JP2009158829A5 - - Google Patents

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Publication number
JP2009158829A5
JP2009158829A5 JP2007337691A JP2007337691A JP2009158829A5 JP 2009158829 A5 JP2009158829 A5 JP 2009158829A5 JP 2007337691 A JP2007337691 A JP 2007337691A JP 2007337691 A JP2007337691 A JP 2007337691A JP 2009158829 A5 JP2009158829 A5 JP 2009158829A5
Authority
JP
Japan
Prior art keywords
electrostatic chuck
gas
fixing device
base
inert gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007337691A
Other languages
English (en)
Japanese (ja)
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JP2009158829A (ja
JP4929150B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2007337691A priority Critical patent/JP4929150B2/ja
Priority claimed from JP2007337691A external-priority patent/JP4929150B2/ja
Priority to US12/334,961 priority patent/US20090168292A1/en
Priority to CNA2008101766008A priority patent/CN101471279A/zh
Priority to KR1020080134767A priority patent/KR20090071489A/ko
Publication of JP2009158829A publication Critical patent/JP2009158829A/ja
Publication of JP2009158829A5 publication Critical patent/JP2009158829A5/ja
Application granted granted Critical
Publication of JP4929150B2 publication Critical patent/JP4929150B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007337691A 2007-12-27 2007-12-27 静電チャック及び基板温調固定装置 Active JP4929150B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007337691A JP4929150B2 (ja) 2007-12-27 2007-12-27 静電チャック及び基板温調固定装置
US12/334,961 US20090168292A1 (en) 2007-12-27 2008-12-15 Electrostatic chuck and substrate temperature adjusting-fixing device
CNA2008101766008A CN101471279A (zh) 2007-12-27 2008-12-25 静电夹盘和基板温度调节固定装置
KR1020080134767A KR20090071489A (ko) 2007-12-27 2008-12-26 정전척 및 기판 온도조절-고정장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007337691A JP4929150B2 (ja) 2007-12-27 2007-12-27 静電チャック及び基板温調固定装置

Publications (3)

Publication Number Publication Date
JP2009158829A JP2009158829A (ja) 2009-07-16
JP2009158829A5 true JP2009158829A5 (enExample) 2010-11-25
JP4929150B2 JP4929150B2 (ja) 2012-05-09

Family

ID=40798015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007337691A Active JP4929150B2 (ja) 2007-12-27 2007-12-27 静電チャック及び基板温調固定装置

Country Status (4)

Country Link
US (1) US20090168292A1 (enExample)
JP (1) JP4929150B2 (enExample)
KR (1) KR20090071489A (enExample)
CN (1) CN101471279A (enExample)

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CA2704683A1 (en) * 2010-05-28 2010-08-12 Ibm Canada Limited - Ibm Canada Limitee Grounded lid for micro-electronic assemblies
CN108359957A (zh) * 2010-10-29 2018-08-03 应用材料公司 用于物理气相沉积腔室的沉积环及静电夹盘
US9082804B2 (en) * 2011-02-07 2015-07-14 Varian Semiconductor Equipment Associates, Inc. Triboelectric charge controlled electrostatic clamp
JP5505667B2 (ja) * 2011-09-30 2014-05-28 Ｔｏｔｏ株式会社 交流駆動静電チャック
JP5785862B2 (ja) * 2011-11-30 2015-09-30 新光電気工業株式会社 静電チャック及びその製造方法、基板温調固定装置
JP2014049685A (ja) * 2012-09-03 2014-03-17 Ngk Spark Plug Co Ltd 半導体製造用部品
JP2014138164A (ja) * 2013-01-18 2014-07-28 Sumitomo Osaka Cement Co Ltd 静電チャック装置
NL2012204A (en) * 2013-02-07 2014-12-18 Asml Holding Nv Lithographic apparatus and method.
CN103594553B (zh) * 2013-10-23 2015-10-28 中国电子科技集团公司第四十八研究所 一种阵列式硅片装载靶盘
JP5811513B2 (ja) * 2014-03-27 2015-11-11 Toto株式会社 静電チャック
JP6382979B2 (ja) * 2014-07-22 2018-08-29 京セラ株式会社 載置用部材
US9753463B2 (en) * 2014-09-12 2017-09-05 Applied Materials, Inc. Increasing the gas efficiency for an electrostatic chuck
US20170278730A1 (en) * 2016-03-28 2017-09-28 Hitachi High-Technologies Corporation Plasma processing apparatus and plasma processing method
JP6877133B2 (ja) * 2016-03-28 2021-05-26 株式会社日立ハイテク プラズマ処理装置およびプラズマ処理方法
JP6903525B2 (ja) * 2017-04-19 2021-07-14 日本特殊陶業株式会社 セラミックス部材
KR102188779B1 (ko) * 2018-10-15 2020-12-08 세메스 주식회사 기판 지지 장치 및 그 제조방법
KR20210117338A (ko) * 2019-02-12 2021-09-28 램 리써치 코포레이션 세라믹 모놀리식 바디를 갖는 정전 척
US12300473B2 (en) * 2019-03-08 2025-05-13 Applied Materials, Inc. Electrostatic chuck for high bias radio frequency (RF) power application in a plasma processing chamber
CN110246745B (zh) * 2019-05-17 2021-12-21 苏州珂玛材料科技股份有限公司 一种等离子体处理装置及静电卡盘与静电卡盘的制造方法
JP7386624B2 (ja) * 2019-06-14 2023-11-27 日本特殊陶業株式会社 保持装置および保持装置の製造方法
CN110289241B (zh) * 2019-07-04 2022-03-22 北京北方华创微电子装备有限公司 静电卡盘及其制作方法、工艺腔室和半导体处理设备
KR20210057384A (ko) * 2019-11-12 2021-05-21 주식회사 미코세라믹스 정전척
JP7615150B2 (ja) * 2019-12-31 2025-01-16 エーエスエムエル ホールディング エヌ．ブイ． 両面静電クランプを製造するためのシステムおよび方法
US11594401B2 (en) * 2020-02-25 2023-02-28 Taiwan Semiconductor Manufacturing Co., Ltd. Method for manufacturing semiconductor wafer with wafer chuck having fluid guiding structure
US11450546B2 (en) * 2020-04-09 2022-09-20 Applied Materials, Inc. Semiconductor substrate support with internal channels
EP3923077A1 (en) 2020-06-11 2021-12-15 ASML Netherlands B.V. Object holder, electrostatic sheet and method for making an electrostatic sheet
JP7488712B2 (ja) * 2020-07-22 2024-05-22 デンカ株式会社 セラミック板及びその製造方法、セラミック焼結体の体積抵抗率の調整方法
CN114695048A (zh) * 2020-12-30 2022-07-01 中微半导体设备(上海)股份有限公司 下电极组件和包含下电极组件的等离子体处理装置
US12272585B2 (en) * 2021-04-27 2025-04-08 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer chuck structure with holes in upper surface to improve temperature uniformity
JP7707050B2 (ja) * 2021-12-17 2025-07-14 日本特殊陶業株式会社 保持装置
JP7759834B2 (ja) * 2022-03-31 2025-10-24 日本碍子株式会社 ウエハ載置台
JP7645838B2 (ja) * 2022-03-31 2025-03-14 日本碍子株式会社 ウエハ載置台
WO2024004147A1 (ja) * 2022-06-30 2024-01-04 日本碍子株式会社 半導体製造装置用部材
JP7515017B1 (ja) * 2022-10-14 2024-07-11 日本碍子株式会社 ウエハ載置台
KR102724770B1 (ko) * 2023-04-24 2024-10-31 엔지케이 인슐레이터 엘티디 웨이퍼 배치대
KR102752082B1 (ko) 2023-12-12 2025-01-10 주식회사 미코세라믹스 퍼지 가스 유로를 구비하는 서셉터

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JP3271352B2 (ja) * 1993-01-13 2002-04-02 ソニー株式会社 静電チャック及びその作製方法並びに基板処理装置及び基板搬送装置
JPH1131736A (ja) * 1997-07-11 1999-02-02 Anelva Corp 半導体製造装置用静電吸着ステージ
JP3980187B2 (ja) * 1998-07-24 2007-09-26 日本碍子株式会社 半導体保持装置、その製造方法およびその使用方法
US6259592B1 (en) * 1998-11-19 2001-07-10 Applied Materials, Inc. Apparatus for retaining a workpiece upon a workpiece support and method of manufacturing same
KR100511854B1 (ko) * 2002-06-18 2005-09-02 아네르바 가부시키가이샤 정전 흡착 장치
US7072165B2 (en) * 2003-08-18 2006-07-04 Axcelis Technologies, Inc. MEMS based multi-polar electrostatic chuck
JP4292574B2 (ja) * 2003-09-30 2009-07-08 Ｔｏｔｏ株式会社 静電チャックとその製造方法
JP2005166821A (ja) * 2003-12-01 2005-06-23 Toshiba Ceramics Co Ltd ウェーハ保持用静電チャック及びその製造方法
JP4768333B2 (ja) * 2005-06-29 2011-09-07 日本特殊陶業株式会社 静電チャック
US7672110B2 (en) * 2005-08-29 2010-03-02 Applied Materials, Inc. Electrostatic chuck having textured contact surface

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