JP2009267414A - 幅広リードフレーム用の半導体パッケージ製造装置及びこれを利用した半導体パッケージ製造方法 - Google Patents
幅広リードフレーム用の半導体パッケージ製造装置及びこれを利用した半導体パッケージ製造方法 Download PDFInfo
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- JP2009267414A JP2009267414A JP2009106735A JP2009106735A JP2009267414A JP 2009267414 A JP2009267414 A JP 2009267414A JP 2009106735 A JP2009106735 A JP 2009106735A JP 2009106735 A JP2009106735 A JP 2009106735A JP 2009267414 A JP2009267414 A JP 2009267414A
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Abstract
【解決手段】第1面とその反対側の第2面とを有するリードフレーム70を両方向へ移送するインデックス・レール120、インデックス・レール120の一端部に連結されてインデックス・レール120にリードフレーム70を供給するローダ部110、インデックス・レール120の一端部の反対側端部に連結されてリードフレーム70を第1面に対する垂線を中心に回転させるフレーム駆動部140、及びインデックス・レール120に供給されたリードフレーム70に付着された半導体チップとリードフレームをワイヤボンドによって電気的に連結させるためのワイヤボンディング部130を備える半導体パッケージ製造装置である。
【選択図】図4
Description
11,31 第1半導体チップ
13,33 第2半導体チップ
15,61 成形樹脂
20,40 リードフレーム
21,41 ダイパッド
23,43 リードフィンガ
25,45 第1接着層
26,47 第2接着層
27,28,51,53,55,57 ワイヤボンド
30 QDP
35 第3半導体チップ
37 第4半導体チップ
46 第3接着層
48 第4接着層
70 幅広リードフレーム
72 モールディング領域
80 単位リードフレーム
100,500 半導体パッケージ製造装置
110 ローダ部
120 インデックス・レール
125 吸着ブロック
130 ワイヤボンディング部
132 ボンディングヘッド
132a ボンディング・トランスデューサ
132b ヘッドブロック
134 移送モジュール
134a 移送軸
134b 駆動装置
140 フレーム駆動部
142 回転テーブル
144 フレームローディング・レール
146 固定装置
148 回転装置
148a 回転軸
148b 回転駆動装置
170 アンローダ部
180 反転装置
182 回転軸
184 反転駆動装置
210 半導体チップ
220 ボンディングプローブ
230 導電性ワイヤ
232 ワイヤボンド
510 第1ワイヤボンディング装置
520 第2ワイヤボンディング装置
C 幅広リードフレームの幅中心線
L 幅広リードフレームの長さ
W 幅広リードフレームの幅
WB アタッチヘッドの幅方向への有効移動距離
WI インデックス・レールの幅
Claims (20)
- 第1面とその反対側の第2面とを有するリードフレームを両方向へ移送するインデックス・レールと、
前記インデックス・レールの一端部に連結され、前記インデックス・レールに前記リードフレームを供給するローダ部と、
前記インデックス・レールの前記一端部の反対側端部に連結され、前記リードフレームを前記第1面に対する垂線を中心に回転させるフレーム駆動部と、
前記インデックス・レールに供給された前記リードフレームに付着された半導体チップと前記リードフレームとをワイヤボンドによって電気的に連結させるためのワイヤボンディング部とを備える半導体パッケージ製造装置。 - 前記ワイヤボンディング部は、
前記リードフレームに付着された半導体チップと前記リードフレームとを導電性ワイヤで連結するボンディング・トランスデューサが装着されたボンディングヘッドと、
前記ボンディングヘッドを前記インデックス・レール上に移送する移送モジュールとを備えることを特徴とする請求項1に記載の半導体パッケージ製造装置。 - 前記移送モジュールは、前記ボンディングヘッドを前記インデックス・レールの幅方向に沿って、前記インデックス・レールの幅方向の一端上から少なくとも前記インデックス・レールの幅方向の中心部上まで移動させることを特徴とする請求項2に記載の半導体パッケージ製造装置。
- 前記リードフレームを外部に排出するために、前記フレーム駆動部と連結されるアンローダ部をさらに備え、
前記フレーム駆動部は、前記リードフレームの状態によって選択的に、前記リードフレームをアンローダ部に送ったり、前記インデックス・レールにさらに供給することを特徴とする請求項1に記載の半導体パッケージ製造装置。 - 前記フレーム駆動部は、前記リードフレームを前記第1面に対する垂線を中心に回転させるために、
前記リードフレームを支持するためのフレームローディング・レールと、
前記フレームローディング・レールを支持する回転テーブルと、
前記第1面に対する垂線の方向に前記回転テーブルと連結された回転軸と、
前記回転軸に回転駆動力を供給する回転駆動装置とを備えることを特徴とする請求項1に記載の半導体パッケージ製造装置。 - 前記フレームローディング・レールは、前記フレーム駆動部によって1個のリードフレームずつ回転するように、前記1個のリードフレームを支持することを特徴とする請求項5に記載の半導体パッケージ製造装置。
- 前記フレーム駆動部は、前記リードフレームを180°回転させることを特徴とする請求項1に記載の半導体パッケージ製造装置。
- 前記ローダ部は、
前記インデックス・レールから移送された前記リードフレームを外部に排出するためのアンローディング機能を備えることを特徴とする請求項1に記載の半導体パッケージ製造装置。 - 前記フレーム駆動部は、
前記リードフレームの前記第1面と第2面とのうち上方を向く面が下方を向くように、前記リードフレームを反転させる反転装置をさらに具備することを特徴とする請求項1に記載の半導体パッケージ製造装置。 - 第1面とその反対側の第2面とを有するリードフレームを両方向へ移送するインデックス・レールと、前記インデックス・レール上に位置する前記リードフレームに付着された半導体チップと前記リードフレームとをワイヤボンドによって電気的に連結させるためのワイヤボンディング部とをそれぞれ含む第1ワイヤボンディング装置及び第2ワイヤボンディング装置と、
前記第1ワイヤボンディング装置の一端部に連結され、前記第1ワイヤボンディング装置に前記リードフレームを供給するローダ部と、
前記第2ワイヤボンディング装置の一端部に連結され、前記第2ワイヤボンディング装置から前記リードフレームが排出されるアンローダ部と、
前記第1ワイヤボンディング装置及び前記第2ワイヤボンディング装置のそれぞれ前記一端部の反対側端部間に連結され、前記リードフレームを前記第1面に対する垂線を中心に回転させるフレーム駆動部とを備える半導体パッケージ製造装置。 - 前記ワイヤボンディング部は、
前記リードフレームに付着された半導体チップと前記リードフレームとを金ワイヤで連結するボンディングヘッドと、
前記ボンディングヘッドを前記インデックス・レール上に移送する移送モジュールとを備えることを特徴とする請求項10に記載の半導体パッケージ製造装置。 - 前記移送モジュールは、前記ボンディングヘッドを前記インデックス・レールの幅方向に沿って、前記インデックス・レールの幅方向の一端上から少なくとも前記インデックス・レールの幅方向の中心部上まで移動させることを特徴とする請求項11に記載の半導体パッケージ製造装置。
- 前記フレーム駆動部は、
前記リードフレームの状態によって選択的に、前記リードフレームを前記第1ワイヤボンディング装置、または前記第2ワイヤボンディング装置に供給することを特徴とする請求項10に記載の半導体パッケージ製造装置。 - 前記フレーム駆動部は、
前記リードフレームの上方を向く面が下方を向くように、前記リードフレームを反転させる反転装置をさらに具備することを特徴とする請求項13に記載の半導体パッケージ製造装置。 - 複数のダイパッドを有する第1面とその反対側の第2面とを有するリードフレームを前記第1面が上方を向くようにワイヤボンディング部に供給する段階と、
前記ワイヤボンディング部で、前記リードフレームの第1面上に付着された半導体チップのうち一部と前記リードフレームとをワイヤボンドによって電気的に連結する第1ワイヤボンディング段階と、
前記リードフレームを前記第1面に対する垂線を中心に回転させる段階と、
前記ワイヤボンディング部で、前記リードフレームの第1面上に付着された半導体チップのうちワイヤボンディングされていない残りの半導体チップと前記リードフレームとをワイヤボンドによって電気的に連結する第2ワイヤボンディング段階とを含むことを特徴とする半導体パッケージ製造方法。 - 前記第1ワイヤボンディング段階は、
前記リードフレーム第1面の第1方向への中心線を基準に少なくとも一側半分に付着されたあらゆる半導体チップと前記リードフレームとを、それぞれワイヤボンドによって電気的に連結することを特徴とする請求項15に記載の半導体パッケージ製造方法。 - 前記第2ワイヤボンディング段階は、
前記リードフレーム第1面の第1方向への中心線を基準に少なくとも一側半分に付着されたあらゆる半導体チップと前記リードフレームとを、それぞれワイヤボンドによって電気的に連結することを特徴とする請求項15に記載の半導体パッケージ製造方法。 - 前記リードフレームの前記第2面が上方を向くように、前記リードフレームを反転する段階と、
前記ワイヤボンディング部で、前記リードフレームの第2面上に付着された半導体チップのうち一部と前記リードフレームとをワイヤボンドによって電気的に連結する第3ワイヤボンディング段階と、
前記リードフレームを前記第2面に対する垂線を中心に回転させる段階と、
前記ワイヤボンディング部で、前記リードフレームの第2面上に付着された半導体チップのうちワイヤボンディングされていない半導体チップと前記リードフレームとをワイヤボンドによって電気的に連結する第4ワイヤボンディング段階とをさらに含むことを特徴とする請求項15に記載の半導体パッケージ製造方法。 - 前記第3ワイヤボンディング段階は、
前記リードフレーム第2面の第1方向への中心線を基準に少なくとも一側半分に付着されたあらゆる半導体チップと前記リードフレームとを、それぞれワイヤボンドによって電気的に連結することを特徴とする請求項18に記載の半導体パッケージ製造方法。 - 前記第4ワイヤボンディング段階は、
前記リードフレーム第2面の第1方向への中心線を基準に少なくとも一側半分に付着されたあらゆる半導体チップと前記リードフレームとを、それぞれワイヤボンドによって電気的に連結することを特徴とする請求項18に記載の半導体パッケージ製造方法。
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