JP2009123736A - デバイスの実装構造及びデバイスの実装方法 - Google Patents

デバイスの実装構造及びデバイスの実装方法 Download PDF

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Publication number
JP2009123736A
JP2009123736A JP2007293062A JP2007293062A JP2009123736A JP 2009123736 A JP2009123736 A JP 2009123736A JP 2007293062 A JP2007293062 A JP 2007293062A JP 2007293062 A JP2007293062 A JP 2007293062A JP 2009123736 A JP2009123736 A JP 2009123736A
Authority
JP
Japan
Prior art keywords
wiring board
mounting structure
heat radiating
radiating plate
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007293062A
Other languages
English (en)
Japanese (ja)
Inventor
Masahiro Tamura
政裕 田村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2007293062A priority Critical patent/JP2009123736A/ja
Priority to TW097140144A priority patent/TWI377886B/zh
Priority to EP08167814A priority patent/EP2063455A3/en
Priority to US12/263,853 priority patent/US7929312B2/en
Priority to CN200810171817.XA priority patent/CN101437364B/zh
Publication of JP2009123736A publication Critical patent/JP2009123736A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2007293062A 2007-11-12 2007-11-12 デバイスの実装構造及びデバイスの実装方法 Pending JP2009123736A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007293062A JP2009123736A (ja) 2007-11-12 2007-11-12 デバイスの実装構造及びデバイスの実装方法
TW097140144A TWI377886B (en) 2007-11-12 2008-10-20 Device mounting structure and device mounting method
EP08167814A EP2063455A3 (en) 2007-11-12 2008-10-29 Device mounting structure and device mounting method
US12/263,853 US7929312B2 (en) 2007-11-12 2008-11-03 Device mounting structure and device mounting method
CN200810171817.XA CN101437364B (zh) 2007-11-12 2008-11-12 器件安装结构和器件安装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007293062A JP2009123736A (ja) 2007-11-12 2007-11-12 デバイスの実装構造及びデバイスの実装方法

Publications (1)

Publication Number Publication Date
JP2009123736A true JP2009123736A (ja) 2009-06-04

Family

ID=40348064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007293062A Pending JP2009123736A (ja) 2007-11-12 2007-11-12 デバイスの実装構造及びデバイスの実装方法

Country Status (5)

Country Link
US (1) US7929312B2 (zh)
EP (1) EP2063455A3 (zh)
JP (1) JP2009123736A (zh)
CN (1) CN101437364B (zh)
TW (1) TWI377886B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101015735B1 (ko) * 2009-07-02 2011-02-22 삼성전기주식회사 세라믹 적층체 모듈 및 그 제조방법
JP2018506860A (ja) * 2015-02-15 2018-03-08 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． パワーアンプに係る電力管の接続構造およびパワーアンプ
WO2020202954A1 (ja) * 2019-04-01 2020-10-08 住友電気工業株式会社 電子部品の実装構造、及び電子部品の実装構造の製造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080284690A1 (en) * 2007-05-18 2008-11-20 Sam Min Ko Organic light emitting display device
KR101030991B1 (ko) * 2008-12-31 2011-04-22 삼성에스디아이 주식회사 반도체 패키지의 장착구조 및 이를 적용한 플라즈마 디스플레이 장치
JP5189616B2 (ja) * 2010-04-15 2013-04-24 三菱電機株式会社 半導体装置
US8391009B2 (en) * 2010-06-18 2013-03-05 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipating assembly
KR101077378B1 (ko) 2010-06-23 2011-10-26 삼성전기주식회사 방열기판 및 그 제조방법
US20130170136A1 (en) * 2011-12-31 2013-07-04 Joshua L. Roby Pcb heat sink for power electronics
JP2016119798A (ja) * 2014-12-22 2016-06-30 株式会社オートネットワーク技術研究所 回路構成体及び電気接続箱
WO2018063171A1 (en) * 2016-09-28 2018-04-05 Intel Corporation Thermal conductivity for integrated circuit packaging
CN108924393B (zh) * 2018-07-13 2020-11-27 北京大恒图像视觉有限公司 一种大靶面图像传感器的散热结构

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48108152U (zh) * 1972-03-13 1973-12-14
JPS6413146U (zh) * 1987-07-09 1989-01-24
JPH0669389A (ja) * 1992-08-20 1994-03-11 Fujitsu Ltd 半導体装置の取り付け構造とその取り付け方法
JPH0732977U (ja) * 1993-11-22 1995-06-16 リズム時計工業株式会社 半導体基板の部品装着構造
JPH0945814A (ja) * 1995-07-31 1997-02-14 Nec Corp 半導体装置
JP2002510881A (ja) * 1998-04-03 2002-04-09 エリクソン インコーポレイテッド 集積回路パッケージをヒートシンクに固定する容量性取付け装置
JP2002232170A (ja) * 2001-01-30 2002-08-16 Densei Lambda Kk プリント基板と放熱板との接続構造
JP2002290084A (ja) * 2001-03-26 2002-10-04 Densei Lambda Kk 電子部品の放熱板
JP2006073763A (ja) * 2004-09-01 2006-03-16 Denso Corp 多層基板の製造方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3784884A (en) * 1972-11-03 1974-01-08 Motorola Inc Low parasitic microwave package
US3943556A (en) * 1973-07-30 1976-03-09 Motorola, Inc. Method of making a high frequency semiconductor package
US3946428A (en) * 1973-09-19 1976-03-23 Nippon Electric Company, Limited Encapsulation package for a semiconductor element
JPS5386576A (en) * 1977-01-10 1978-07-31 Nec Corp Package for semiconductor element
WO1992022090A1 (en) * 1991-06-03 1992-12-10 Motorola, Inc. Thermally conductive electronic assembly
GB2258563B (en) * 1991-08-09 1995-01-11 Motorola Ltd Transistor mounting apparatus
JP2772184B2 (ja) * 1991-11-07 1998-07-02 株式会社東芝 半導体装置
JPH0714949A (ja) 1993-06-18 1995-01-17 Mitsubishi Electric Corp 半導体モジュール
JPH08264910A (ja) 1995-03-22 1996-10-11 Yokohama Teikouki Kk 放熱板付きプリント配線板の作製方法及びプリント配線板へのハイパワー部品の実装方法
JPH09139450A (ja) 1995-11-13 1997-05-27 Sony Corp ヒートシンクの固定方法
JP2711825B2 (ja) 1996-02-26 1998-02-10 五洋電子工業株式会社 パワートランジスタの実装方法
CN1206326A (zh) * 1997-07-23 1999-01-27 夏普公司 包括具有热隔离部分的印刷电路板的电路底板
JP3923703B2 (ja) * 2000-03-29 2007-06-06 ローム株式会社 放熱手段を有するプリント配線板
JP2003188461A (ja) 2001-12-19 2003-07-04 Pentax Corp 半導体レーザ駆動装置
JP2003289118A (ja) 2002-03-28 2003-10-10 Hitachi Kokusai Electric Inc ヒートシンクを有する基板への実装構造
JP2004087594A (ja) * 2002-08-23 2004-03-18 Alps Electric Co Ltd 電子回路ユニットの放熱構造
JP4340103B2 (ja) * 2002-09-12 2009-10-07 株式会社リコー ねじ締結構造
JP2004214249A (ja) * 2002-12-27 2004-07-29 Renesas Technology Corp 半導体モジュール
TW588445B (en) * 2003-03-25 2004-05-21 Advanced Semiconductor Eng Bumpless chip package
JP2004356492A (ja) * 2003-05-30 2004-12-16 Toshiba Corp 電子機器
JP2007293062A (ja) 2006-04-26 2007-11-08 Mitsubishi Electric Corp 携帯表示装置
DE202006016349U1 (de) * 2006-10-23 2007-01-11 Hanning Elektro-Werke Gmbh & Co. Kg Elektromotorischer Antrieb
JP4729001B2 (ja) * 2007-05-28 2011-07-20 株式会社東芝 プリント配線板構造、プリント配線板の部品実装方法および電子機器

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48108152U (zh) * 1972-03-13 1973-12-14
JPS6413146U (zh) * 1987-07-09 1989-01-24
JPH0669389A (ja) * 1992-08-20 1994-03-11 Fujitsu Ltd 半導体装置の取り付け構造とその取り付け方法
JPH0732977U (ja) * 1993-11-22 1995-06-16 リズム時計工業株式会社 半導体基板の部品装着構造
JPH0945814A (ja) * 1995-07-31 1997-02-14 Nec Corp 半導体装置
JP2002510881A (ja) * 1998-04-03 2002-04-09 エリクソン インコーポレイテッド 集積回路パッケージをヒートシンクに固定する容量性取付け装置
JP2002232170A (ja) * 2001-01-30 2002-08-16 Densei Lambda Kk プリント基板と放熱板との接続構造
JP2002290084A (ja) * 2001-03-26 2002-10-04 Densei Lambda Kk 電子部品の放熱板
JP2006073763A (ja) * 2004-09-01 2006-03-16 Denso Corp 多層基板の製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101015735B1 (ko) * 2009-07-02 2011-02-22 삼성전기주식회사 세라믹 적층체 모듈 및 그 제조방법
US8307546B2 (en) 2009-07-02 2012-11-13 Samsung Electro-Mechanics Co., Ltd. Method for manufacturing a ceramic elements module
US9374885B2 (en) 2009-07-02 2016-06-21 Samsung Electro-Mechanics Co., Ltd. Ceramic elements module
JP2018506860A (ja) * 2015-02-15 2018-03-08 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． パワーアンプに係る電力管の接続構造およびパワーアンプ
US10165687B2 (en) 2015-02-15 2018-12-25 Huawei Technologies Co., Ltd. Power tube connection structure of power amplifier and power amplifier
US10426036B2 (en) 2015-02-15 2019-09-24 Huawei Technologies Co., Ltd. Power tube connection structure of power amplifier and power amplifier
WO2020202954A1 (ja) * 2019-04-01 2020-10-08 住友電気工業株式会社 電子部品の実装構造、及び電子部品の実装構造の製造方法

Also Published As

Publication number Publication date
EP2063455A3 (en) 2009-09-09
EP2063455A2 (en) 2009-05-27
CN101437364B (zh) 2014-04-09
US7929312B2 (en) 2011-04-19
TWI377886B (en) 2012-11-21
TW200922418A (en) 2009-05-16
CN101437364A (zh) 2009-05-20
US20090122495A1 (en) 2009-05-14

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