JP2009302222A - メサ型半導体装置及びその製造方法 - Google Patents

メサ型半導体装置及びその製造方法 Download PDF

Info

Publication number
JP2009302222A
JP2009302222A JP2008153851A JP2008153851A JP2009302222A JP 2009302222 A JP2009302222 A JP 2009302222A JP 2008153851 A JP2008153851 A JP 2008153851A JP 2008153851 A JP2008153851 A JP 2008153851A JP 2009302222 A JP2009302222 A JP 2009302222A
Authority
JP
Japan
Prior art keywords
mesa
insulating film
semiconductor layer
mesa groove
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008153851A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009302222A5 (enExample
Inventor
Katsuyuki Seki
克行 関
Akira Suzuki
彰 鈴木
Keita Odajima
慶汰 小田島
Kikuo Okada
喜久雄 岡田
Kojiro Kameyama
工次郎 亀山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
System Solutions Co Ltd
On Semiconductor Niigata Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Sanyo Semiconductor Co Ltd
Sanyo Semiconductor Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd, Sanyo Semiconductor Co Ltd, Sanyo Semiconductor Manufacturing Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP2008153851A priority Critical patent/JP2009302222A/ja
Priority to TW098119329A priority patent/TWI415192B/zh
Priority to KR1020090051851A priority patent/KR101075709B1/ko
Priority to US12/482,674 priority patent/US8227901B2/en
Priority to CN2009101406685A priority patent/CN101604632B/zh
Publication of JP2009302222A publication Critical patent/JP2009302222A/ja
Publication of JP2009302222A5 publication Critical patent/JP2009302222A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H10D8/422—PN diodes having the PN junctions in mesas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02249—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by combined oxidation and nitridation performed simultaneously
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/113—Isolations within a component, i.e. internal isolations
    • H10D62/115—Dielectric isolations, e.g. air gaps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H10D8/01—Manufacture or treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
  • Element Separation (AREA)
  • Formation Of Insulating Films (AREA)
JP2008153851A 2008-06-12 2008-06-12 メサ型半導体装置及びその製造方法 Pending JP2009302222A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008153851A JP2009302222A (ja) 2008-06-12 2008-06-12 メサ型半導体装置及びその製造方法
TW098119329A TWI415192B (zh) 2008-06-12 2009-06-10 台型半導體裝置及其製造方法
KR1020090051851A KR101075709B1 (ko) 2008-06-12 2009-06-11 메사형 반도체 장치 및 그 제조 방법
US12/482,674 US8227901B2 (en) 2008-06-12 2009-06-11 Mesa type semiconductor device and manufacturing method thereof
CN2009101406685A CN101604632B (zh) 2008-06-12 2009-06-12 台型半导体装置及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008153851A JP2009302222A (ja) 2008-06-12 2008-06-12 メサ型半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2009302222A true JP2009302222A (ja) 2009-12-24
JP2009302222A5 JP2009302222A5 (enExample) 2011-07-07

Family

ID=41413966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008153851A Pending JP2009302222A (ja) 2008-06-12 2008-06-12 メサ型半導体装置及びその製造方法

Country Status (5)

Country Link
US (1) US8227901B2 (enExample)
JP (1) JP2009302222A (enExample)
KR (1) KR101075709B1 (enExample)
CN (1) CN101604632B (enExample)
TW (1) TWI415192B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010021532A (ja) * 2008-06-12 2010-01-28 Sanyo Electric Co Ltd メサ型半導体装置及びその製造方法
DE102011112659B4 (de) * 2011-09-06 2022-01-27 Vishay Semiconductor Gmbh Oberflächenmontierbares elektronisches Bauelement
CN104681633B (zh) * 2015-01-08 2018-05-08 北京时代民芯科技有限公司 具备低漏电高耐压终端结构的台面二极管及其制备方法
US10479675B2 (en) * 2015-09-30 2019-11-19 Denso Corporation Method of production of semiconductor device having semiconductor layer and support substrate spaced apart by recess
CN106098791A (zh) * 2016-06-16 2016-11-09 杭州赛晶电子有限公司 U型蚀刻直角台面硅二极管及其硅芯和制备方法
CN108365015A (zh) * 2017-12-29 2018-08-03 济南兰星电子有限公司 半导体二极管芯片及其制作方法
CN119673784B (zh) * 2024-11-20 2025-07-22 济南科盛电子有限公司 一种高效的gpp芯片玻璃钝化层制备工艺

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001110799A (ja) * 1999-10-04 2001-04-20 Sanken Electric Co Ltd 半導体素子及びその製造方法
JP2003347306A (ja) * 2002-05-24 2003-12-05 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JP2004319554A (ja) * 2003-04-11 2004-11-11 Oki Electric Ind Co Ltd 光半導体素子および光半導体素子の製造方法
JP2006100694A (ja) * 2004-09-30 2006-04-13 Matsushita Electric Ind Co Ltd メサ型半導体装置およびその製造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1485015A (en) * 1974-10-29 1977-09-08 Mullard Ltd Semi-conductor device manufacture
US3973270A (en) * 1974-10-30 1976-08-03 Westinghouse Electric Corporation Charge storage target and method of manufacture
JPS51139281A (en) * 1975-05-28 1976-12-01 Hitachi Ltd Semi-conductor device
US4179794A (en) * 1975-07-23 1979-12-25 Nippon Gakki Seizo Kabushiki Kaisha Process of manufacturing semiconductor devices
US4389281A (en) * 1980-12-16 1983-06-21 International Business Machines Corporation Method of planarizing silicon dioxide in semiconductor devices
JPS57196585A (en) * 1981-05-28 1982-12-02 Nec Corp Manufacture of high-speed mesa type semiconductor device
JPS5943545A (ja) * 1982-09-06 1984-03-10 Hitachi Ltd 半導体集積回路装置
US4738936A (en) * 1983-07-01 1988-04-19 Acrian, Inc. Method of fabrication lateral FET structure having a substrate to source contact
US4663832A (en) * 1984-06-29 1987-05-12 International Business Machines Corporation Method for improving the planarity and passivation in a semiconductor isolation trench arrangement
US4725562A (en) * 1986-03-27 1988-02-16 International Business Machines Corporation Method of making a contact to a trench isolated device
US4775643A (en) * 1987-06-01 1988-10-04 Motorola Inc. Mesa zener diode and method of manufacture thereof
KR940016546A (ko) * 1992-12-23 1994-07-23 프레데릭 얀 스미트 반도체 장치 및 제조방법
JPH1075012A (ja) * 1996-06-27 1998-03-17 Mitsubishi Electric Corp 半導体レーザ装置，及びその製造方法
JP4200626B2 (ja) * 2000-02-28 2008-12-24 株式会社デンソー 絶縁ゲート型パワー素子の製造方法
JP3492279B2 (ja) * 2000-03-21 2004-02-03 Ｎｅｃエレクトロニクス株式会社 素子分離領域の形成方法
US6383933B1 (en) * 2000-03-23 2002-05-07 National Semiconductor Corporation Method of using organic material to enhance STI planarization or other planarization processes
JP2002261269A (ja) 2001-02-27 2002-09-13 Matsushita Electric Ind Co Ltd メサ型半導体装置の製造方法
JP2005051111A (ja) 2003-07-30 2005-02-24 Matsushita Electric Ind Co Ltd メサ型半導体装置
JP3767864B2 (ja) * 2004-02-16 2006-04-19 ローム株式会社 メサ型半導体装置の製法
JP4901300B2 (ja) 2006-05-19 2012-03-21 新電元工業株式会社 半導体装置の製造方法
JP5117698B2 (ja) * 2006-09-27 2013-01-16 ルネサスエレクトロニクス株式会社 半導体装置
JP2010021532A (ja) * 2008-06-12 2010-01-28 Sanyo Electric Co Ltd メサ型半導体装置及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001110799A (ja) * 1999-10-04 2001-04-20 Sanken Electric Co Ltd 半導体素子及びその製造方法
JP2003347306A (ja) * 2002-05-24 2003-12-05 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JP2004319554A (ja) * 2003-04-11 2004-11-11 Oki Electric Ind Co Ltd 光半導体素子および光半導体素子の製造方法
JP2006100694A (ja) * 2004-09-30 2006-04-13 Matsushita Electric Ind Co Ltd メサ型半導体装置およびその製造方法

Also Published As

Publication number Publication date
KR101075709B1 (ko) 2011-10-21
TW200952085A (en) 2009-12-16
TWI415192B (zh) 2013-11-11
US20090309194A1 (en) 2009-12-17
CN101604632B (zh) 2012-03-07
KR20090129367A (ko) 2009-12-16
CN101604632A (zh) 2009-12-16
US8227901B2 (en) 2012-07-24

Similar Documents

Publication Publication Date Title
US8368181B2 (en) Mesa semiconductor device and method of manufacturing the same
KR101230680B1 (ko) 반도체 장치 및 그 제조 방법
CN103311317B (zh) 碳化硅半导体装置及其制造方法
JP2009206502A (ja) メサ型半導体装置及びその製造方法
JP5074172B2 (ja) メサ型半導体装置及びその製造方法
JP2009302222A (ja) メサ型半導体装置及びその製造方法
JP5687128B2 (ja) 半導体装置およびその製造方法
JP2000196075A (ja) 半導体装置及びその製造方法
EP3133648A1 (en) Semiconductor device and manufacturing mehtod thereof
US20060255407A1 (en) Semiconductor device and manufacturing method of the same
TWI405268B (zh) 台型半導體裝置及其製造方法
JP2011040431A (ja) 半導体装置およびその製造方法
JP2011253883A (ja) 半導体装置及びその製造方法
JP2013134998A (ja) 半導体装置およびその製造方法
CN111162008B (zh) 半导体装置及其制造方法
US20250105078A1 (en) Semiconductor device and manufacturing method thereof
JP2007158218A (ja) メサ型半導体装置
JP2024122592A (ja) 炭化珪素半導体装置およびその製造方法
CN117637611A (zh) 一种改善芯片切割形变的晶圆结构及其制作方法
JP2008147268A (ja) メサ型半導体素子とその製造方法
JP2007036299A (ja) 半導体装置及びその製造方法
JP2012033950A (ja) 半導体装置の製造方法

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20101215

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20110324

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110520

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110523

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20110603

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20110603

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20130207

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130215

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20130301

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130426

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130507

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130729

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20131212

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20140507