EP2183329A4 - Composition de revêtement et article l'utilisant - Google Patents

Composition de revêtement et article l'utilisant

Info

Publication number
EP2183329A4
EP2183329A4 EP08798178A EP08798178A EP2183329A4 EP 2183329 A4 EP2183329 A4 EP 2183329A4 EP 08798178 A EP08798178 A EP 08798178A EP 08798178 A EP08798178 A EP 08798178A EP 2183329 A4 EP2183329 A4 EP 2183329A4
Authority
EP
European Patent Office
Prior art keywords
article
same
coating composition
coating
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08798178A
Other languages
German (de)
English (en)
Other versions
EP2183329A2 (fr
Inventor
Fumio Karasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of EP2183329A2 publication Critical patent/EP2183329A2/fr
Publication of EP2183329A4 publication Critical patent/EP2183329A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
    • C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
EP08798178A 2007-08-23 2008-08-19 Composition de revêtement et article l'utilisant Withdrawn EP2183329A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007217386A JP2009051876A (ja) 2007-08-23 2007-08-23 コーティング組成物及びそれを使用した物品
PCT/US2008/073584 WO2009026284A2 (fr) 2007-08-23 2008-08-19 Composition de revêtement et article l'utilisant

Publications (2)

Publication Number Publication Date
EP2183329A2 EP2183329A2 (fr) 2010-05-12
EP2183329A4 true EP2183329A4 (fr) 2011-05-11

Family

ID=40378954

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08798178A Withdrawn EP2183329A4 (fr) 2007-08-23 2008-08-19 Composition de revêtement et article l'utilisant

Country Status (6)

Country Link
EP (1) EP2183329A4 (fr)
JP (1) JP2009051876A (fr)
KR (1) KR20100063083A (fr)
CN (1) CN101784622A (fr)
TW (1) TW200920799A (fr)
WO (1) WO2009026284A2 (fr)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
CN102150480A (zh) 2008-08-18 2011-08-10 赛姆布兰特环球有限公司 卤代烃聚合物涂层
GB2462824A (en) * 2008-08-18 2010-02-24 Crombie 123 Ltd Printed circuit board encapsulation
EP2409071A1 (fr) * 2009-03-17 2012-01-25 Koninklijke Philips Electronics N.V. Bande de diodes électroluminescentes pour petites lettres profilées
US8697458B2 (en) 2009-04-22 2014-04-15 Shat-R-Shield, Inc. Silicone coated light-emitting diode
DE102009032424A1 (de) * 2009-07-09 2011-01-13 Osram Gesellschaft mit beschränkter Haftung Leuchtvorrichtung mit einer flexiblen Leiterplatte
WO2011064861A1 (fr) * 2009-11-26 2011-06-03 Cheng Chiang-Ming Dispositif d'éclairage multifonction
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
TWI509838B (zh) * 2010-04-14 2015-11-21 Pang Ming Huang 具氟化聚合物之表面塗層的發光二極體外殼及其發光二極體結構
WO2011134941A1 (fr) 2010-04-30 2011-11-03 Solvay Solexis S.P.A. Composition de polymère de vdf
US20120036750A1 (en) * 2010-08-12 2012-02-16 Sun Inno Tech Internally Illuminated Panel and Method of Making the Same
EP2428537A1 (fr) * 2010-09-13 2012-03-14 Sika Technology AG Membrane d'étanchéité dotée d'une adhérence améliorée
RU2505572C2 (ru) * 2012-04-26 2014-01-27 Открытое акционерное общество "Научно-исследовательский институт приборостроения имени В.В. Тихомирова" Лаковая композиция
CN102977700B (zh) * 2012-12-28 2016-05-04 上海电缆研究所 一种全面改善架空导线性能的涂料
ITMI20130350A1 (it) * 2013-03-07 2014-09-08 Davide Zanesi Processo di stampaggio di circuiti elettronici su supporti tessili tramite tecnologia serigrafica, con l¿ utilizzo di materiale elettricamente conduttivo, termoelettrico o elettro-luminescente.
US10103037B2 (en) * 2014-05-09 2018-10-16 Intel Corporation Flexible microelectronic systems and methods of fabricating the same
KR102237112B1 (ko) 2014-07-30 2021-04-08 엘지이노텍 주식회사 발광 소자 및 이를 구비한 광원 모듈
US9540536B2 (en) 2014-09-02 2017-01-10 E I Du Pont De Nemours And Company Heat-curable polymer paste
EP3196550B1 (fr) * 2016-01-20 2018-10-24 OSRAM GmbH Procédé de production de dispositifs d'éclairage et dispositif d'éclairage correspondant
DE102016105407A1 (de) 2016-03-23 2017-09-28 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer elektronischen Vorrichtung und elektronische Vorrichtung
CN109314168A (zh) * 2016-05-03 2019-02-05 霍尼韦尔国际公司 具有改善的耐化学品性的光发射器设备和部件及相关方法
US10700247B2 (en) 2016-06-29 2020-06-30 Mitsubishi Electric Corporation Display device and method for manufacturing display device
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating
EP3625294A4 (fr) * 2017-05-20 2021-01-20 Honeywell International Inc. Intellectual Property - Patent Services Dispersion luminescente de lait
KR102186090B1 (ko) 2017-06-15 2020-12-03 주식회사 엘지화학 부분 몰딩 처리된 기판과 부분 몰딩 장치 및 방법
EP3655490A1 (fr) * 2017-07-21 2020-05-27 The Chemours Company FC, LLC Composition de revêtement de fluoropolymère photoréticulable et couche de passivation formée à partir de celle-ci
CA3080321C (fr) * 2017-10-26 2023-02-14 Syed Taymur Ahmad Composition comprenant des fluides non newtoniens pour des revetements hydrophobes, oleophobes et oleophiles, et leurs procedes d'utilisation
US20210087381A1 (en) 2018-03-15 2021-03-25 Solvay Specialty Polymers Italy S.P.A. Fluoropolymer composition for components of light emitting apparatus
JP6899412B2 (ja) * 2018-07-27 2021-07-07 住友化学株式会社 Ｌｅｄデバイスの製造方法
DE102019205064A1 (de) * 2019-04-09 2020-10-15 Conti Temic Microelectronic Gmbh Verwendung des Stoffs [P(VdF-HFP)HP] als Kühleinrichtung zur Kühlung einer Sensorvorrichtung eines Kraftfahrzeugs
CN113811429A (zh) 2019-05-16 2021-12-17 住友化学株式会社 电子部件的制造方法和电子部件
CN113853690A (zh) 2019-05-16 2021-12-28 住友化学株式会社 电子部件和其制造方法
JP6998362B2 (ja) * 2019-05-16 2022-01-18 住友化学株式会社 電子部品及びその製造方法
JP6856787B1 (ja) * 2020-01-29 2021-04-14 住友化学株式会社 電子部品の製造方法
JP6830168B1 (ja) * 2020-01-30 2021-02-17 住友化学株式会社 電子部品の製造方法
JP6816317B1 (ja) * 2020-01-30 2021-01-20 住友化学株式会社 フッ素樹脂シート及びその製造方法
JP6870128B1 (ja) * 2020-01-30 2021-05-12 住友化学株式会社 フッ素樹脂封止剤及びその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5922453A (en) * 1997-02-06 1999-07-13 Rogers Corporation Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates
WO2002003397A2 (fr) * 2000-06-30 2002-01-10 3M Innovative Properties Company Materiau d'isolation, utile dans des elements electroniques haute frequence
US20070053179A1 (en) * 2005-09-08 2007-03-08 Pang Slew I Low profile light source utilizing a flexible circuit carrier

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177150A (en) * 1990-05-10 1993-01-05 Elf Atochem North America, Inc. Powder coatings of vinylidene fluoride/hexafluoropylene copolymers
JP2000017197A (ja) * 1998-04-30 2000-01-18 Daikin Ind Ltd 熱硬化性粉体塗料組成物
KR100601775B1 (ko) * 2001-04-09 2006-07-19 후지 샤신 필름 가부시기가이샤 화상 형성용 착색 조성물 및 칼라 화상의 내오존성 개선방법
US6878196B2 (en) * 2002-01-15 2005-04-12 Fuji Photo Film Co., Ltd. Ink, ink jet recording method and azo compound
ES2337686T3 (es) * 2003-04-09 2010-04-28 Kuraray Co., Ltd. Emulsion de resina (met)acrilica y procedimiento para produccion de la misma.

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5922453A (en) * 1997-02-06 1999-07-13 Rogers Corporation Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates
WO2002003397A2 (fr) * 2000-06-30 2002-01-10 3M Innovative Properties Company Materiau d'isolation, utile dans des elements electroniques haute frequence
US20070053179A1 (en) * 2005-09-08 2007-03-08 Pang Slew I Low profile light source utilizing a flexible circuit carrier

Also Published As

Publication number Publication date
TW200920799A (en) 2009-05-16
CN101784622A (zh) 2010-07-21
WO2009026284A2 (fr) 2009-02-26
KR20100063083A (ko) 2010-06-10
JP2009051876A (ja) 2009-03-12
EP2183329A2 (fr) 2010-05-12
WO2009026284A3 (fr) 2009-04-09

Similar Documents

Publication Publication Date Title
EP2183329A4 (fr) Composition de revêtement et article l'utilisant
EP2147957A4 (fr) Composition de revêtement hydrophile et élément hydrophile l'utilisant
IL254218A0 (en) Pipedrine-bridged compounds of the quinoxaline-converted type and their use
EP1911819A4 (fr) Revetement antibrouillard et article antibrouillard
EP2209625A4 (fr) Objets et leurs procédés de fabrication
EP2035519A4 (fr) Compositions adhésives, articles adhésifs et leurs procédés de fabrication
IL178957A0 (en) Adhesive protective coatings, methods for the preparation thereof and articles coated therewith
EP2177557A4 (fr) Poudre frittable au laser et produit façonné de celle-ci
HK1168843A1 (zh) 取代的喹喔啉型呱啶化合物及其用途
IL210722A0 (en) Benzazepine derivatives, compositions comprising the same and uses thereof
EP2207835A4 (fr) Compositions et articles préparés à partir de celles-ci
EP2222893A4 (fr) Nouvelles compositions et procédés, revêtements et articles apparentés
EP1970418A4 (fr) Composition de revetement a emballage unique et a base d eau et article revetu
IL206199A0 (en) Coated article
PL2150575T3 (pl) Kompozycja powłoki antyadhezyjnej i sposób jej wytwarzania
EP2113542A4 (fr) Composition de revêtement et article optique photochromique
EP2011838A4 (fr) Composition de revetement et article revetu
EP2112208A4 (fr) Composition de revêtement
EP1854854A4 (fr) Composition de revetement et article revetu
PL2078063T3 (pl) Kompozycja powłoki nieprzywierającej
PL3542831T3 (pl) Niewodna kompozycja powlekająca do artykułów elastomerowych i wyroby zawierające tę kompozycję
EP2307052A4 (fr) Agents anti-bêta-2-microglobuline et leur utilisation
SI2292686T1 (sl) Preslojevalni sestavek
EP2160192A4 (fr) Matériaux et revêtements antimicrobiens
IL208168A0 (en) Tetrahydroisoquinoline derivatives, compositions comprising the same and use thereof

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20100309

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA MK RS

A4 Supplementary search report drawn up and despatched

Effective date: 20110413

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

18W Application withdrawn

Effective date: 20110704