ATE557578T1 - Emi-folienlaminatdichtung - Google Patents

Emi-folienlaminatdichtung

Info

Publication number
ATE557578T1
ATE557578T1 AT05755085T AT05755085T ATE557578T1 AT E557578 T1 ATE557578 T1 AT E557578T1 AT 05755085 T AT05755085 T AT 05755085T AT 05755085 T AT05755085 T AT 05755085T AT E557578 T1 ATE557578 T1 AT E557578T1
Authority
AT
Austria
Prior art keywords
conductive
emi
foil laminate
laminate seal
sheath
Prior art date
Application number
AT05755085T
Other languages
English (en)
Inventor
Stanley Miska
Original Assignee
Schlegel Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlegel Systems Inc filed Critical Schlegel Systems Inc
Application granted granted Critical
Publication of ATE557578T1 publication Critical patent/ATE557578T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S277/00—Seal for a joint or juncture
    • Y10S277/92—Seal including electromagnetic shielding feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
AT05755085T 2004-06-04 2005-06-02 Emi-folienlaminatdichtung ATE557578T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/860,985 US6943288B1 (en) 2004-06-04 2004-06-04 EMI foil laminate gasket
PCT/US2005/019430 WO2005122665A2 (en) 2004-06-04 2005-06-02 Emi foil laminate gasket

Publications (1)

Publication Number Publication Date
ATE557578T1 true ATE557578T1 (de) 2012-05-15

Family

ID=34912777

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05755085T ATE557578T1 (de) 2004-06-04 2005-06-02 Emi-folienlaminatdichtung

Country Status (5)

Country Link
US (1) US6943288B1 (de)
EP (1) EP1779713B1 (de)
AT (1) ATE557578T1 (de)
TW (1) TW200614908A (de)
WO (1) WO2005122665A2 (de)

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US20090008431A1 (en) * 2007-07-03 2009-01-08 Kossi Zonvide Solderable EMI Gasket and Grounding Pad
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US20090242271A1 (en) * 2008-03-28 2009-10-01 Jan Vetrovec Lightweight electric conductor assembly
US20100052263A1 (en) * 2008-09-03 2010-03-04 Baker Hughes Incorporated Electroplated resilient seal
US8138429B2 (en) * 2008-12-17 2012-03-20 3M Innovative Properties Company Electromagnetic shielding article
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JP2011018873A (ja) * 2009-05-22 2011-01-27 Sony Ericsson Mobilecommunications Japan Inc 電磁シールド方法および電磁シールド用フィルム
DE102010000881A1 (de) * 2010-01-14 2011-07-21 Henkel AG & Co. KGaA, 40589 1K- Kaschierklebstoff mit Silanvernetzung
US20130133942A1 (en) * 2010-07-26 2013-05-30 Laird Technologies, Inc. Process for the fabrication of highly electrically-conductive polymer foams with controlled compression set suitable for use in emi shielding applications
KR101033193B1 (ko) 2010-10-14 2011-05-06 주식회사 이노칩테크놀로지 전자파 차폐 가스켓
KR101048083B1 (ko) * 2010-10-14 2011-07-11 주식회사 이노칩테크놀로지 전자파 차폐 가스켓
DE212013000167U1 (de) 2012-07-28 2015-03-06 Laird Technologies, Inc. Mit metallischem Film überzogener Schaumstoffkontakt
WO2014086038A1 (en) * 2012-12-07 2014-06-12 Laird Technologies, Inc. Coatings and methods for providing fabrics with faux metal platings
US9531853B2 (en) * 2013-03-14 2016-12-27 Htc Corporation Electronic module and electronic device
US9226433B2 (en) 2013-03-15 2015-12-29 Laird Technologies, Inc. Selectively conductive EMI gaskets
US8884168B2 (en) 2013-03-15 2014-11-11 Laird Technologies, Inc. Selectively conductive EMI gaskets
JP5497949B1 (ja) * 2013-07-03 2014-05-21 Ｊｘ日鉱日石金属株式会社 電磁波シールド用金属箔、電磁波シールド材及びシールドケーブル
JP5887305B2 (ja) 2013-07-04 2016-03-16 Ｊｘ金属株式会社 電磁波シールド用金属箔、電磁波シールド材、及びシールドケーブル
CA2917916A1 (en) 2013-07-09 2015-02-05 United Technologies Corporation Plated polymer nosecone
CA2917871A1 (en) 2013-07-09 2015-01-15 United Technologies Corporation Plated tubular lattice structure
US20160376709A1 (en) * 2013-07-09 2016-12-29 United Technologies Corporation Industrial products formed from plated polymers
CA2917884A1 (en) 2013-07-09 2015-01-15 United Technologies Corporation Plated polymer fan
EP3019723A4 (de) 2013-07-09 2017-05-10 United Technologies Corporation Beschichteter polymerverdichter
US9060417B2 (en) 2013-10-03 2015-06-16 International Business Machines Corporation Device for attenuating propagation of electromagnetic emissions from an enclosure
CN106460219B (zh) 2014-05-30 2019-11-19 Ｊｘ金属株式会社 电磁波屏蔽用金属箔、电磁波屏蔽材料及屏蔽电缆
CN107182195B (zh) * 2017-07-28 2019-10-11 北京航天发射技术研究所 用于电子设备面板上元器件的电磁屏蔽装置及其屏蔽方法
US10058014B1 (en) * 2017-12-13 2018-08-21 International Business Machines Corporation Conductive adhesive layer for gasket assembly
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Also Published As

Publication number Publication date
US6943288B1 (en) 2005-09-13
TW200614908A (en) 2006-05-01
EP1779713A4 (de) 2008-12-31
EP1779713A2 (de) 2007-05-02
EP1779713B1 (de) 2012-05-09
WO2005122665A2 (en) 2005-12-22
WO2005122665A3 (en) 2006-02-16

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