CN105489531A - 一种cob固晶焊线系统和方法 - Google Patents

一种cob固晶焊线系统和方法 Download PDF

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CN105489531A
CN105489531A CN201510908357.4A CN201510908357A CN105489531A CN 105489531 A CN105489531 A CN 105489531A CN 201510908357 A CN201510908357 A CN 201510908357A CN 105489531 A CN105489531 A CN 105489531A
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die bond
bonder
wire
reverse
chip
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CN105489531B (zh
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何苗
张园园
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Suzhou Yonghao Technology Co ltd
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South China Normal University
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Abstract

本发明公开了一种COB固晶焊线系统和方法，该系统包括有控制器、正向固晶机、反向固晶机和传送带，所述控制器分别与正向固晶机和反向固晶机连接，所述正向固晶机与反向固晶机通过传送带连接。本发明系统和方法利用同向固晶机和反向固晶机实现固定芯片时正反向固定方式的结合，从而用于实现基板上芯片的连接金线用量最少，从而节省电路成本、工作时间和劳动力。本发明作为一种COB固晶焊线系统和方法可广泛应用于电子领域。

Description

一种COB固晶焊线系统和方法
技术领域
本发明涉及电子领域，尤其是一种COB固晶焊线系统和方法。
背景技术
COB（ChipsonBoard,板上芯片封装），即将裸芯片用导电或非导电胶粘附在互联的基板上，然后进行引线键合实现其电连接。
传统的固晶操作过程中是采用一台固晶机，因此只能实现同向固晶，焊线只能依次正负极键合，由于大部分COB基板是圆形的，这样形成了折叠形的焊线方式如图3所示，在实际生产中金线消耗量较大。由于金线成本较高，这就造成了成本高的问题。
发明内容
为了解决上述技术问题，本发明的目的是：提供一种实现节省金线使用量、焊线时间的COB固晶焊线装置。
为了解决上述技术问题，本发明的另一目的是：提供一种实现节省金线使用量、焊线时间的COB固晶焊线的方法。
本发明所采用的技术方案是：一种COB固晶焊线系统，包括有控制器、正向固晶机、反向固晶机和传送带，所述控制器分别与正向固晶机和反向固晶机连接，所述正向固晶机与反向固晶机通过传送带连接。
进一步，所述控制器内包括有最短焊线路径计算模块，所述最短焊线路径计算模块用于计算基板上实现最短焊线路径的芯片固晶布局。
进一步，还包括有焊线装置，所述焊线装置与控制器连接。
本发明所采用的另一技术方案是：一种COB固晶焊线方法，包括有以下步骤：
A、根据芯片的正向固晶和反向固晶两种方式，计算基板上实现最短焊线路径的芯片固晶布局；
B、将上述芯片固晶布局中的正向固晶布局发送至正向固晶机，将上述芯片固晶布局中的反向固晶布局发送至反向固晶机，将最短焊线路径发送至焊线装置；
C、由正向固晶机对基板进行固晶操作，将正向固晶后的基板通过传送带传送至反向固晶机，再由反向固晶机对基板进行固晶操作；
D、通过焊线装置对基板上的芯片进行焊线操作。
进一步，所述步骤A中实现最短焊线路径的芯片固晶布局为芯片分排排列，其中每排内的芯片均为正向或反向排列，相邻两排的芯片排列方向相反。
进一步，所述步骤C中反正固晶机的固晶操作先于正向固晶机的固晶操作，具体步骤为：由反向固晶机对基板进行固晶操作，将反向固晶后的基板通过传送带传送至正向固晶机，再由正向固晶机对基板进行固晶操作。
本发明的有益效果是：本发明装置利用同向固晶机和反向固晶机实现固定芯片时正反向固定方式的结合，从而用于实现基板上芯片的连接金线用量最少，从而节省电路成本、工作时间和劳动力。
本发明的另一有益效果是：本发明本方法利用同向固晶机和反向固晶机实现固定芯片时正反向固定方式的结合，从而用于实现基板上芯片的连接金线用量最少，从而节省电路成本、工作时间和劳动力。
附图说明
图1为本发明装置的结构示意图；
图2为本发明方法的步骤流程图；
图3为现有技术中的固晶布局方式；
图4为本发明装置和方法实现的一固晶焊线实施例示意图；
图5为本发明装置和方法实现的另一固晶焊线实施例示意图。
具体实施方式
下面结合附图对本发明的具体实施方式作进一步说明：
参照图1，一种COB固晶焊线系统，包括有控制器、正向固晶机、反向固晶机和传送带，所述控制器分别与正向固晶机和反向固晶机连接，所述正向固晶机与反向固晶机通过传送带连接。
进一步作为优选的实施方式，所述控制器内包括有最短焊线路径计算模块，所述最短焊线路径计算模块用于计算基板上实现最短焊线路径的芯片固晶布局。
进一步作为优选的实施方式，还包括有焊线装置，所述焊线装置与控制器连接。
参照图2，一种COB固晶焊线方法，包括有以下步骤：
A、根据芯片的正向固晶和反向固晶两种方式，计算基板上实现最短焊线路径的芯片固晶布局；
B、将上述芯片固晶布局中的正向固晶布局发送至正向固晶机，将上述芯片固晶布局中的反向固晶布局发送至反向固晶机，将最短焊线路径发送至焊线装置；
C、由正向固晶机对基板进行固晶操作，将正向固晶后的基板通过传送带传送至反向固晶机，再由反向固晶机对基板进行固晶操作；
D、通过焊线装置对基板上的芯片进行焊线操作。
进一步作为优选的实施方式，所述步骤A中实现最短焊线路径的芯片固晶布局为芯片分排排列，其中每排内的芯片均为正向或反向排列，相邻两排的芯片排列方向相反。
进一步作为优选的实施方式，所述步骤C中反正固晶机的固晶操作先于正向固晶机的固晶操作，具体步骤为：由反向固晶机对基板进行固晶操作，将反向固晶后的基板通过传送带传送至正向固晶机，再由正向固晶机对基板进行固晶操作。
参照图4，本发明第一具体实施例，即是采用异向固晶焊线，部分芯片正极朝向基板负极引脚（即图中的“-”）。
与图4相比，图3为传统的中小功率固晶焊线方式实现的固晶焊线图，其中所有芯片是同向的，即固晶时所有芯片正极朝向基板正极引脚，而负极朝向基板负极引脚。
本方法图4实施例采用两个方向固晶，相比传统同向固晶焊线方法节约大量金线。通过测量计算，图3中传统同向固晶需要金线0.0525m/pcs，而此方法需金线0.039m/pcs，金线节约了25.7%，明显降低了成本。
同时，由于固晶机是按特征识别芯片然后固晶，芯片只能固一个方向。如果反复设置参数无疑会增加劳动力成本。新的实现方法可以用两台固晶机组成系统实现，第一台固正向芯片，第二台固反向芯片，中间通过自动传送带连接，从而节省实现时间和成本。
参照图5，作为本发明第二具体实施例，相对于图4中横向排列的芯片，图5中芯片呈竖直方向排列，其中每列中的芯片均为为正向或反向排列，相邻两排的芯片排列方向相反；该芯片固晶布局所需要的金线使用量与图4中的相同，同样可起到节省金线的作用。
以上是对本发明的较佳实施进行了具体说明，但本发明创造并不限于所述实施例，熟悉本领域的技术人员在不违背本发明精神的前提下还可以作出种种的等同变换或替换，这些等同的变形或替换均包含在本申请权利要求所限定的范围内。

Claims (6)

1.一种COB固晶焊线系统，其特征在于：包括有控制器、正向固晶机、反向固晶机和传送带，所述控制器分别与正向固晶机和反向固晶机连接，所述正向固晶机与反向固晶机通过传送带连接。
2.根据权利要求1所述的一种COB固晶焊线系统，其特征在于：所述控制器内包括有最短焊线路径计算模块，所述最短焊线路径计算模块用于计算基板上实现最短焊线路径的芯片固晶布局。
3.根据权利要求1所述的一种COB固晶焊线系统，其特征在于：还包括有焊线装置，所述焊线装置与控制器连接。
4.一种COB固晶焊线方法，其特征在于：包括有以下步骤：
A、根据芯片的正向固晶和反向固晶两种方式，计算基板上实现最短焊线路径的芯片固晶布局；
B、将上述芯片固晶布局中的正向固晶布局发送至正向固晶机，将上述芯片固晶布局中的反向固晶布局发送至反向固晶机，将最短焊线路径发送至焊线装置；
C、由正向固晶机对基板进行固晶操作，将正向固晶后的基板通过传送带传送至反向固晶机，再由反向固晶机对基板进行固晶操作；
D、通过焊线装置对基板上的芯片进行焊线操作。
5.根据权利要求4所述的一种COB固晶焊线方法，其特征在于：所述步骤A中实现最短焊线路径的芯片固晶布局为芯片分排排列，其中每排内的芯片均为正向或反向排列，相邻两排的芯片排列方向相反。
6.根据权利要求4所述的一种COB固晶焊线方法，其特征在于：所述步骤C中反正固晶机的固晶操作先于正向固晶机的固晶操作，具体步骤为：由反向固晶机对基板进行固晶操作，将反向固晶后的基板通过传送带传送至正向固晶机，再由正向固晶机对基板进行固晶操作。
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