KR20100063083A - 코팅 조성물 및 이를 사용하는 용품 - Google Patents

코팅 조성물 및 이를 사용하는 용품 Download PDF

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Publication number
KR20100063083A
KR20100063083A KR1020107006285A KR20107006285A KR20100063083A KR 20100063083 A KR20100063083 A KR 20100063083A KR 1020107006285 A KR1020107006285 A KR 1020107006285A KR 20107006285 A KR20107006285 A KR 20107006285A KR 20100063083 A KR20100063083 A KR 20100063083A
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KR
South Korea
Prior art keywords
fluoropolymer
coating
article
coating composition
fluoropolymers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020107006285A
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English (en)
Korean (ko)
Inventor
후미오 가라사와
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 쓰리엠 이노베이티브 프로퍼티즈 캄파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 캄파니
Publication of KR20100063083A publication Critical patent/KR20100063083A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
    • C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020107006285A 2007-08-23 2008-08-19 코팅 조성물 및 이를 사용하는 용품 Withdrawn KR20100063083A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-217386 2007-08-23
JP2007217386A JP2009051876A (ja) 2007-08-23 2007-08-23 コーティング組成物及びそれを使用した物品

Publications (1)

Publication Number Publication Date
KR20100063083A true KR20100063083A (ko) 2010-06-10

Family

ID=40378954

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KR1020107006285A Withdrawn KR20100063083A (ko) 2007-08-23 2008-08-19 코팅 조성물 및 이를 사용하는 용품

Country Status (6)

Country Link
EP (1) EP2183329A4 (enExample)
JP (1) JP2009051876A (enExample)
KR (1) KR20100063083A (enExample)
CN (1) CN101784622A (enExample)
TW (1) TW200920799A (enExample)
WO (1) WO2009026284A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10333033B2 (en) 2014-07-30 2019-06-25 Lg Innotek Co., Ltd. Light emitting device and light source module having thereof
KR20200033286A (ko) * 2017-07-21 2020-03-27 더 케무어스 컴퍼니 에프씨, 엘엘씨 광가교결합성 플루오로중합체 코팅 조성물 및 그로부터 형성되는 패시베이션 층

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
CA2957997C (en) 2008-08-18 2019-10-22 Semblant Limited Halo-hydrocarbon polymer coating
GB2462824A (en) * 2008-08-18 2010-02-24 Crombie 123 Ltd Printed circuit board encapsulation
CA2755508A1 (en) * 2009-03-17 2010-09-23 Koninklijke Philips Electronics N.V. Led strip for small channel letters
US8697458B2 (en) 2009-04-22 2014-04-15 Shat-R-Shield, Inc. Silicone coated light-emitting diode
DE102009032424A1 (de) * 2009-07-09 2011-01-13 Osram Gesellschaft mit beschränkter Haftung Leuchtvorrichtung mit einer flexiblen Leiterplatte
WO2011064861A1 (ja) * 2009-11-26 2011-06-03 Cheng Chiang-Ming 多機能照明装置
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
TWI509838B (zh) 2010-04-14 2015-11-21 黃邦明 具氟化聚合物之表面塗層的發光二極體外殼及其發光二極體結構
EP2563858B1 (en) 2010-04-30 2013-12-11 Solvay Specialty Polymers Italy S.p.A. Vdf polymer composition
US20120036750A1 (en) * 2010-08-12 2012-02-16 Sun Inno Tech Internally Illuminated Panel and Method of Making the Same
EP2428537A1 (de) * 2010-09-13 2012-03-14 Sika Technology AG Abdichtungsmembran mit verbesserter Haftung
WO2018217580A1 (en) * 2017-05-20 2018-11-29 Honeywell International Inc. Intellectual Property-Patent Services Milk lumilux dispersion
RU2505572C2 (ru) * 2012-04-26 2014-01-27 Открытое акционерное общество "Научно-исследовательский институт приборостроения имени В.В. Тихомирова" Лаковая композиция
CN102977700B (zh) * 2012-12-28 2016-05-04 上海电缆研究所 一种全面改善架空导线性能的涂料
ITMI20130350A1 (it) * 2013-03-07 2014-09-08 Davide Zanesi Processo di stampaggio di circuiti elettronici su supporti tessili tramite tecnologia serigrafica, con l¿ utilizzo di materiale elettricamente conduttivo, termoelettrico o elettro-luminescente.
US10103037B2 (en) * 2014-05-09 2018-10-16 Intel Corporation Flexible microelectronic systems and methods of fabricating the same
US9540536B2 (en) 2014-09-02 2017-01-10 E I Du Pont De Nemours And Company Heat-curable polymer paste
EP3196550B1 (en) 2016-01-20 2018-10-24 OSRAM GmbH A method of producing lighting devices and corresponding lighting device
DE102016105407A1 (de) 2016-03-23 2017-09-28 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer elektronischen Vorrichtung und elektronische Vorrichtung
EP3453054A4 (en) * 2016-05-03 2020-01-01 Honeywell International Inc. LIGHT EMITTER DEVICES AND COMPONENTS WITH IMPROVED CHEMICAL RESISTANCE AND RELATED METHODS
WO2018003027A1 (ja) * 2016-06-29 2018-01-04 三菱電機株式会社 表示装置および表示装置の製造方法
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating
KR102186090B1 (ko) 2017-06-15 2020-12-03 주식회사 엘지화학 부분 몰딩 처리된 기판과 부분 몰딩 장치 및 방법
CN111527568B (zh) * 2017-10-26 2023-03-24 赛义德·泰穆尔·艾哈迈德 包括用于疏水性的、疏油性的和亲油性的涂层的非牛顿流体的组合物及其使用方法
KR102783854B1 (ko) 2018-03-15 2025-03-24 솔베이 스페셜티 폴리머스 이태리 에스.피.에이. 발광 장치의 구성요소용 플루오로중합체 조성물
JP6899412B2 (ja) * 2018-07-27 2021-07-07 住友化学株式会社 Ｌｅｄデバイスの製造方法
DE102019205064A1 (de) * 2019-04-09 2020-10-15 Conti Temic Microelectronic Gmbh Verwendung des Stoffs [P(VdF-HFP)HP] als Kühleinrichtung zur Kühlung einer Sensorvorrichtung eines Kraftfahrzeugs
CN113853690A (zh) 2019-05-16 2021-12-28 住友化学株式会社 电子部件和其制造方法
JP6998362B2 (ja) * 2019-05-16 2022-01-18 住友化学株式会社 電子部品及びその製造方法
KR20220009994A (ko) 2019-05-16 2022-01-25 스미또모 가가꾸 가부시키가이샤 전자 부품의 제조 방법 및 전자 부품
JP6856787B1 (ja) * 2020-01-29 2021-04-14 住友化学株式会社 電子部品の製造方法
JP6816317B1 (ja) * 2020-01-30 2021-01-20 住友化学株式会社 フッ素樹脂シート及びその製造方法
JP6870128B1 (ja) * 2020-01-30 2021-05-12 住友化学株式会社 フッ素樹脂封止剤及びその製造方法
JP6830168B1 (ja) * 2020-01-30 2021-02-17 住友化学株式会社 電子部品の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177150A (en) * 1990-05-10 1993-01-05 Elf Atochem North America, Inc. Powder coatings of vinylidene fluoride/hexafluoropylene copolymers
US5922453A (en) * 1997-02-06 1999-07-13 Rogers Corporation Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates
JP2000017197A (ja) * 1998-04-30 2000-01-18 Daikin Ind Ltd 熱硬化性粉体塗料組成物
WO2002003397A2 (en) * 2000-06-30 2002-01-10 3M Innovative Properties Company Insulation material for use in high-frequency electronic parts
CN100526391C (zh) * 2001-04-09 2009-08-12 富士胶片株式会社 成象用的着色组合物和提高彩色图象抗臭氧性的方法
US6878196B2 (en) * 2002-01-15 2005-04-12 Fuji Photo Film Co., Ltd. Ink, ink jet recording method and azo compound
JP4152984B2 (ja) * 2003-04-09 2008-09-17 株式会社クラレ （メタ）アクリル樹脂系エマルジョンおよびその製造方法
US20070053179A1 (en) * 2005-09-08 2007-03-08 Pang Slew I Low profile light source utilizing a flexible circuit carrier

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10333033B2 (en) 2014-07-30 2019-06-25 Lg Innotek Co., Ltd. Light emitting device and light source module having thereof
US10957823B2 (en) 2014-07-30 2021-03-23 Lg Innotek Co., Ltd. Light emitting device and light source module having thereof
US11282986B2 (en) 2014-07-30 2022-03-22 Suzhou Lekin Semiconductor Co., Ltd. Light emitting device and light source module having thereof
US11688831B2 (en) 2014-07-30 2023-06-27 Suzhou Lekin Semiconductor Co., Ltd. Light emitting device and light source module having thereof
KR20200033286A (ko) * 2017-07-21 2020-03-27 더 케무어스 컴퍼니 에프씨, 엘엘씨 광가교결합성 플루오로중합체 코팅 조성물 및 그로부터 형성되는 패시베이션 층

Also Published As

Publication number Publication date
CN101784622A (zh) 2010-07-21
EP2183329A4 (en) 2011-05-11
WO2009026284A2 (en) 2009-02-26
WO2009026284A3 (en) 2009-04-09
JP2009051876A (ja) 2009-03-12
EP2183329A2 (en) 2010-05-12
TW200920799A (en) 2009-05-16

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PA0105 International application

Patent event date: 20100323

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid