JP2007197627A5 - - Google Patents

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Publication number
JP2007197627A5
JP2007197627A5 JP2006020431A JP2006020431A JP2007197627A5 JP 2007197627 A5 JP2007197627 A5 JP 2007197627A5 JP 2006020431 A JP2006020431 A JP 2006020431A JP 2006020431 A JP2006020431 A JP 2006020431A JP 2007197627 A5 JP2007197627 A5 JP 2007197627A5
Authority
JP
Japan
Prior art keywords
thiol
resin composition
epoxy resin
component
optical semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006020431A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007197627A (ja
JP4890872B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2006020431A external-priority patent/JP4890872B2/ja
Priority to JP2006020431A priority Critical patent/JP4890872B2/ja
Priority to KR1020070009620A priority patent/KR100858967B1/ko
Priority to US11/668,974 priority patent/US7880279B2/en
Priority to TW096103305A priority patent/TWI355393B/zh
Priority to CN2007100047915A priority patent/CN101012330B/zh
Publication of JP2007197627A publication Critical patent/JP2007197627A/ja
Publication of JP2007197627A5 publication Critical patent/JP2007197627A5/ja
Publication of JP4890872B2 publication Critical patent/JP4890872B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006020431A 2006-01-30 2006-01-30 光半導体封止用透明エポキシ樹脂組成物及びそれを用いた光半導体集積回路装置 Active JP4890872B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006020431A JP4890872B2 (ja) 2006-01-30 2006-01-30 光半導体封止用透明エポキシ樹脂組成物及びそれを用いた光半導体集積回路装置
CN2007100047915A CN101012330B (zh) 2006-01-30 2007-01-30 光学半导体封止用透明环氧树脂组合物和使用该组合物的光学半导体集成电路器件
US11/668,974 US7880279B2 (en) 2006-01-30 2007-01-30 Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the same
TW096103305A TWI355393B (en) 2006-01-30 2007-01-30 Transparent epoxy resin composition for molding op
KR1020070009620A KR100858967B1 (ko) 2006-01-30 2007-01-30 광반도체를 성형하기 위한 투명 에폭시 수지 조성물과 이것을 사용한 광반도체 집적회로장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006020431A JP4890872B2 (ja) 2006-01-30 2006-01-30 光半導体封止用透明エポキシ樹脂組成物及びそれを用いた光半導体集積回路装置

Publications (3)

Publication Number Publication Date
JP2007197627A JP2007197627A (ja) 2007-08-09
JP2007197627A5 true JP2007197627A5 (enExample) 2009-02-26
JP4890872B2 JP4890872B2 (ja) 2012-03-07

Family

ID=38333156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006020431A Active JP4890872B2 (ja) 2006-01-30 2006-01-30 光半導体封止用透明エポキシ樹脂組成物及びそれを用いた光半導体集積回路装置

Country Status (5)

Country Link
US (1) US7880279B2 (enExample)
JP (1) JP4890872B2 (enExample)
KR (1) KR100858967B1 (enExample)
CN (1) CN101012330B (enExample)
TW (1) TWI355393B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5105974B2 (ja) * 2007-07-03 2012-12-26 日東電工株式会社 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
CN101681010A (zh) * 2007-07-03 2010-03-24 柯尼卡美能达精密光学株式会社 摄影装置的制造方法、摄影装置以及光学元件
DE102008024704A1 (de) 2008-04-17 2009-10-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils
US10431567B2 (en) 2010-11-03 2019-10-01 Cree, Inc. White ceramic LED package
KR100999746B1 (ko) 2009-02-17 2010-12-08 엘지이노텍 주식회사 발광 디바이스 패키지 및 그 제조방법
JP5619466B2 (ja) * 2010-04-13 2014-11-05 デクセリアルズ株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、ダイボンド剤、非導電性ペースト、接着性エポキシ樹脂フィルム、非導電性エポキシ樹脂フィルム、異方性導電ペースト及び異方性導電フィルム
JP5874633B2 (ja) * 2010-05-28 2016-03-02 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物の製造方法およびこれを用いる半導体装置の製造方法
US9831393B2 (en) 2010-07-30 2017-11-28 Cree Hong Kong Limited Water resistant surface mount device package
DE102010046122A1 (de) * 2010-09-21 2012-03-22 Osram Opto Semiconductors Gmbh Elektronisches Bauelement
KR101295705B1 (ko) 2011-04-25 2013-08-16 도레이첨단소재 주식회사 투명 플라스틱기판용 페녹시수지 조성물 및 이를 이용한 투명 플라스틱 기판소재
JP5748611B2 (ja) * 2011-08-22 2015-07-15 京セラ株式会社 発光装置
TWI444132B (zh) * 2011-12-08 2014-07-01 Ind Tech Res Inst 電磁波屏蔽複合膜及具有該複合膜之軟性印刷電路板
US9711489B2 (en) 2013-05-29 2017-07-18 Cree Huizhou Solid State Lighting Company Limited Multiple pixel surface mount device package
CN103627141B (zh) * 2013-11-27 2016-01-20 北京石油化工学院 Led注压成型封装用透明树脂组合物
JP6924276B2 (ja) * 2017-12-06 2021-08-25 三井化学株式会社 光学材料用重合性組成物、成形体、光学材料、プラスチックレンズおよびその製造方法
JP7604138B2 (ja) 2020-06-03 2024-12-23 日東電工株式会社 光半導体封止用樹脂成形物
WO2025033099A1 (ja) * 2023-08-04 2025-02-13 ローム株式会社 半導体装置

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DE3666442D1 (en) * 1985-04-02 1989-11-23 Ciba Geigy Ag Curable compositions
JPS6361017A (ja) * 1986-08-29 1988-03-17 Sumitomo Chem Co Ltd 液状エポキシ封止材
US5120803A (en) * 1988-09-07 1992-06-09 Mitsui Toatsu Chemicals, Inc. Resin compositions for sealing semiconductor
JP2541015B2 (ja) * 1990-12-11 1996-10-09 信越化学工業株式会社 半導体装置封止用エポキシ樹脂組成物及び半導体装置
JPH053269A (ja) * 1991-06-25 1993-01-08 Sumitomo Bakelite Co Ltd 樹脂組成物
US5969414A (en) * 1994-05-25 1999-10-19 Advanced Technology Interconnect Incorporated Semiconductor package with molded plastic body
JPH09208805A (ja) * 1994-11-09 1997-08-12 Nitto Denko Corp 光半導体素子封止用エポキシ樹脂組成物
DE19639025C2 (de) * 1996-09-23 1999-10-28 Siemens Ag Chipmodul und Verfahren zur Herstellung eines Chipmoduls
US6204311B1 (en) * 1998-03-13 2001-03-20 Mitsui Chemicals, Inc. Polymerizable composition
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US6187836B1 (en) * 1998-06-05 2001-02-13 3M Innovative Properties Company Compositions featuring cationically active and free radically active functional groups, and methods for polymerizing such compositions
JP2001055431A (ja) * 1999-08-19 2001-02-27 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
CN1232515C (zh) * 2000-03-31 2005-12-21 亨凯尔公司 包含环氧乙烷或硫杂丙环的树脂和固化剂的可再加工的组合物
JP2002299540A (ja) * 2001-04-04 2002-10-11 Hitachi Ltd 半導体装置およびその製造方法
JP2002353518A (ja) 2001-05-28 2002-12-06 Nitto Denko Corp 光半導体装置
JP2003046034A (ja) 2001-07-31 2003-02-14 Nec Kagobutsu Device Kk 樹脂封止型半導体装置
JP2003204027A (ja) * 2002-01-09 2003-07-18 Matsushita Electric Ind Co Ltd リードフレーム及びその製造方法、樹脂封止型半導体装置及びその製造方法
JP2003268200A (ja) * 2002-03-15 2003-09-25 Nitto Denko Corp 光半導体封止用透明エポキシ樹脂組成物およびそれを用いた光半導体装置
US7108914B2 (en) * 2002-07-15 2006-09-19 Motorola, Inc. Self-healing polymer compositions
JP2004257950A (ja) * 2003-02-27 2004-09-16 Denso Corp 半導体圧力センサ
JP2005075915A (ja) 2003-08-29 2005-03-24 New Japan Chem Co Ltd エポキシ樹脂用硬化剤組成物及びそれを含有するエポキシ樹脂組成物
JP2005264040A (ja) * 2004-03-19 2005-09-29 Sumitomo Bakelite Co Ltd 金型離型回復樹脂組成物
JP2005290111A (ja) * 2004-03-31 2005-10-20 Kyocera Chemical Corp 封止用樹脂組成物および半導体装置
WO2005118665A1 (en) * 2004-06-02 2005-12-15 Reichhold, Inc. Impact resistant, low shrinkage reinforced molding compositions
TWI280673B (en) * 2004-09-22 2007-05-01 Sharp Kk Optical semiconductor device, optical communication device, and electronic equipment

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