JP2009182208A - 半導体チップパッケージ及びその製造方法 - Google Patents
半導体チップパッケージ及びその製造方法 Download PDFInfo
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- JP2009182208A JP2009182208A JP2008020775A JP2008020775A JP2009182208A JP 2009182208 A JP2009182208 A JP 2009182208A JP 2008020775 A JP2008020775 A JP 2008020775A JP 2008020775 A JP2008020775 A JP 2008020775A JP 2009182208 A JP2009182208 A JP 2009182208A
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Abstract
【解決手段】第1の支持板の表面に第1の配線パターンを形成して、該第1の配線パターン上に半導体チップを配置して、該半導体チップの電極端子と該第1の配線パターンの必要個所とを電気接続する。第2の支持板により一体に連結されている配線付ポスト電極部品の第2の配線パターンと接続されたポスト電極を、第1の支持板に形成した第1の配線パターンの所定の位置に、一括して固定しかつ電気的に接続する。樹脂封止後、第1及び第2の支持板を剥離し、おもて面側においてはガラス基板を貼り付け、かつ、裏面側においては第2の配線パターンに接続される前記外部電極を形成する。
【選択図】 図8
Description
Claims (10)
- おもて面側に備えた基板と、該基板に装着される半導体チップと、前記基板とは反対の裏面側に位置して前記半導体チップに接続される外部電極とを一体化してパッケージした半導体チップパッケージにおいて、
前記基板は、第1の支持板を剥離した位置に貼り付けられ、かつ、第1の支持板は、その表面に第1の配線パターンを形成して、該第1の配線パターン上に半導体チップを配置して、該半導体チップの電極端子と該第1の配線パターンの必要個所とを電気接続し、
第2の支持板により一体に連結されている配線付ポスト電極部品の第2の配線パターンと接続されたポスト電極を、第1の配線パターンの所定の位置に接続し、
第2の支持板を剥離した裏面側において第2の配線パターンに接続される前記外部電極を形成した、
ことから成る半導体チップパッケージ。 - おもて面側に備えた基板と、該基板に装着される半導体チップと、前記基板とは反対の裏面側に位置して前記半導体チップに接続される外部電極とを一体化してパッケージした半導体チップパッケージにおいて、
前記基板は、その表面に第1の配線パターンを形成して、該第1の配線パターン上に半導体チップを配置して、該半導体チップの電極端子と該第1の配線パターンの必要個所とを電気接続し、
支持板により一体に連結されている配線付ポスト電極部品の第2の配線パターンと接続されたポスト電極を、前記基板に形成した第1の配線パターンの所定の位置に接続し、
前記支持板を剥離した裏面側において第2の配線パターンに接続される前記外部電極を形成した、
ことから成る半導体チップパッケージ。 - おもて面側に備えた基板と、該基板に装着される半導体チップと、前記基板とは反対の裏面側に位置して前記半導体チップに接続される外部電極とを一体化してパッケージした半導体チップパッケージにおいて、
前記基板は、第1の支持板を剥離した位置に貼り付けられ、かつ、第1の支持板は、その表面に第1の配線パターンを形成して、該第1の配線パターン上に半導体チップを配置して、該半導体チップの電極端子と該第1の配線パターンの必要個所とを電気接続し、
第2の支持板の全面に貼り付けた絶縁基材テープにより一体に連結されている配線付ポスト電極部品の第2の配線パターンと接続されたポスト電極を、第1の支持板に形成した第1の配線パターンの所定の位置に接続し、
第2の支持板を剥離した裏面側においては前記絶縁基材テープに穴を空け、開口により露出した第2の配線パターンと接続される前記外部電極を形成した、
ことから成る半導体チップパッケージ。 - 前記半導体チップは、イメージセンサLSIチップであり、かつ前記基板はガラス基板又は光透過性の透明樹脂基板である請求項1〜3のいずれかに記載の半導体チップパッケージ。
- 前記基板は、ヒートシンクとして機能する高放熱基板である請求項1〜3のいずれかに記載の半導体チップパッケージ。
- おもて面側に備えた基板と、該基板に装着される半導体チップと、前記基板とは反対の裏面側に位置して前記半導体チップに接続される外部電極とを一体化してパッケージした半導体チップパッケージの製造方法において、
第1の支持板の表面に第1の配線パターンを形成して、該第1の配線パターン上に半導体チップを配置して、該半導体チップの電極端子と該第1の配線パターンの必要個所とを電気接続し、
第2の支持板により一体に連結されている配線付ポスト電極部品の第2の配線パターンと接続されたポスト電極を、第1の支持板に形成した第1の配線パターンの所定の位置に、一括して固定しかつ電気的に接続し、
樹脂封止後、第1及び第2の支持板を剥離し、おもて面側においては前記基板を貼り付け、かつ、裏面側においては第2の配線パターンに接続される前記外部電極を形成した、
ことから成る半導体チップパッケージの製造方法。 - おもて面側に備えた基板と、該基板に装着される半導体チップと、前記基板とは反対の裏面側に位置して前記半導体チップに接続される外部電極とを一体化してパッケージした半導体チップパッケージの製造方法において、
前記基板の表面に第1の配線パターンを形成して、該第1の配線パターン上に半導体チップを配置して、該半導体チップの電極端子と該第1の配線パターンの必要個所とを電気接続し、
支持板により一体に連結されている配線付ポスト電極部品の第2の配線パターンと接続されたポスト電極を、前記基板に形成した第1の配線パターンの所定の位置に、一括して固定しかつ電気的に接続し、
樹脂封止後、前記支持板を剥離し、裏面側において第2の配線パターンに接続される前記外部電極を形成した、
ことから成る半導体チップパッケージの製造方法。 - おもて面側に備えた基板と、該基板に装着される半導体チップと、前記基板とは反対の裏面側に位置して前記半導体チップに接続される外部電極とを一体化してパッケージした半導体チップパッケージの製造方法において、
第1の支持板の表面に第1の配線パターンを形成して、該第1の配線パターン上に半導体チップを配置して、該半導体チップの電極端子と該第1の配線パターンの必要個所とを電気接続し、
第2の支持板の全面に貼り付けた絶縁基材テープにより一体に連結されている配線付ポスト電極部品の第2の配線パターンと接続されたポスト電極を、第1の支持板に形成した第1の配線パターンの所定の位置に、一括して固定しかつ電気的に接続し、
樹脂封止後、第1及び第2の支持板を剥離し、おもて面側においては前記基板を貼り付け、かつ、裏面側においては前記絶縁基材テープに穴を空け、開口により露出した第2の配線パターンと接続される前記外部電極を形成した、
ことから成る半導体チップパッケージの製造方法。 - 前記半導体チップは、イメージセンサLSIチップであり、かつ前記基板はガラス基板又は光透過性の透明樹脂基板である請求項6〜8のいずれかに記載の半導体チップパッケージの製造方法。
- 前記基板は、ヒートシンクとして機能する高放熱基板である請求項6〜8のいずれかに記載の半導体チップパッケージの製造方法。
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