DE69529677D1 - Schutzstrukturen gegen veränderliche spannung und verfahren zur herstellung - Google Patents
Schutzstrukturen gegen veränderliche spannung und verfahren zur herstellungInfo
- Publication number
- DE69529677D1 DE69529677D1 DE69529677T DE69529677T DE69529677D1 DE 69529677 D1 DE69529677 D1 DE 69529677D1 DE 69529677 T DE69529677 T DE 69529677T DE 69529677 T DE69529677 T DE 69529677T DE 69529677 D1 DE69529677 D1 DE 69529677D1
- Authority
- DE
- Germany
- Prior art keywords
- variable
- voltage protection
- protection component
- producing
- voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C8/00—Non-adjustable resistors consisting of loose powdered or granular conducting, or powdered or granular semi-conducting material
- H01C8/04—Overvoltage protection resistors; Arresters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/105—Varistor cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/073—High voltage adaptations
- H05K2201/0738—Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Emergency Protection Circuit Devices (AREA)
- Thermistors And Varistors (AREA)
- Insulating Bodies (AREA)
- Cable Accessories (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US27594794A | 1994-07-14 | 1994-07-14 | |
US275947 | 1994-07-14 | ||
PCT/US1995/008683 WO1996002922A2 (en) | 1994-07-14 | 1995-07-11 | Variable voltage protection structures and methods for making same |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69529677D1 true DE69529677D1 (de) | 2003-03-27 |
DE69529677T2 DE69529677T2 (de) | 2004-03-25 |
Family
ID=23054477
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69529677T Expired - Lifetime DE69529677T2 (de) | 1994-07-14 | 1995-07-11 | Schutzstrukturen gegen veränderliche spannung und verfahren zur herstellung |
Country Status (12)
Country | Link |
---|---|
US (3) | US6310752B1 (de) |
EP (1) | EP0770260B1 (de) |
JP (1) | JP3757419B2 (de) |
KR (1) | KR100369681B1 (de) |
CN (1) | CN1079571C (de) |
AT (1) | ATE233014T1 (de) |
AU (1) | AU704862B2 (de) |
BR (1) | BR9508404A (de) |
CA (1) | CA2194968A1 (de) |
DE (1) | DE69529677T2 (de) |
MX (1) | MX9700370A (de) |
WO (1) | WO1996002922A2 (de) |
Families Citing this family (90)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0770260B1 (de) | 1994-07-14 | 2003-02-19 | Surgx Corporation | Schutzstrukturen gegen veränderliche spannung und verfahren zur herstellung |
US6172590B1 (en) | 1996-01-22 | 2001-01-09 | Surgx Corporation | Over-voltage protection device and method for making same |
US5869869A (en) * | 1996-01-31 | 1999-02-09 | Lsi Logic Corporation | Microelectronic device with thin film electrostatic discharge protection structure |
US6064094A (en) * | 1998-03-10 | 2000-05-16 | Oryx Technology Corporation | Over-voltage protection system for integrated circuits using the bonding pads and passivation layer |
US6133820A (en) * | 1998-08-12 | 2000-10-17 | General Electric Company | Current limiting device having a web structure |
US6549114B2 (en) * | 1998-08-20 | 2003-04-15 | Littelfuse, Inc. | Protection of electrical devices with voltage variable materials |
US6211554B1 (en) * | 1998-12-08 | 2001-04-03 | Littelfuse, Inc. | Protection of an integrated circuit with voltage variable materials |
US7695644B2 (en) | 1999-08-27 | 2010-04-13 | Shocking Technologies, Inc. | Device applications for voltage switchable dielectric material having high aspect ratio particles |
US20100038119A1 (en) * | 1999-08-27 | 2010-02-18 | Lex Kosowsky | Metal Deposition |
US20080035370A1 (en) * | 1999-08-27 | 2008-02-14 | Lex Kosowsky | Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material |
US20100044080A1 (en) * | 1999-08-27 | 2010-02-25 | Lex Kosowsky | Metal Deposition |
US7446030B2 (en) * | 1999-08-27 | 2008-11-04 | Shocking Technologies, Inc. | Methods for fabricating current-carrying structures using voltage switchable dielectric materials |
US7825491B2 (en) | 2005-11-22 | 2010-11-02 | Shocking Technologies, Inc. | Light-emitting device using voltage switchable dielectric material |
AU6531600A (en) | 1999-08-27 | 2001-03-26 | Lex Kosowsky | Current carrying structure using voltage switchable dielectric material |
US20100038121A1 (en) * | 1999-08-27 | 2010-02-18 | Lex Kosowsky | Metal Deposition |
US20100044079A1 (en) * | 1999-08-27 | 2010-02-25 | Lex Kosowsky | Metal Deposition |
DE19945426C1 (de) | 1999-09-22 | 2001-01-18 | Siemens Ag | Steckverbinder eines elektrischen Geräts |
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US6373719B1 (en) * | 2000-04-13 | 2002-04-16 | Surgx Corporation | Over-voltage protection for electronic circuits |
JP3895911B2 (ja) * | 2000-08-28 | 2007-03-22 | 隆 河東田 | 対サージ防御装置の主構成部材及びその作製方法 |
US6628498B2 (en) * | 2000-08-28 | 2003-09-30 | Steven J. Whitney | Integrated electrostatic discharge and overcurrent device |
US6486535B2 (en) * | 2001-03-20 | 2002-11-26 | Advanced Semiconductor Engineering, Inc. | Electronic package with surface-mountable device built therein |
US6893901B2 (en) * | 2001-05-14 | 2005-05-17 | Fairchild Semiconductor Corporation | Carrier with metal bumps for semiconductor die packages |
US7034652B2 (en) * | 2001-07-10 | 2006-04-25 | Littlefuse, Inc. | Electrostatic discharge multifunction resistor |
US6935879B2 (en) * | 2001-07-10 | 2005-08-30 | Littelfuse, Inc. | Connectors having circuit protection |
US7258819B2 (en) | 2001-10-11 | 2007-08-21 | Littelfuse, Inc. | Voltage variable substrate material |
DE10392524B4 (de) * | 2002-04-08 | 2008-08-07 | OTC Littelfuse, Inc., Des Plaines | Vorrichtungen mit spannungsvariablem Material zur direkten Anwendung |
US7132922B2 (en) * | 2002-04-08 | 2006-11-07 | Littelfuse, Inc. | Direct application voltage variable material, components thereof and devices employing same |
US7183891B2 (en) * | 2002-04-08 | 2007-02-27 | Littelfuse, Inc. | Direct application voltage variable material, devices employing same and methods of manufacturing such devices |
TWI299559B (en) * | 2002-06-19 | 2008-08-01 | Inpaq Technology Co Ltd | Ic substrate with over voltage protection function and method for manufacturing the same |
US6981319B2 (en) * | 2003-02-13 | 2006-01-03 | Shrier Karen P | Method of manufacturing devices to protect election components |
US7218492B2 (en) * | 2004-09-17 | 2007-05-15 | Electronic Polymers, Inc. | Devices and systems for electrostatic discharge suppression |
US20060152334A1 (en) * | 2005-01-10 | 2006-07-13 | Nathaniel Maercklein | Electrostatic discharge protection for embedded components |
CN101595769B (zh) * | 2005-02-16 | 2011-09-14 | 三米拉-惜爱公司 | 印刷电路板的嵌入式瞬时保护的选择性沉积 |
US9781830B2 (en) | 2005-03-04 | 2017-10-03 | Sanmina Corporation | Simultaneous and selective wide gap partitioning of via structures using plating resist |
TWI389205B (zh) * | 2005-03-04 | 2013-03-11 | Sanmina Sci Corp | 使用抗鍍層分隔介層結構 |
JP2006269876A (ja) * | 2005-03-25 | 2006-10-05 | Matsushita Electric Ind Co Ltd | 静電気対策部品 |
US10244793B2 (en) | 2005-07-19 | 2019-04-02 | Juul Labs, Inc. | Devices for vaporization of a substance |
US7567416B2 (en) * | 2005-07-21 | 2009-07-28 | Cooper Technologies Company | Transient voltage protection device, material, and manufacturing methods |
KR20080084812A (ko) | 2005-11-22 | 2008-09-19 | 쇼킹 테크놀로지스 인코포레이티드 | 과전압 보호를 위해 전압 변환가능 재료를 포함하는 반도체디바이스 |
US20100264225A1 (en) * | 2005-11-22 | 2010-10-21 | Lex Kosowsky | Wireless communication device using voltage switchable dielectric material |
US7371616B2 (en) * | 2006-01-05 | 2008-05-13 | Fairchild Semiconductor Corporation | Clipless and wireless semiconductor die package and method for making the same |
TW200809639A (en) * | 2006-03-10 | 2008-02-16 | Littelfuse Inc | Suppressing electrostatic discharge associated with radio frequency identification tags |
EP2020009B1 (de) * | 2006-04-24 | 2012-12-26 | ABB Research Ltd | Überspannungsschutz auf mikrovaristorbasis und herstellungsverahren |
US20080029405A1 (en) * | 2006-07-29 | 2008-02-07 | Lex Kosowsky | Voltage switchable dielectric material having conductive or semi-conductive organic material |
US20080032049A1 (en) * | 2006-07-29 | 2008-02-07 | Lex Kosowsky | Voltage switchable dielectric material having high aspect ratio particles |
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EP2084748A4 (de) | 2006-09-24 | 2011-09-28 | Shocking Technologies Inc | Formulierungen für ein spannungsumschaltbares dielektrisches material mit einem abgestuften spannungsansprechverhalten und herstellungsverfahren dafür |
US20120119168A9 (en) * | 2006-11-21 | 2012-05-17 | Robert Fleming | Voltage switchable dielectric materials with low band gap polymer binder or composite |
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JP2921722B2 (ja) | 1992-06-10 | 1999-07-19 | 三菱マテリアル株式会社 | チップ型サージアブソーバ |
US5246388A (en) | 1992-06-30 | 1993-09-21 | Amp Incorporated | Electrical over stress device and connector |
RU2036523C1 (ru) * | 1992-07-03 | 1995-05-27 | Многопрофильное научно-техническое и производственно-коммерческое общество с ограниченной ответственностью "Эконд" | Конденсатор с двойным электрическим слоем |
US5278535A (en) | 1992-08-11 | 1994-01-11 | G&H Technology, Inc. | Electrical overstress pulse protection |
DE69314742T2 (de) | 1992-09-23 | 1998-02-19 | Electromer Corp | Vorrichtung zum Schutz gegen elektrische Überbeanspruchung |
US5393597A (en) * | 1992-09-23 | 1995-02-28 | The Whitaker Corporation | Overvoltage protection element |
US5262754A (en) * | 1992-09-23 | 1993-11-16 | Electromer Corporation | Overvoltage protection element |
US5444593A (en) | 1993-09-30 | 1995-08-22 | Allina; Edward F. | Thick-film varistors for TVSS |
EP0771465B1 (de) | 1994-07-14 | 2002-11-13 | Surgx Corporation | Verfahren zur herstellung von ein- und mehrschicht-schutzvorrichtungen gegen veränderliche spannung |
EP0770260B1 (de) | 1994-07-14 | 2003-02-19 | Surgx Corporation | Schutzstrukturen gegen veränderliche spannung und verfahren zur herstellung |
US5742223A (en) * | 1995-12-07 | 1998-04-21 | Raychem Corporation | Laminar non-linear device with magnetically aligned particles |
US6172590B1 (en) | 1996-01-22 | 2001-01-09 | Surgx Corporation | Over-voltage protection device and method for making same |
-
1995
- 1995-07-11 EP EP95925619A patent/EP0770260B1/de not_active Expired - Lifetime
- 1995-07-11 CA CA002194968A patent/CA2194968A1/en not_active Abandoned
- 1995-07-11 CN CN95194113A patent/CN1079571C/zh not_active Expired - Lifetime
- 1995-07-11 JP JP50509996A patent/JP3757419B2/ja not_active Expired - Lifetime
- 1995-07-11 DE DE69529677T patent/DE69529677T2/de not_active Expired - Lifetime
- 1995-07-11 AU AU29691/95A patent/AU704862B2/en not_active Ceased
- 1995-07-11 KR KR1019970700236A patent/KR100369681B1/ko not_active IP Right Cessation
- 1995-07-11 BR BR9508404A patent/BR9508404A/pt not_active IP Right Cessation
- 1995-07-11 WO PCT/US1995/008683 patent/WO1996002922A2/en active IP Right Grant
- 1995-07-11 AT AT95925619T patent/ATE233014T1/de not_active IP Right Cessation
- 1995-07-11 MX MX9700370A patent/MX9700370A/es unknown
-
1997
- 1997-01-28 US US08/790,250 patent/US6310752B1/en not_active Expired - Lifetime
- 1997-10-03 US US08/943,189 patent/US6239687B1/en not_active Expired - Lifetime
-
2001
- 2001-04-10 US US09/828,883 patent/US6542065B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
AU2969195A (en) | 1996-02-16 |
AU704862B2 (en) | 1999-05-06 |
US6310752B1 (en) | 2001-10-30 |
WO1996002922A2 (en) | 1996-02-01 |
CA2194968A1 (en) | 1996-02-01 |
JP3757419B2 (ja) | 2006-03-22 |
CN1079571C (zh) | 2002-02-20 |
MX9700370A (es) | 1998-03-31 |
CN1154178A (zh) | 1997-07-09 |
EP0770260A2 (de) | 1997-05-02 |
US6239687B1 (en) | 2001-05-29 |
KR970705153A (ko) | 1997-09-06 |
US20020050912A1 (en) | 2002-05-02 |
KR100369681B1 (ko) | 2003-04-11 |
ATE233014T1 (de) | 2003-03-15 |
EP0770260B1 (de) | 2003-02-19 |
JPH10505462A (ja) | 1998-05-26 |
BR9508404A (pt) | 1997-11-25 |
US6542065B2 (en) | 2003-04-01 |
DE69529677T2 (de) | 2004-03-25 |
WO1996002922A3 (en) | 1996-07-25 |
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