JP2009142817A - ウエハ状の物品を液体処理するための装置及び方法 - Google Patents
ウエハ状の物品を液体処理するための装置及び方法 Download PDFInfo
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- JP2009142817A JP2009142817A JP2009062516A JP2009062516A JP2009142817A JP 2009142817 A JP2009142817 A JP 2009142817A JP 2009062516 A JP2009062516 A JP 2009062516A JP 2009062516 A JP2009062516 A JP 2009062516A JP 2009142817 A JP2009142817 A JP 2009142817A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Abstract
【解決手段】 洗浄ガスの大部分をウエハ状の物品(W)の縁部領域でウエハ状の物品(W)から導き出すガス排出装置(4)が周囲に設けられ、また、第2の主面上の液体が縁部付近の所定の部分を濡らし、続いて、液体がウエハ状の物品(W)から除去される。
【選択図】 図1
Description
処理するための方法である。この方法では、液体は液体供給源(Fluessigkeitsquelle)に向いた第1の表面に塗布される。液体は、ほぼ半径方向外側に、ウエハ状の物品の周囲の縁部(ウエハの縁部)の方へ流れ、この縁部を回って、液体供給源から離隔している第2の表面に流れる。この液体は、第2の表面で、縁部付近の所定の部分を濡らし、続いて、ウエハ状の物品から除去される。
ちガス排出装置4は、ウエハWの外径よりも小さい内径と、ウエハWの外径よりも大きな外径とを有する。
3 基体
10 ギャップ
14 面
25 ガイドエレメント
W ウエハ
Claims (18)
- ウエハ状の物品を支持するための支持手段と、前記ウエハ状の物品の、前記支持手段に向いた面を少なくとも部分的にガスで洗浄するためのガス供給手段とを具備する、ウエハ状の物品の前記支持手段に向いた面の縁部付近を液体処理するための装置において、
洗浄ガスの大部分を前記ウエハ状の物品の縁部領域で前記ウエハ状の物品から離れるように排出するガス排出装置が周囲に設けられており、前記ガス排出装置の内周面は鋭角な縁部を有していること、を特徴とする装置。 - 前記ガス排出装置はリングの形状を有する、請求項1に記載の装置。
- 前記リング形状のガス排出装置は、前記ウエハ状の物品の外径よりも小さい内径と、前記ウエハ状の物品の外径と少なくとも同じ大きさの外径とを有する、請求項2に記載の装置。
- 前記ガス排出装置は、前記支持手段の周囲に対し同軸な環状の溝を有し、この溝からはガスが外へ排出される、請求項1に記載の装置。
- 前記支持手段のうちの、前記ガス供給手段と前記ガス排出装置との間にある部分は、前記ガス排出装置が前記ウエハ状の物品から間隔をあけているよりも、前記ウエハ状の物品から大きな間隔をあけている、請求項1に記載の装置。
- 前記ガス排出装置は、前記ウエハ状の物品に接触しない、請求項5に記載の装置。
- 前記ガス排出装置と前記ウエハ状の物品との間のギャップは0.05乃至1mmである、請求項6に記載の装置。
- 前記ギャップは0.1乃至0.5mmである、請求項7に記載の装置。
- 前記ガス排出装置の、前記ウエハ状の物品に向いた面は、前記ウエハ状の物品の主面に対し平行である、請求項6に記載の装置。
- 前記支持手段に直角に設けられており、かつ前記ウエハ状の物品の位置を周囲に区画する少なくとも2つのガイドエレメントを具備する、請求項1に記載の装置。
- 前記ガス供給手段は、前記ウエハ状の物品を浮動させるガスクッションを生起する、請求項10に記載の装置。
- 前記支持手段は回転されることができる、請求項1に記載の装置。
- 請求項1の装置を使用してウエハ状の物品の縁部付近の所定の領域を液体処理するための方法であって、
ウエハ状の物品を支持手段の上に置き、ただし該ウエハ状の物品は支持手段に向いた第2の面、第2の面とは反対側の第1の面および第2の面と第1の面との間の周囲縁を有し、上記した所定の領域は該第2の面の縁部付近である、
支持手段の周囲に環状のガス排出装置を設け、
ウエハ状の物品の第2の面とガス排出装置との間にギャップを設け、ただし該ギャップは上記の周囲縁から半径方向内側へ向かって上記した所定の領域に略々一致して広がっている、
液体を適用し、
毛管現象によって液体をギャップ内に吸引してギャップを満たし、上記した所定の領域を液体で濡らすことによって処理する、
ことを特徴とする方法。 - 前記縁部領域は2mmより大きい、請求項13に記載の方法。
- 前記ウエハ状の物品は液体処理中に軸線を中心として回転する、請求項13に記載の方法。
- 回転速度は少なくとも100回/分である、請求項15に記載の方法。
- 前記ガス排出装置と前記ウエハ状の物品との間のギャップは0.05乃至1mmである、請求項13に記載の方法。
- 前記ギャップは0.1乃至0.5mmである、請求項17に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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EP99108319.7 | 1999-04-28 | ||
EP99108319A EP1052682B1 (de) | 1999-04-28 | 1999-04-28 | Vorrichtung und Verfahren zur Flüssigkeitsbehandlung von scheibenförmigen Gegenständen |
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JP2000118470A Division JP4346207B2 (ja) | 1999-04-28 | 2000-04-19 | ウエハ状の物品を液体処理するための装置及び方法 |
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JP2009142817A true JP2009142817A (ja) | 2009-07-02 |
JP4884493B2 JP4884493B2 (ja) | 2012-02-29 |
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JP2000118470A Expired - Lifetime JP4346207B2 (ja) | 1999-04-28 | 2000-04-19 | ウエハ状の物品を液体処理するための装置及び方法 |
JP2009062518A Expired - Lifetime JP4884494B2 (ja) | 1999-04-28 | 2009-03-16 | ウエハ状の物品をウエットエッチングするための装置及び方法 |
JP2009062516A Expired - Lifetime JP4884493B2 (ja) | 1999-04-28 | 2009-03-16 | ウエハ状の物品を液体処理するための装置及び方法 |
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JP2000118470A Expired - Lifetime JP4346207B2 (ja) | 1999-04-28 | 2000-04-19 | ウエハ状の物品を液体処理するための装置及び方法 |
JP2009062518A Expired - Lifetime JP4884494B2 (ja) | 1999-04-28 | 2009-03-16 | ウエハ状の物品をウエットエッチングするための装置及び方法 |
Country Status (8)
Country | Link |
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US (5) | US6435200B1 (ja) |
EP (1) | EP1052682B1 (ja) |
JP (3) | JP4346207B2 (ja) |
KR (1) | KR100675260B1 (ja) |
AT (1) | ATE211855T1 (ja) |
DE (1) | DE59900743D1 (ja) |
SG (1) | SG98382A1 (ja) |
TW (1) | TW518638B (ja) |
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Also Published As
Publication number | Publication date |
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US7726323B2 (en) | 2010-06-01 |
US7007702B2 (en) | 2006-03-07 |
EP1052682A1 (de) | 2000-11-15 |
TW518638B (en) | 2003-01-21 |
US20040020427A1 (en) | 2004-02-05 |
US20060144429A1 (en) | 2006-07-06 |
JP4346207B2 (ja) | 2009-10-21 |
JP2000343054A (ja) | 2000-12-12 |
EP1052682B1 (de) | 2002-01-09 |
US20080066865A1 (en) | 2008-03-20 |
US7267129B2 (en) | 2007-09-11 |
US6858092B2 (en) | 2005-02-22 |
US20020148489A1 (en) | 2002-10-17 |
KR20010014780A (ko) | 2001-02-26 |
KR100675260B1 (ko) | 2007-01-29 |
ATE211855T1 (de) | 2002-01-15 |
JP2009142818A (ja) | 2009-07-02 |
US6435200B1 (en) | 2002-08-20 |
JP4884493B2 (ja) | 2012-02-29 |
SG98382A1 (en) | 2003-09-19 |
JP4884494B2 (ja) | 2012-02-29 |
DE59900743D1 (de) | 2002-02-28 |
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