EP2183329A4 - COATING COMPOSITION AND PRODUCT THEREOF - Google Patents

COATING COMPOSITION AND PRODUCT THEREOF

Info

Publication number
EP2183329A4
EP2183329A4 EP08798178A EP08798178A EP2183329A4 EP 2183329 A4 EP2183329 A4 EP 2183329A4 EP 08798178 A EP08798178 A EP 08798178A EP 08798178 A EP08798178 A EP 08798178A EP 2183329 A4 EP2183329 A4 EP 2183329A4
Authority
EP
European Patent Office
Prior art keywords
article
same
coating composition
coating
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08798178A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2183329A2 (en
Inventor
Fumio Karasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of EP2183329A2 publication Critical patent/EP2183329A2/en
Publication of EP2183329A4 publication Critical patent/EP2183329A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
    • C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
EP08798178A 2007-08-23 2008-08-19 COATING COMPOSITION AND PRODUCT THEREOF Withdrawn EP2183329A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007217386A JP2009051876A (ja) 2007-08-23 2007-08-23 コーティング組成物及びそれを使用した物品
PCT/US2008/073584 WO2009026284A2 (en) 2007-08-23 2008-08-19 Coating composition and article using the same

Publications (2)

Publication Number Publication Date
EP2183329A2 EP2183329A2 (en) 2010-05-12
EP2183329A4 true EP2183329A4 (en) 2011-05-11

Family

ID=40378954

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08798178A Withdrawn EP2183329A4 (en) 2007-08-23 2008-08-19 COATING COMPOSITION AND PRODUCT THEREOF

Country Status (6)

Country Link
EP (1) EP2183329A4 (enExample)
JP (1) JP2009051876A (enExample)
KR (1) KR20100063083A (enExample)
CN (1) CN101784622A (enExample)
TW (1) TW200920799A (enExample)
WO (1) WO2009026284A2 (enExample)

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GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
SG10201701218UA (en) 2008-08-18 2017-03-30 Semblant Ltd Halo-hydrocarbon polymer coating
GB2462824A (en) * 2008-08-18 2010-02-24 Crombie 123 Ltd Printed circuit board encapsulation
JP2012521016A (ja) * 2009-03-17 2012-09-10 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 小型の経路識別文字用のｌｅｄストリップ
US8697458B2 (en) * 2009-04-22 2014-04-15 Shat-R-Shield, Inc. Silicone coated light-emitting diode
DE102009032424A1 (de) * 2009-07-09 2011-01-13 Osram Gesellschaft mit beschränkter Haftung Leuchtvorrichtung mit einer flexiblen Leiterplatte
WO2011064861A1 (ja) * 2009-11-26 2011-06-03 Cheng Chiang-Ming 多機能照明装置
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
TWI509838B (zh) 2010-04-14 2015-11-21 黃邦明 具氟化聚合物之表面塗層的發光二極體外殼及其發光二極體結構
WO2011134941A1 (en) 2010-04-30 2011-11-03 Solvay Solexis S.P.A. Vdf polymer composition
US20120036750A1 (en) * 2010-08-12 2012-02-16 Sun Inno Tech Internally Illuminated Panel and Method of Making the Same
EP2428537A1 (de) * 2010-09-13 2012-03-14 Sika Technology AG Abdichtungsmembran mit verbesserter Haftung
RU2505572C2 (ru) * 2012-04-26 2014-01-27 Открытое акционерное общество "Научно-исследовательский институт приборостроения имени В.В. Тихомирова" Лаковая композиция
CN102977700B (zh) * 2012-12-28 2016-05-04 上海电缆研究所 一种全面改善架空导线性能的涂料
ITMI20130350A1 (it) * 2013-03-07 2014-09-08 Davide Zanesi Processo di stampaggio di circuiti elettronici su supporti tessili tramite tecnologia serigrafica, con l¿ utilizzo di materiale elettricamente conduttivo, termoelettrico o elettro-luminescente.
US10103037B2 (en) 2014-05-09 2018-10-16 Intel Corporation Flexible microelectronic systems and methods of fabricating the same
KR102237112B1 (ko) 2014-07-30 2021-04-08 엘지이노텍 주식회사 발광 소자 및 이를 구비한 광원 모듈
US9540536B2 (en) 2014-09-02 2017-01-10 E I Du Pont De Nemours And Company Heat-curable polymer paste
EP3196550B1 (en) * 2016-01-20 2018-10-24 OSRAM GmbH A method of producing lighting devices and corresponding lighting device
DE102016105407A1 (de) * 2016-03-23 2017-09-28 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer elektronischen Vorrichtung und elektronische Vorrichtung
CN109314168A (zh) * 2016-05-03 2019-02-05 霍尼韦尔国际公司 具有改善的耐化学品性的光发射器设备和部件及相关方法
CN109328378A (zh) * 2016-06-29 2019-02-12 三菱电机株式会社 显示装置及显示装置的制造方法
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating
KR102647179B1 (ko) * 2017-05-20 2024-03-14 허니웰 인터내셔날 인코포레이티드 밀크 루미룩스 분산물
KR102186090B1 (ko) * 2017-06-15 2020-12-03 주식회사 엘지화학 부분 몰딩 처리된 기판과 부분 몰딩 장치 및 방법
EP3655490A1 (en) * 2017-07-21 2020-05-27 The Chemours Company FC, LLC Photocrosslinkable fluoropolymer coating composition and passivation layer formed therefrom
CN111527568B (zh) * 2017-10-26 2023-03-24 赛义德·泰穆尔·艾哈迈德 包括用于疏水性的、疏油性的和亲油性的涂层的非牛顿流体的组合物及其使用方法
WO2019175197A1 (en) 2018-03-15 2019-09-19 Solvay Specialty Polymers Italy S.P.A. Fluoropolymer composition for components of light emitting apparatus
JP6899412B2 (ja) * 2018-07-27 2021-07-07 住友化学株式会社 Ｌｅｄデバイスの製造方法
DE102019205064A1 (de) * 2019-04-09 2020-10-15 Conti Temic Microelectronic Gmbh Verwendung des Stoffs [P(VdF-HFP)HP] als Kühleinrichtung zur Kühlung einer Sensorvorrichtung eines Kraftfahrzeugs
KR20220009994A (ko) 2019-05-16 2022-01-25 스미또모 가가꾸 가부시키가이샤 전자 부품의 제조 방법 및 전자 부품
KR20220009993A (ko) 2019-05-16 2022-01-25 스미또모 가가꾸 가부시키가이샤 전자 부품 및 그 제조 방법
JP6998362B2 (ja) * 2019-05-16 2022-01-18 住友化学株式会社 電子部品及びその製造方法
JP6856787B1 (ja) * 2020-01-29 2021-04-14 住友化学株式会社 電子部品の製造方法
JP6816317B1 (ja) * 2020-01-30 2021-01-20 住友化学株式会社 フッ素樹脂シート及びその製造方法
JP6870128B1 (ja) * 2020-01-30 2021-05-12 住友化学株式会社 フッ素樹脂封止剤及びその製造方法
JP6830168B1 (ja) * 2020-01-30 2021-02-17 住友化学株式会社 電子部品の製造方法

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US5922453A (en) * 1997-02-06 1999-07-13 Rogers Corporation Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates
WO2002003397A2 (en) * 2000-06-30 2002-01-10 3M Innovative Properties Company Insulation material for use in high-frequency electronic parts
US20070053179A1 (en) * 2005-09-08 2007-03-08 Pang Slew I Low profile light source utilizing a flexible circuit carrier

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US5177150A (en) * 1990-05-10 1993-01-05 Elf Atochem North America, Inc. Powder coatings of vinylidene fluoride/hexafluoropylene copolymers
JP2000017197A (ja) * 1998-04-30 2000-01-18 Daikin Ind Ltd 熱硬化性粉体塗料組成物
EP1377642B1 (en) * 2001-04-09 2013-01-09 FUJIFILM Corporation Coloring composition for image formation and method for improving ozone resistance of color image
US6878196B2 (en) * 2002-01-15 2005-04-12 Fuji Photo Film Co., Ltd. Ink, ink jet recording method and azo compound
EP1612226B1 (en) * 2003-04-09 2009-12-09 Kuraray Co., Ltd. (meth)acrylic resin emulsion and process for producing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5922453A (en) * 1997-02-06 1999-07-13 Rogers Corporation Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates
WO2002003397A2 (en) * 2000-06-30 2002-01-10 3M Innovative Properties Company Insulation material for use in high-frequency electronic parts
US20070053179A1 (en) * 2005-09-08 2007-03-08 Pang Slew I Low profile light source utilizing a flexible circuit carrier

Also Published As

Publication number Publication date
WO2009026284A2 (en) 2009-02-26
KR20100063083A (ko) 2010-06-10
WO2009026284A3 (en) 2009-04-09
EP2183329A2 (en) 2010-05-12
TW200920799A (en) 2009-05-16
CN101784622A (zh) 2010-07-21
JP2009051876A (ja) 2009-03-12

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