JP2009206145A5 - - Google Patents

Download PDF

Info

Publication number
JP2009206145A5
JP2009206145A5 JP2008044393A JP2008044393A JP2009206145A5 JP 2009206145 A5 JP2009206145 A5 JP 2009206145A5 JP 2008044393 A JP2008044393 A JP 2008044393A JP 2008044393 A JP2008044393 A JP 2008044393A JP 2009206145 A5 JP2009206145 A5 JP 2009206145A5
Authority
JP
Japan
Prior art keywords
region
forming
conductivity type
gate electrode
source region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008044393A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009206145A (ja
JP5442951B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2008044393A external-priority patent/JP5442951B2/ja
Priority to JP2008044393A priority Critical patent/JP5442951B2/ja
Priority to KR1020090014839A priority patent/KR101618613B1/ko
Priority to TW98105808A priority patent/TWI472032B/zh
Priority to US12/392,450 priority patent/US7888212B2/en
Priority to CN200910007920.5A priority patent/CN101521230B/zh
Publication of JP2009206145A publication Critical patent/JP2009206145A/ja
Priority to US12/983,583 priority patent/US8207575B2/en
Publication of JP2009206145A5 publication Critical patent/JP2009206145A5/ja
Publication of JP5442951B2 publication Critical patent/JP5442951B2/ja
Application granted granted Critical
Priority to KR1020150183285A priority patent/KR101667499B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008044393A 2008-02-26 2008-02-26 半導体装置の製造方法 Expired - Fee Related JP5442951B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2008044393A JP5442951B2 (ja) 2008-02-26 2008-02-26 半導体装置の製造方法
KR1020090014839A KR101618613B1 (ko) 2008-02-26 2009-02-23 반도체 장치 및 그 제조 방법
TW98105808A TWI472032B (zh) 2008-02-26 2009-02-24 半導體裝置及其製造方法
US12/392,450 US7888212B2 (en) 2008-02-26 2009-02-25 Semiconductor device and method of manufacturing the same
CN200910007920.5A CN101521230B (zh) 2008-02-26 2009-02-26 半导体器件及其制造方法
US12/983,583 US8207575B2 (en) 2008-02-26 2011-01-03 Semiconductor device and method of manufacturing the same
KR1020150183285A KR101667499B1 (ko) 2008-02-26 2015-12-21 반도체 장치 및 그 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008044393A JP5442951B2 (ja) 2008-02-26 2008-02-26 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2009206145A JP2009206145A (ja) 2009-09-10
JP2009206145A5 true JP2009206145A5 (enExample) 2011-01-27
JP5442951B2 JP5442951B2 (ja) 2014-03-19

Family

ID=40997475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008044393A Expired - Fee Related JP5442951B2 (ja) 2008-02-26 2008-02-26 半導体装置の製造方法

Country Status (5)

Country Link
US (2) US7888212B2 (enExample)
JP (1) JP5442951B2 (enExample)
KR (2) KR101618613B1 (enExample)
CN (1) CN101521230B (enExample)
TW (1) TWI472032B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5165954B2 (ja) * 2007-07-27 2013-03-21 セイコーインスツル株式会社 半導体装置
CN102198925B (zh) 2010-03-25 2015-03-04 张家港丽恒光微电子科技有限公司 Mems器件及其形成方法
JP6084357B2 (ja) * 2011-11-02 2017-02-22 ルネサスエレクトロニクス株式会社 半導体装置
JP5939846B2 (ja) * 2012-03-09 2016-06-22 エスアイアイ・セミコンダクタ株式会社 半導体装置の製造方法
FR2995139A1 (fr) 2012-09-04 2014-03-07 St Microelectronics Sa Transistor mos

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03209760A (ja) * 1990-01-11 1991-09-12 Mitsubishi Electric Corp 半導体装置
JPH05168211A (ja) * 1991-12-11 1993-07-02 Okuma Mach Works Ltd 多極レゾルバー
WO1996022615A1 (en) * 1995-01-17 1996-07-25 National Semiconductor Corporation Co-implantation of arsenic and phosphorus in extended drain region for improved performance of high voltage nmos device
JPH098291A (ja) * 1995-06-20 1997-01-10 Fujitsu Ltd 半導体装置
JP3405681B2 (ja) * 1997-07-31 2003-05-12 株式会社東芝 半導体装置
JPH11168211A (ja) * 1997-12-02 1999-06-22 Toyota Central Res & Dev Lab Inc 半導体装置
US6114205A (en) * 1998-10-30 2000-09-05 Sony Corporation Epitaxial channel vertical MOS transistor
JP3644438B2 (ja) * 2002-04-09 2005-04-27 株式会社デンソー 半導体装置及びその製造方法
GB0314392D0 (en) * 2003-06-20 2003-07-23 Koninkl Philips Electronics Nv Trench mos structure
JP2006019518A (ja) * 2004-07-01 2006-01-19 Seiko Instruments Inc 横型トレンチｍｏｓｆｅｔ
JP4976658B2 (ja) 2005-04-05 2012-07-18 セイコーインスツル株式会社 半導体装置の製造方法

Similar Documents

Publication Publication Date Title
WO2007110832A3 (en) Trench-gate semiconductor device and method of fabrication thereof
JP2010114152A5 (enExample)
JP2001284584A5 (enExample)
JP2009516361A5 (enExample)
JP2009267021A5 (enExample)
JP2011193020A5 (enExample)
JP2010147405A5 (ja) 半導体装置
JP2010183022A5 (ja) 半導体装置
EP2620983A4 (en) SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREFOR
JP2009060096A5 (enExample)
JP2006186303A5 (enExample)
JP2006147789A5 (enExample)
WO2010051133A3 (en) Semiconductor devices having faceted silicide contacts, and related fabrication methods
JP2013508981A5 (enExample)
JP2011071304A5 (enExample)
JP2010186989A5 (enExample)
JP2006510206A5 (enExample)
JP2012033731A5 (enExample)
JP2009021568A5 (enExample)
JP2019057603A5 (enExample)
JP2009206145A5 (enExample)
JP2008182055A5 (enExample)
JP2009054999A5 (enExample)
JP2008199029A5 (enExample)
JP2010040951A5 (enExample)