
Authority
AT
Austria
Prior art keywords
adhesive layer
filler
thermal transfer
transfer tape
improved functionality
Prior art date
Application number
AT06800729T
Other languages
English (en)
Inventor
You-Hoon Kim
Sungpil Moon
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE528365T1 publication Critical patent/ATE528365T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249954—With chemically effective material or specified gas other than air, N, or carbon dioxide in void-containing component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
AT06800729T 2005-08-05 2006-08-03 Thermotransferklebeband mit verbesserter funktionalität ATE528365T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050071620A KR100700346B1 (ko) 2005-08-05 2005-08-05 기능성을 갖는 방열 점착테이프
PCT/US2006/030352 WO2007019261A1 (en) 2005-08-05 2006-08-03 Heat-transferring adhesive tape with improved functionality

Publications (1)

Publication Number Publication Date
ATE528365T1 true ATE528365T1 (de) 2011-10-15

Family

ID=37387444

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06800729T ATE528365T1 (de) 2005-08-05 2006-08-03 Thermotransferklebeband mit verbesserter funktionalität

Country Status (8)

Country Link
US (1) US20080206544A1 (de)
EP (1) EP1922377B1 (de)
JP (2) JP2009503241A (de)
KR (1) KR100700346B1 (de)
CN (1) CN101243151A (de)
AT (1) ATE528365T1 (de)
TW (1) TWI391461B (de)
WO (1) WO2007019261A1 (de)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100853711B1 (ko) * 2007-02-14 2008-08-25 최훈석 변형이 유연한 히트 싱크와 이의 제조방법
KR101040713B1 (ko) 2007-06-05 2011-06-10 주식회사 엘지화학 전자파 저감용 조성물 및 이를 포함하는 시트
EP2352786A1 (de) * 2008-08-05 2011-08-10 World Properties, Inc. Leitfähige polymerschäume, herstellungsverfahren und gegenstände daraus
US20110214735A1 (en) * 2008-11-07 2011-09-08 3M Innovative Properities Company Conductive laminated assembly
JPWO2010073880A1 (ja) * 2008-12-25 2012-06-14 日本ゼオン株式会社 熱伝導性感圧接着性積層シート及び電子部品
JP5651344B2 (ja) * 2010-02-04 2015-01-14 日東電工株式会社 熱伝導性両面粘着シート
CN108084936B (zh) 2010-11-02 2021-05-18 Lg化学株式会社 粘合剂和使用其包封有机电子装置的方法
KR101377138B1 (ko) * 2011-04-15 2014-03-21 주식회사 성세인터내셔날 점착력 보강용 무기재 테이프 및 그 제조방법과 점착력 보강용 무기재 테이프를 이용한 점착테이프
KR101314169B1 (ko) * 2011-04-28 2013-10-04 주식회사 솔루에타 수평열전 테이프 및 그 제조방법
KR101362077B1 (ko) * 2011-04-28 2014-02-17 주식회사 솔루에타 전도성 섬유를 이용한 방열테이프 및 그 제조방법
EP2851406A4 (de) 2012-05-14 2015-12-23 Lg Chemical Ltd Verfahren zur herstellung eines klebeartikels
CN102757740B (zh) * 2012-07-04 2014-07-02 北京康得新复合材料股份有限公司 双向拉伸数码预涂膜及其制备方法
KR101530591B1 (ko) * 2014-04-07 2015-06-22 율촌화학 주식회사 전사 인쇄를 위한 무 기재 점착 테이프 및 그의 제조방법
KR101640218B1 (ko) * 2014-06-26 2016-07-18 파낙스 이텍(주) 전도성 실리콘 수지 조성물 및 이로부터 제조된 전자파 차폐용 가스켓
WO2016028746A1 (en) * 2014-08-18 2016-02-25 Avery Dennison Corporation Adhesive tapes and heat spreader assemblies
EP3910039A1 (de) 2014-10-13 2021-11-17 Avery Dennison Corporation Schweissbare und schwingungsdämpfende silikonklebstoffe
KR101792755B1 (ko) * 2014-10-28 2017-11-01 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
KR101661583B1 (ko) * 2015-01-20 2016-10-10 (주)창성 전자파 차폐 흡수재 및 그 제조방법
KR101740288B1 (ko) 2015-05-15 2017-05-29 한국패션산업연구원 재봉기용 보조패드
KR20160139203A (ko) 2015-05-27 2016-12-07 이영옥 방열테이프 점착제 및 이를 이용하여 제조된 방열테이프
KR20180069193A (ko) * 2016-12-14 2018-06-25 주식회사 영우 전자기파 충진제의 효율이 향상된 uv 경화형 점착 시트 및 이의 제조방법
KR101906806B1 (ko) * 2016-12-14 2018-10-12 주식회사 영우 전자기파 흡수 이방성을 나타내는 점착 테이프 및 이의 제조방법
KR101907910B1 (ko) * 2016-12-29 2018-10-17 주식회사 영우 경화수축율이 작은 자외선 경화형 점착 조성물을 포함하는 점착 테이프 및 이의 제조방법
KR102171958B1 (ko) * 2017-05-22 2020-10-30 주식회사 엘지화학 다층 점착 테이프
CN107201184B (zh) * 2017-07-14 2020-08-11 东莞市纳利光学材料有限公司 一种复合结构散热膜及其制造工艺
EP3724292B1 (de) 2017-12-14 2024-07-17 Avery Dennison Corporation Haftkleber mit breitem dämpfungstemperatur- und frequenzbereich
KR102213777B1 (ko) 2018-02-02 2021-02-08 주식회사 엘지화학 반도체용 접착 필름
EP3569669A1 (de) * 2018-05-14 2019-11-20 3M Innovative Properties Company Verfahren zur herstellung einer elektronischen steuerungsvorrichtung
JP6461414B1 (ja) * 2018-08-02 2019-01-30 清二 加川 電磁波吸収複合シート
KR102170378B1 (ko) * 2019-02-19 2020-10-27 테사 소시에타스 유로파에아 Uv 경화 방식을 이용한 다층구조형 기능성 고방열 점착테이프의 제조방법
SG11202100481WA (en) 2019-06-10 2021-02-25 Fuji Polymer Industries Co Ltd Electromagnetic wave absorbing thermally conductive composition and sheet thereof
US11785752B2 (en) 2019-06-10 2023-10-10 Fuji Polymer Industries Co., Ltd. Electromagnetic wave absorbing thermally conductive composition and sheet thereof
TWI844699B (zh) * 2019-07-05 2024-06-11 日商力森諾科股份有限公司 電子零件用載體膜及載體膜的製造方法
KR20210071277A (ko) 2019-12-06 2021-06-16 주식회사 베이스원 코퍼레이션 전자파 차단, 내충격성 및 열전도성이 향상된 복합 기능성 시트
CN111040696A (zh) * 2019-12-13 2020-04-21 郑棚 高导热磁屏蔽高强度防水灌封胶及其制备方法
CN112374765A (zh) * 2020-12-01 2021-02-19 合肥鼎中智能科技有限公司 一种辅助真空镀膜玻璃生产的装置
KR102895681B1 (ko) * 2021-04-08 2025-12-04 주식회사 대신테크젠 무선 원격 시스템 적용 전자파차폐 접착제 조성물
TW202346528A (zh) * 2022-03-22 2023-12-01 德商漢高股份有限及兩合公司 熱介面材料
WO2023222200A1 (en) * 2022-05-17 2023-11-23 Lohmann Gmbh & Co.Kg Adhesive tape
KR102728049B1 (ko) * 2023-07-26 2024-11-07 김시형 수직방향의 열전도도가 향상된 방열 시트의 제조방법
CN118201337B (zh) * 2024-05-16 2024-08-16 浙江大华技术股份有限公司 吸波散热器及其制备方法、电子设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5213868A (en) * 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same
JP3468420B2 (ja) * 2000-06-07 2003-11-17 持田商工株式会社 放熱シート及びその製造方法
JP2002317064A (ja) * 2001-04-20 2002-10-31 Sekisui Chem Co Ltd 熱伝導材
US7063887B2 (en) * 2002-02-04 2006-06-20 3M Innovative Properties Company Stretch releasable foams, articles including same and methods for the manufacture thereof
JP2003238908A (ja) * 2002-02-14 2003-08-27 Nitto Denko Corp 感圧性接着シート
US7744991B2 (en) * 2003-05-30 2010-06-29 3M Innovative Properties Company Thermally conducting foam interface materials
TW200502342A (en) * 2003-07-01 2005-01-16 Delta Electronics Inc Anti-electro magnetic interference filling adhesive
KR100669366B1 (ko) * 2003-10-21 2007-01-15 삼성에스디아이 주식회사 다공성 열전달 시트를 갖는 플라즈마 디스플레이 장치

Also Published As

Publication number Publication date
JP2009503241A (ja) 2009-01-29
KR20070016718A (ko) 2007-02-08
US20080206544A1 (en) 2008-08-28
TW200724640A (en) 2007-07-01
CN101243151A (zh) 2008-08-13
EP1922377B1 (de) 2011-10-12
JP2013136766A (ja) 2013-07-11
TWI391461B (zh) 2013-04-01
KR100700346B1 (ko) 2007-03-29
WO2007019261A1 (en) 2007-02-15
EP1922377A1 (de) 2008-05-21

Similar Documents

Publication Publication Date Title
ATE528365T1 (de) Thermotransferklebeband mit verbesserter funktionalität
EA200970365A1 (ru) Составной стеклопакет с улучшенной селективностью и применение подложки для получения такого стеклопакета
WO2007103741A3 (en) Emi shielding and thermal management assemblies including frames and covers with multi-position latching
TW200709766A (en) Flexible circuit board with heat sink
WO2011119007A3 (ko) 방열 테이프 및 그 제조 방법
WO2011003997A9 (en) Thermally mounting electronics to a photovoltaic panel
ATE557578T1 (de) Emi-folienlaminatdichtung
AU2675901A (en) Multilayer printed board
WO2009141129A8 (en) Cold appliance
WO2009082516A3 (en) Adhesive applications using alkali silicate glass for electronics
SG11201810963WA (en) Light-dimming laminate and double glass
TW200733824A (en) Wiring circuit board
TW200722280A (en) Anti-frost film assemblies, method of manufacture, and articles made thereof
WO2010074402A3 (en) Structure of heat dissipating sheet for plasma display panel
CN103572862B (zh) 电力站环保隔墙
WO2009025518A3 (en) Electrically conductive adhesive tape and method for preparing the same
TW200631991A (en) Polyimide resin, polyimide film and polyimide laminate
WO2008011021A3 (en) Electroluminescent lamp
TW200740331A (en) Hybrid multilayer circuit board and method of manufacturing the same
CN204031699U (zh) 电子产品用石墨导热片
TW200737589A (en) Electronic device and antenna structure thereof
CN204265675U (zh) 一种高光阻燃电磁屏蔽胶带
CN204022730U (zh) 多用途压敏胶带
CN204022729U (zh) 抗静电保护膜
CN203826146U (zh) 一种新型绝缘片

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties