JP2009096865A5 - - Google Patents

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Publication number
JP2009096865A5
JP2009096865A5 JP2007269034A JP2007269034A JP2009096865A5 JP 2009096865 A5 JP2009096865 A5 JP 2009096865A5 JP 2007269034 A JP2007269034 A JP 2007269034A JP 2007269034 A JP2007269034 A JP 2007269034A JP 2009096865 A5 JP2009096865 A5 JP 2009096865A5
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JP
Japan
Prior art keywords
acetate
diethylene glycol
ether acetate
solvent
present composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007269034A
Other languages
English (en)
Japanese (ja)
Other versions
JP5422109B2 (ja
JP2009096865A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2007269034A external-priority patent/JP5422109B2/ja
Priority to JP2007269034A priority Critical patent/JP5422109B2/ja
Priority to TW097137993A priority patent/TW200934826A/zh
Priority to KR1020107008091A priority patent/KR20100083146A/ko
Priority to AT08839384T priority patent/ATE514751T1/de
Priority to US12/738,463 priority patent/US8563666B2/en
Priority to CN2008801117570A priority patent/CN101827891B/zh
Priority to PCT/JP2008/068516 priority patent/WO2009051084A2/en
Priority to EP08839384A priority patent/EP2201068B1/en
Publication of JP2009096865A publication Critical patent/JP2009096865A/ja
Publication of JP2009096865A5 publication Critical patent/JP2009096865A5/ja
Publication of JP5422109B2 publication Critical patent/JP5422109B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007269034A 2007-10-16 2007-10-16 硬化性シリコーン組成物およびその硬化物 Expired - Fee Related JP5422109B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2007269034A JP5422109B2 (ja) 2007-10-16 2007-10-16 硬化性シリコーン組成物およびその硬化物
TW097137993A TW200934826A (en) 2007-10-16 2008-10-02 Curable silicone composition and cured product thereof
PCT/JP2008/068516 WO2009051084A2 (en) 2007-10-16 2008-10-06 Curable silicone composition and cured product thereof
AT08839384T ATE514751T1 (de) 2007-10-16 2008-10-06 Härtbare silikonzusammensetzung und gehärtetes produkt daraus
US12/738,463 US8563666B2 (en) 2007-10-16 2008-10-06 Curable silicone composition and cured product thereof
CN2008801117570A CN101827891B (zh) 2007-10-16 2008-10-06 可固化的硅氧烷组合物及其固化产物
KR1020107008091A KR20100083146A (ko) 2007-10-16 2008-10-06 경화성 실리콘 조성물 및 이의 경화물
EP08839384A EP2201068B1 (en) 2007-10-16 2008-10-06 Curable silicone composition and cured product thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007269034A JP5422109B2 (ja) 2007-10-16 2007-10-16 硬化性シリコーン組成物およびその硬化物

Publications (3)

Publication Number Publication Date
JP2009096865A JP2009096865A (ja) 2009-05-07
JP2009096865A5 true JP2009096865A5 (enExample) 2010-11-25
JP5422109B2 JP5422109B2 (ja) 2014-02-19

Family

ID=40567912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007269034A Expired - Fee Related JP5422109B2 (ja) 2007-10-16 2007-10-16 硬化性シリコーン組成物およびその硬化物

Country Status (8)

Country Link
US (1) US8563666B2 (enExample)
EP (1) EP2201068B1 (enExample)
JP (1) JP5422109B2 (enExample)
KR (1) KR20100083146A (enExample)
CN (1) CN101827891B (enExample)
AT (1) ATE514751T1 (enExample)
TW (1) TW200934826A (enExample)
WO (1) WO2009051084A2 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5547369B2 (ja) * 2007-09-28 2014-07-09 東レ・ダウコーニング株式会社 硬化性液状エポキシ樹脂組成物およびその硬化物
US20130146118A1 (en) * 2011-12-12 2013-06-13 Dow Corning Corporation Silicone Junction Box and Assemblies
US9663664B2 (en) * 2013-02-27 2017-05-30 Asahi Rubber Inc. Ink for white reflective film, powder coating material for white reflective film, production method of white reflective film, white reflective film, light source mount, and lighting device shade
CN105122496B (zh) * 2013-03-25 2018-01-19 大日本印刷株式会社 电池用包装材料
CN103333463A (zh) * 2013-06-26 2013-10-02 苏州天脉导热科技有限公司 一种导热母粒的制备方法
WO2016098305A1 (ja) * 2014-12-18 2016-06-23 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、その硬化物、および硬化皮膜の形成方法
CN104774470B (zh) * 2015-03-25 2017-07-07 清华大学深圳研究生院 一种用于大功率led的密封剂及大功率led
JP6736844B2 (ja) * 2015-07-16 2020-08-05 凸版印刷株式会社 化粧シート及び化粧板
CN108292113B (zh) * 2015-11-30 2020-09-25 住友理工株式会社 电子照相设备用弹性辊及其制造方法
JP6847597B2 (ja) * 2016-06-22 2021-03-24 株式会社ダイセル シルセスキオキサン
JP6610491B2 (ja) * 2016-10-03 2019-11-27 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
WO2019023840A1 (en) * 2017-07-31 2019-02-07 Dow Global Technologies Llc GLACIOPHOBIC COATINGS
US11326059B2 (en) 2017-09-07 2022-05-10 Dow Global Technologies Llc Thermally conductive ice-phobic coatings
CN108276777A (zh) * 2018-01-23 2018-07-13 苏州矽美科导热科技有限公司 一种高弹力导热硅胶片及其制备方法
CN118782556A (zh) 2018-02-16 2024-10-15 株式会社力森诺科 导热片及使用了导热片的散热装置
CN108727831A (zh) * 2018-05-23 2018-11-02 湖南博隽生物医药有限公司 一种医用抗菌硅胶材料及其制备方法
EP4249461A4 (en) * 2020-11-20 2024-11-20 Shin-Etsu Chemical Co., Ltd. Phenol compound, electroconductive paste composition, method for producing electroconductive paste composition, and electroconductive wiring line and production method therefor

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3367964B2 (ja) 1992-04-21 2003-01-20 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
JP3786139B2 (ja) 1992-05-26 2006-06-14 東レ・ダウコーニング株式会社 硬化性シリコーン組成物
JP2705519B2 (ja) 1993-02-26 1998-01-28 松下電工株式会社 液状エポキシ樹脂組成物
EP0620242B1 (en) * 1993-04-15 1998-08-19 Dow Corning Toray Silicone Company, Limited Epoxy group-containing silicone resin and compositions based thereon
JP3466239B2 (ja) 1993-08-18 2003-11-10 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
US6140445A (en) * 1998-04-17 2000-10-31 Crompton Corporation Silane functional oligomer
JP3773022B2 (ja) 1999-02-12 2006-05-10 信越化学工業株式会社 フリップチップ型半導体装置
US6225704B1 (en) 1999-02-12 2001-05-01 Shin-Etsu Chemical Co., Ltd. Flip-chip type semiconductor device
JP4019254B2 (ja) * 2002-04-24 2007-12-12 信越化学工業株式会社 導電性樹脂組成物
JP2004352947A (ja) * 2003-05-30 2004-12-16 Shin Etsu Chem Co Ltd 室温硬化型熱伝導性シリコーンゴム組成物
TWI345576B (en) * 2003-11-07 2011-07-21 Dow Corning Toray Silicone Curable silicone composition and cured product thereof
JP5166677B2 (ja) 2005-03-15 2013-03-21 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5004433B2 (ja) 2005-04-27 2012-08-22 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
JP5217119B2 (ja) * 2005-06-15 2013-06-19 日立化成株式会社 封止用液状エポキシ樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ
JP5207591B2 (ja) 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP5285846B2 (ja) * 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5248012B2 (ja) 2006-12-25 2013-07-31 東レ・ダウコーニング株式会社 硬化性シリコーン組成物

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