ATE320656T1 - Für hohe frequenzen ausgelegtes elektronisches teil, das ein isoliermaterial umfasst, und verfahren zu dessen herstellung - Google Patents

Für hohe frequenzen ausgelegtes elektronisches teil, das ein isoliermaterial umfasst, und verfahren zu dessen herstellung

Info

Publication number
ATE320656T1
ATE320656T1 AT01952194T AT01952194T ATE320656T1 AT E320656 T1 ATE320656 T1 AT E320656T1 AT 01952194 T AT01952194 T AT 01952194T AT 01952194 T AT01952194 T AT 01952194T AT E320656 T1 ATE320656 T1 AT E320656T1
Authority
AT
Austria
Prior art keywords
insulating material
frequency electronic
producing
high frequency
same
Prior art date
Application number
AT01952194T
Other languages
English (en)
Inventor
Mitsuaki Kobayashi
Hiroshi Ayukawa
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE320656T1 publication Critical patent/ATE320656T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
    • H01B3/445—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds from vinylfluorides or other fluoroethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Paints Or Removers (AREA)
  • Inorganic Insulating Materials (AREA)
AT01952194T 2000-06-30 2001-06-21 Für hohe frequenzen ausgelegtes elektronisches teil, das ein isoliermaterial umfasst, und verfahren zu dessen herstellung ATE320656T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000198017 2000-06-30

Publications (1)

Publication Number Publication Date
ATE320656T1 true ATE320656T1 (de) 2006-04-15

Family

ID=18696243

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01952194T ATE320656T1 (de) 2000-06-30 2001-06-21 Für hohe frequenzen ausgelegtes elektronisches teil, das ein isoliermaterial umfasst, und verfahren zu dessen herstellung

Country Status (7)

Country Link
EP (1) EP1297539B1 (de)
KR (1) KR100733433B1 (de)
AT (1) ATE320656T1 (de)
AU (1) AU2001272979A1 (de)
DE (1) DE60117994T2 (de)
MY (1) MY129636A (de)
WO (1) WO2002003397A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7026032B2 (en) * 2003-11-05 2006-04-11 E. I. Du Pont De Nemours And Company Polyimide based compositions useful as electronic substrates, derived in part from (micro-powder) fluoropolymer, and methods and compositions relating thereto
EP1605012A1 (de) * 2004-06-10 2005-12-14 SOLVAY (Société Anonyme) Fluorpolymer-band, Fluorpolymer-band enthaltender Gegenstand und Verfahren zur Herstellung eines Fluorpolymer-bands
JP2009051876A (ja) * 2007-08-23 2009-03-12 Three M Innovative Properties Co コーティング組成物及びそれを使用した物品
CN106604536B (zh) * 2017-01-26 2019-05-21 上海安缔诺科技有限公司 聚四氟乙烯复合微波介质材料及其制备方法
WO2025100608A1 (ko) * 2023-11-10 2025-05-15 엘지전자 주식회사 폴리이미드 조성물, 이의 제조방법 및 이를 이용한 폴리이미드 필름
WO2025100607A1 (ko) * 2023-11-10 2025-05-15 엘지전자 주식회사 폴리이미드 조성물, 이의 제조방법 및 이를 이용한 폴리이미드 필름

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3693086A (en) * 1971-03-15 1972-09-19 Henry W Redecker Meter with small tilt error
US4302413A (en) * 1978-11-16 1981-11-24 Rogers Corporation Process for preparing extrudable polyimide granules
US4433104A (en) * 1982-03-18 1984-02-21 General Electric Company Polyetherimide-fluorinated polyolefin blends
JPS59202258A (ja) * 1983-04-30 1984-11-16 Mitsui Toatsu Chem Inc ポリエ−テルイミド樹脂組成物
JPS6037415A (ja) * 1983-08-09 1985-02-26 Oiles Ind Co Ltd 複層軸受ならびにその製造方法
JPS6038464A (ja) * 1983-08-11 1985-02-28 Sumitomo Chem Co Ltd ポリエ−テルイミド樹脂組成物
EP0301543B1 (de) * 1987-07-29 1995-02-08 Sumitomo Electric Industries Limited Formkörper auf Basis einer Harzzusammensetzung
US4985297A (en) * 1988-04-30 1991-01-15 Daikin Industries, Inc. Composite materials
US4954578A (en) * 1988-10-25 1990-09-04 International Business Machines Corporation Fine domain composite films of polyimide mixtures

Also Published As

Publication number Publication date
WO2002003397A2 (en) 2002-01-10
KR100733433B1 (ko) 2007-06-29
DE60117994T2 (de) 2006-09-21
EP1297539B1 (de) 2006-03-15
WO2002003397A3 (en) 2002-06-20
AU2001272979A1 (en) 2002-01-14
EP1297539A2 (de) 2003-04-02
DE60117994D1 (de) 2006-05-11
KR20040030179A (ko) 2004-04-09
MY129636A (en) 2007-04-30

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