JP2009051876A - コーティング組成物及びそれを使用した物品 - Google Patents

コーティング組成物及びそれを使用した物品 Download PDF

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Publication number
JP2009051876A
JP2009051876A JP2007217386A JP2007217386A JP2009051876A JP 2009051876 A JP2009051876 A JP 2009051876A JP 2007217386 A JP2007217386 A JP 2007217386A JP 2007217386 A JP2007217386 A JP 2007217386A JP 2009051876 A JP2009051876 A JP 2009051876A
Authority
JP
Japan
Prior art keywords
fluoropolymer
coating composition
solvent
article
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007217386A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009051876A5 (enExample
Inventor
Fumio Karasawa
文男 唐澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to JP2007217386A priority Critical patent/JP2009051876A/ja
Priority to CN200880103801A priority patent/CN101784622A/zh
Priority to KR1020107006285A priority patent/KR20100063083A/ko
Priority to PCT/US2008/073584 priority patent/WO2009026284A2/en
Priority to EP08798178A priority patent/EP2183329A4/en
Priority to TW097132252A priority patent/TW200920799A/zh
Publication of JP2009051876A publication Critical patent/JP2009051876A/ja
Publication of JP2009051876A5 publication Critical patent/JP2009051876A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
    • C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2007217386A 2007-08-23 2007-08-23 コーティング組成物及びそれを使用した物品 Withdrawn JP2009051876A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007217386A JP2009051876A (ja) 2007-08-23 2007-08-23 コーティング組成物及びそれを使用した物品
CN200880103801A CN101784622A (zh) 2007-08-23 2008-08-19 涂料组合物和使用此涂料组合物的制品
KR1020107006285A KR20100063083A (ko) 2007-08-23 2008-08-19 코팅 조성물 및 이를 사용하는 용품
PCT/US2008/073584 WO2009026284A2 (en) 2007-08-23 2008-08-19 Coating composition and article using the same
EP08798178A EP2183329A4 (en) 2007-08-23 2008-08-19 COATING COMPOSITION AND PRODUCT THEREOF
TW097132252A TW200920799A (en) 2007-08-23 2008-08-22 Coating composition and article using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007217386A JP2009051876A (ja) 2007-08-23 2007-08-23 コーティング組成物及びそれを使用した物品

Publications (2)

Publication Number Publication Date
JP2009051876A true JP2009051876A (ja) 2009-03-12
JP2009051876A5 JP2009051876A5 (enExample) 2010-09-16

Family

ID=40378954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007217386A Withdrawn JP2009051876A (ja) 2007-08-23 2007-08-23 コーティング組成物及びそれを使用した物品

Country Status (6)

Country Link
EP (1) EP2183329A4 (enExample)
JP (1) JP2009051876A (enExample)
KR (1) KR20100063083A (enExample)
CN (1) CN101784622A (enExample)
TW (1) TW200920799A (enExample)
WO (1) WO2009026284A2 (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011064861A1 (ja) * 2009-11-26 2011-06-03 Cheng Chiang-Ming 多機能照明装置
JP2011228705A (ja) * 2010-04-14 2011-11-10 Bang Ming Huang フッ素化ポリマーの表面塗膜を備えた発光ダイオードの筐体及びその発光ダイオード構造
JP2015233126A (ja) * 2014-05-09 2015-12-24 インテル・コーポレーション フレキシブルなマイクロ電子システム、および、フレキシブルなマイクロ電子システムを製造する方法
WO2018003027A1 (ja) * 2016-06-29 2018-01-04 三菱電機株式会社 表示装置および表示装置の製造方法
CN110313222A (zh) * 2017-06-15 2019-10-08 株式会社Lg化学 部分模制基板和部分模制装置和方法
WO2020022080A1 (ja) * 2018-07-27 2020-01-30 住友化学株式会社 Ｌｅｄデバイス、ｌｅｄデバイスの製造方法および積層体
JP2020191440A (ja) * 2019-05-16 2020-11-26 住友化学株式会社 電子部品及びその製造方法
WO2021153337A1 (ja) * 2020-01-30 2021-08-05 住友化学株式会社 フッ素樹脂及びその製造方法
WO2021153335A1 (ja) * 2020-01-30 2021-08-05 住友化学株式会社 電子部品及びその製造方法
WO2021153334A1 (ja) * 2020-01-29 2021-08-05 住友化学株式会社 電子部品の製造方法および電子部品
WO2021153336A1 (ja) * 2020-01-30 2021-08-05 住友化学株式会社 フッ素樹脂シート及びその製造方法
KR20220009994A (ko) 2019-05-16 2022-01-25 스미또모 가가꾸 가부시키가이샤 전자 부품의 제조 방법 및 전자 부품
KR20220009993A (ko) 2019-05-16 2022-01-25 스미또모 가가꾸 가부시키가이샤 전자 부품 및 그 제조 방법

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GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
GB2462824A (en) * 2008-08-18 2010-02-24 Crombie 123 Ltd Printed circuit board encapsulation
CN105744750B (zh) 2008-08-18 2019-06-18 赛姆布兰特有限公司 卤代烃聚合物涂层
CN102356267A (zh) * 2009-03-17 2012-02-15 皇家飞利浦电子股份有限公司 用于小型槽型字母的led灯带
US8697458B2 (en) * 2009-04-22 2014-04-15 Shat-R-Shield, Inc. Silicone coated light-emitting diode
DE102009032424A1 (de) * 2009-07-09 2011-01-13 Osram Gesellschaft mit beschränkter Haftung Leuchtvorrichtung mit einer flexiblen Leiterplatte
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
US8642702B2 (en) 2010-04-30 2014-02-04 Solvay Specialty Polymers Italy S.P.A. VDF polymer composition
US20120036750A1 (en) * 2010-08-12 2012-02-16 Sun Inno Tech Internally Illuminated Panel and Method of Making the Same
EP2428537A1 (de) * 2010-09-13 2012-03-14 Sika Technology AG Abdichtungsmembran mit verbesserter Haftung
RU2505572C2 (ru) * 2012-04-26 2014-01-27 Открытое акционерное общество "Научно-исследовательский институт приборостроения имени В.В. Тихомирова" Лаковая композиция
CN102977700B (zh) * 2012-12-28 2016-05-04 上海电缆研究所 一种全面改善架空导线性能的涂料
ITMI20130350A1 (it) * 2013-03-07 2014-09-08 Davide Zanesi Processo di stampaggio di circuiti elettronici su supporti tessili tramite tecnologia serigrafica, con l¿ utilizzo di materiale elettricamente conduttivo, termoelettrico o elettro-luminescente.
KR102237112B1 (ko) 2014-07-30 2021-04-08 엘지이노텍 주식회사 발광 소자 및 이를 구비한 광원 모듈
US9540536B2 (en) 2014-09-02 2017-01-10 E I Du Pont De Nemours And Company Heat-curable polymer paste
EP3196550B1 (en) * 2016-01-20 2018-10-24 OSRAM GmbH A method of producing lighting devices and corresponding lighting device
DE102016105407A1 (de) * 2016-03-23 2017-09-28 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer elektronischen Vorrichtung und elektronische Vorrichtung
CN109314168A (zh) * 2016-05-03 2019-02-05 霍尼韦尔国际公司 具有改善的耐化学品性的光发射器设备和部件及相关方法
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating
EP3625294B1 (en) * 2017-05-20 2025-12-10 Honeywell International Inc. Luminescent composition
KR102542925B1 (ko) * 2017-07-21 2023-06-16 더 케무어스 컴퍼니 에프씨, 엘엘씨 광가교결합성 플루오로중합체 코팅 조성물 및 그로부터 형성되는 패시베이션 층
AU2018355524B2 (en) * 2017-10-26 2020-12-10 Syed Taymur Ahmad Composition comprising non-Newtonian fluids for hydrophobic, oleophobic, and oleophilic coatings, and methods of using the same
EP3766106B1 (en) 2018-03-15 2022-01-05 Solvay Specialty Polymers Italy S.p.A. Fluoropolymer composition for components of light emitting apparatus
DE102019205064A1 (de) * 2019-04-09 2020-10-15 Conti Temic Microelectronic Gmbh Verwendung des Stoffs [P(VdF-HFP)HP] als Kühleinrichtung zur Kühlung einer Sensorvorrichtung eines Kraftfahrzeugs

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EP1297539B1 (en) * 2000-06-30 2006-03-15 3M Innovative Properties Company High-frequency electronic part comprising an insulation material and method of preparing the same
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DE602004024512D1 (de) * 2003-04-09 2010-01-21 Kuraray Co (meth)acrylharzemulsion und herstellungsverfahren dafür
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Publication number Priority date Publication date Assignee Title
WO2011064861A1 (ja) * 2009-11-26 2011-06-03 Cheng Chiang-Ming 多機能照明装置
JP2011228705A (ja) * 2010-04-14 2011-11-10 Bang Ming Huang フッ素化ポリマーの表面塗膜を備えた発光ダイオードの筐体及びその発光ダイオード構造
US10103037B2 (en) 2014-05-09 2018-10-16 Intel Corporation Flexible microelectronic systems and methods of fabricating the same
JP2015233126A (ja) * 2014-05-09 2015-12-24 インテル・コーポレーション フレキシブルなマイクロ電子システム、および、フレキシブルなマイクロ電子システムを製造する方法
CN109328378A (zh) * 2016-06-29 2019-02-12 三菱电机株式会社 显示装置及显示装置的制造方法
JPWO2018003027A1 (ja) * 2016-06-29 2018-10-18 三菱電機株式会社 表示装置および表示装置の製造方法
US10700247B2 (en) 2016-06-29 2020-06-30 Mitsubishi Electric Corporation Display device and method for manufacturing display device
WO2018003027A1 (ja) * 2016-06-29 2018-01-04 三菱電機株式会社 表示装置および表示装置の製造方法
CN110313222B (zh) * 2017-06-15 2022-04-01 株式会社Lg新能源 部分模制基板和部分模制装置和方法
CN110313222A (zh) * 2017-06-15 2019-10-08 株式会社Lg化学 部分模制基板和部分模制装置和方法
JP2020508567A (ja) * 2017-06-15 2020-03-19 エルジー・ケム・リミテッド 部分モールディング処理された基板と部分モールディング装置および方法
US10939542B2 (en) 2017-06-15 2021-03-02 Lg Chem, Ltd. Partially molded substrate and partial molding device and method
WO2020022080A1 (ja) * 2018-07-27 2020-01-30 住友化学株式会社 Ｌｅｄデバイス、ｌｅｄデバイスの製造方法および積層体
JP2020025089A (ja) * 2018-07-27 2020-02-13 住友化学株式会社 Ｌｅｄデバイス、ｌｅｄデバイスの製造方法および積層体
JP2020191440A (ja) * 2019-05-16 2020-11-26 住友化学株式会社 電子部品及びその製造方法
JP6998362B2 (ja) 2019-05-16 2022-01-18 住友化学株式会社 電子部品及びその製造方法
KR20220009994A (ko) 2019-05-16 2022-01-25 스미또모 가가꾸 가부시키가이샤 전자 부품의 제조 방법 및 전자 부품
KR20220009993A (ko) 2019-05-16 2022-01-25 스미또모 가가꾸 가부시키가이샤 전자 부품 및 그 제조 방법
WO2021153334A1 (ja) * 2020-01-29 2021-08-05 住友化学株式会社 電子部品の製造方法および電子部品
WO2021153335A1 (ja) * 2020-01-30 2021-08-05 住友化学株式会社 電子部品及びその製造方法
WO2021153336A1 (ja) * 2020-01-30 2021-08-05 住友化学株式会社 フッ素樹脂シート及びその製造方法
JP2021120434A (ja) * 2020-01-30 2021-08-19 住友化学株式会社 フッ素樹脂封止剤及びその製造方法
JP2021120433A (ja) * 2020-01-30 2021-08-19 住友化学株式会社 フッ素樹脂シート及びその製造方法
JP2021120993A (ja) * 2020-01-30 2021-08-19 住友化学株式会社 電子部品の製造方法
WO2021153337A1 (ja) * 2020-01-30 2021-08-05 住友化学株式会社 フッ素樹脂及びその製造方法

Also Published As

Publication number Publication date
EP2183329A4 (en) 2011-05-11
TW200920799A (en) 2009-05-16
WO2009026284A3 (en) 2009-04-09
WO2009026284A2 (en) 2009-02-26
KR20100063083A (ko) 2010-06-10
EP2183329A2 (en) 2010-05-12
CN101784622A (zh) 2010-07-21

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