JP2009158810A5 - - Google Patents
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- Publication number
- JP2009158810A5 JP2009158810A5 JP2007337248A JP2007337248A JP2009158810A5 JP 2009158810 A5 JP2009158810 A5 JP 2009158810A5 JP 2007337248 A JP2007337248 A JP 2007337248A JP 2007337248 A JP2007337248 A JP 2007337248A JP 2009158810 A5 JP2009158810 A5 JP 2009158810A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- sio
- effect
- insulating film
- cmp slurries
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229920000858 Cyclodextrin Polymers 0.000 description 1
- 239000001116 FEMA 4028 Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- WHGYBXFWUBPSRW-FOUAGVGXSA-N beta-cyclodextrin Chemical compound OC[C@H]([C@H]([C@@H]([C@H]1O)O)O[C@H]2O[C@@H]([C@@H](O[C@H]3O[C@H](CO)[C@H]([C@@H]([C@H]3O)O)O[C@H]3O[C@H](CO)[C@H]([C@@H]([C@H]3O)O)O[C@H]3O[C@H](CO)[C@H]([C@@H]([C@H]3O)O)O[C@H]3O[C@H](CO)[C@H]([C@@H]([C@H]3O)O)O3)[C@H](O)[C@H]2O)CO)O[C@@H]1O[C@H]1[C@H](O)[C@@H](O)[C@@H]3O[C@@H]1CO WHGYBXFWUBPSRW-FOUAGVGXSA-N 0.000 description 1
- 235000011175 beta-cyclodextrine Nutrition 0.000 description 1
- 229960004853 betadex Drugs 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007337248A JP2009158810A (ja) | 2007-12-27 | 2007-12-27 | 化学的機械的研磨用スラリーおよび半導体装置の製造方法 |
| US12/339,435 US20090176372A1 (en) | 2007-12-27 | 2008-12-19 | Chemical mechanical polishing slurry and semiconductor device manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007337248A JP2009158810A (ja) | 2007-12-27 | 2007-12-27 | 化学的機械的研磨用スラリーおよび半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009158810A JP2009158810A (ja) | 2009-07-16 |
| JP2009158810A5 true JP2009158810A5 (enExample) | 2010-04-15 |
Family
ID=40844923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007337248A Pending JP2009158810A (ja) | 2007-12-27 | 2007-12-27 | 化学的機械的研磨用スラリーおよび半導体装置の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20090176372A1 (enExample) |
| JP (1) | JP2009158810A (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5148948B2 (ja) * | 2007-08-23 | 2013-02-20 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | 研磨用スラリーのリサイクル方法 |
| CN101821058A (zh) * | 2008-06-11 | 2010-09-01 | 信越化学工业株式会社 | 合成石英玻璃基板用抛光剂 |
| SG176255A1 (en) | 2009-08-19 | 2012-01-30 | Hitachi Chemical Co Ltd | Polishing solution for cmp and polishing method |
| JP5878020B2 (ja) * | 2009-11-11 | 2016-03-08 | 株式会社クラレ | 化学的機械的研磨用スラリー並びにそれを用いる基板の研磨方法 |
| JP5481166B2 (ja) * | 2009-11-11 | 2014-04-23 | 株式会社クラレ | 化学的機械的研磨用スラリー |
| JP5251861B2 (ja) * | 2009-12-28 | 2013-07-31 | 信越化学工業株式会社 | 合成石英ガラス基板の製造方法 |
| US10103331B2 (en) * | 2010-02-05 | 2018-10-16 | Industry-University Cooperation Foundation Hanyang University | Slurry for polishing phase-change materials and method for producing a phase-change device using same |
| KR101396232B1 (ko) * | 2010-02-05 | 2014-05-19 | 한양대학교 산학협력단 | 상변화 물질 연마용 슬러리 및 이를 이용한 상변화 소자 제조 방법 |
| SG188621A1 (en) * | 2010-10-21 | 2013-04-30 | Moresco Corp | Lubricant composition for polishing glass substrates and polishing slurry |
| EP2717297B1 (en) * | 2011-05-24 | 2016-07-27 | Kuraray Co., Ltd. | Erosion inhibitor for chemical mechanical polishing, slurry for chemical mechanical polishing, and chemical mechanical polishing method |
| JP5882024B2 (ja) * | 2011-11-01 | 2016-03-09 | 花王株式会社 | 研磨液組成物 |
| US8703004B2 (en) * | 2011-11-14 | 2014-04-22 | Kabushiki Kaisha Toshiba | Method for chemical planarization and chemical planarization apparatus |
| US9443796B2 (en) * | 2013-03-15 | 2016-09-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Air trench in packages incorporating hybrid bonding |
| US9388328B2 (en) * | 2013-08-23 | 2016-07-12 | Diamond Innovations, Inc. | Lapping slurry having a cationic surfactant |
| TWI673357B (zh) * | 2016-12-14 | 2019-10-01 | 美商卡博特微電子公司 | 自化學機械平坦化基板移除殘留物之組合物及方法 |
| CN107189695A (zh) * | 2017-04-15 | 2017-09-22 | 浙江晶圣美纳米科技有限公司 | 一种可有效应用于不锈钢衬底化学机械抛光工艺的抛光液 |
| EP4103663A4 (en) * | 2020-02-13 | 2023-08-23 | Fujifilm Electronic Materials U.S.A., Inc. | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF |
| WO2022145654A1 (ko) * | 2020-12-30 | 2022-07-07 | 에스케이씨솔믹스 주식회사 | 반도체 공정용 연마 조성물, 연마 조성물의 제조 방법 및 연마 조성물을 적용한 반도체 소자의 제조 방법 |
| US20230087984A1 (en) * | 2021-09-23 | 2023-03-23 | Cmc Materials, Inc. | Silica-based slurry compositions containing high molecular weight polymers for use in cmp of dielectrics |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100610387B1 (ko) * | 1998-05-18 | 2006-08-09 | 말린크로트 베이커, 인코포레이티드 | 초소형 전자 기판 세정용 실리케이트 함유 알칼리성 조성물 |
| TWI314950B (en) * | 2001-10-31 | 2009-09-21 | Hitachi Chemical Co Ltd | Polishing slurry and polishing method |
| JP2004247605A (ja) * | 2003-02-14 | 2004-09-02 | Toshiba Corp | Ｃｍｐ用スラリーおよび半導体装置の製造方法 |
| US20050205835A1 (en) * | 2004-03-19 | 2005-09-22 | Tamboli Dnyanesh C | Alkaline post-chemical mechanical planarization cleaning compositions |
| JP2006066874A (ja) * | 2004-07-27 | 2006-03-09 | Asahi Denka Kogyo Kk | Ｃｍｐ用研磨組成物および研磨方法 |
| US20060046465A1 (en) * | 2004-08-27 | 2006-03-02 | Dongbuanam Semiconductor Inc. | Method for manufacturing a semiconductor device |
| KR100645957B1 (ko) * | 2004-10-26 | 2006-11-14 | 삼성코닝 주식회사 | Ｃｍｐ용 수성 슬러리 조성물 |
-
2007
- 2007-12-27 JP JP2007337248A patent/JP2009158810A/ja active Pending
-
2008
- 2008-12-19 US US12/339,435 patent/US20090176372A1/en not_active Abandoned