JP2011228705A - フッ素化ポリマーの表面塗膜を備えた発光ダイオードの筐体及びその発光ダイオード構造 - Google Patents
フッ素化ポリマーの表面塗膜を備えた発光ダイオードの筐体及びその発光ダイオード構造 Download PDFInfo
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- JP2011228705A JP2011228705A JP2011088955A JP2011088955A JP2011228705A JP 2011228705 A JP2011228705 A JP 2011228705A JP 2011088955 A JP2011088955 A JP 2011088955A JP 2011088955 A JP2011088955 A JP 2011088955A JP 2011228705 A JP2011228705 A JP 2011228705A
- Authority
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- Prior art keywords
- emitting diode
- housing
- fluorinated polymer
- light
- surface coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229920002313 fluoropolymer Polymers 0.000 title claims abstract description 56
- 239000011248 coating agent Substances 0.000 title claims abstract description 40
- 238000000576 coating method Methods 0.000 title claims abstract description 40
- 239000006185 dispersion Substances 0.000 claims abstract description 23
- 229920006120 non-fluorinated polymer Polymers 0.000 claims abstract description 3
- 229920006351 engineering plastic Polymers 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 10
- 229920001577 copolymer Polymers 0.000 claims description 7
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 229920001519 homopolymer Polymers 0.000 claims description 6
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 claims description 5
- 229920001774 Perfluoroether Polymers 0.000 claims description 4
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims 2
- 239000012530 fluid Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 9
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 7
- -1 perfluoro Chemical group 0.000 description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 6
- 229910052731 fluorine Inorganic materials 0.000 description 6
- 239000011737 fluorine Substances 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 4
- 239000004408 titanium dioxide Substances 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 239000004811 fluoropolymer Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- KHXKESCWFMPTFT-UHFFFAOYSA-N 1,1,1,2,2,3,3-heptafluoro-3-(1,2,2-trifluoroethenoxy)propane Chemical compound FC(F)=C(F)OC(F)(F)C(F)(F)C(F)(F)F KHXKESCWFMPTFT-UHFFFAOYSA-N 0.000 description 2
- BLTXWCKMNMYXEA-UHFFFAOYSA-N 1,1,2-trifluoro-2-(trifluoromethoxy)ethene Chemical compound FC(F)=C(F)OC(F)(F)F BLTXWCKMNMYXEA-UHFFFAOYSA-N 0.000 description 2
- UZKWTJUDCOPSNM-UHFFFAOYSA-N 1-ethenoxybutane Chemical compound CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 2
- QMIWYOZFFSLIAK-UHFFFAOYSA-N 3,3,3-trifluoro-2-(trifluoromethyl)prop-1-ene Chemical group FC(F)(F)C(=C)C(F)(F)F QMIWYOZFFSLIAK-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 239000004005 microsphere Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- MIZLGWKEZAPEFJ-UHFFFAOYSA-N 1,1,2-trifluoroethene Chemical compound FC=C(F)F MIZLGWKEZAPEFJ-UHFFFAOYSA-N 0.000 description 1
- 229920001780 ECTFE Polymers 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical group FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004815 dispersion polymer Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007850 fluorescent dye Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- KGKJZEKQJQQOTD-UHFFFAOYSA-N vinylbital Chemical group CCCC(C)C1(C=C)C(=O)NC(=O)NC1=O KGKJZEKQJQQOTD-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical class O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
【解決手段】本発明に係る筐体は、発光ダイオードチップを載置することに用いる筐体である。該筐体は、非フッ素化ポリマーからなるカバー体と、フッ素化ポリマーの分散液からなり、該カバー体の少なくとも一部を覆うと共に該カバー体に設置された発光ダイオードチップが発する光を反射することに用いる表面塗膜とを、含む。本発明の発光ダイオード構造は、上記筐体と発光ダイオードチップとを含む。
【選択図】図1A
Description
101 金属枠
102、202 筐体本体
102a 頂部表面
103 凹溝
104、114、124、134、204 表面塗膜
104a 延伸部
300 発光ダイオード構造
301 LEDチップ
303 パッケージ体
Claims (8)
- 発光ダイオードチップを載置することに用いる筐体であって、
非フッ素化ポリマーからなる筐体本体と、
フッ素化ポリマーの分散液からなり、前記筐体本体の少なくとも一部を覆うと共に前記筐体本体に設置された発光ダイオードチップが発する光を反射することに用いる表面塗膜とを、含むことを特徴とする発光ダイオードチップを載置することに用いる筐体。 - 前記筐体本体は、PPAエンジニアリングプラスチックからなることを特徴とする請求項1に記載の筐体。
- 前記筐体本体は、前記発光ダイオードチップを収容することに用いる凹溝を更に含み、前記表面塗膜が前記凹溝の表面のみを覆うことを特徴とする請求項1に記載の筐体。
- 前記フッ素化ポリマーの分散液は、フッ素化ポリマーを含み、前記フッ素化ポリマーがフッ化ビニル(vinyl floride)のホモポリマーと、ペルフルオロアルコキシフッ素樹脂(perfluoroalkoxy fluorocarbon resin)の共重合体、或いは、フッ化ビニリデン(vinylidene fluoride)のホモポリマーとを、含むことを特徴とする請求項1に記載の筐体。
- 前記フッ素化ポリマーの分散液は、可視光線を発散できる充填材を含むことを特徴とする請求項1に記載の筐体。
- 前記フッ素化ポリマーの分散液は、前記表面塗膜のモジュラスを調整できる充填材を含むことを特徴とする請求項1に記載の筐体。
- 前記フッ素化ポリマーの分散液は、発光(luminescent)化合物を含むことを特徴とする請求項1に記載の筐体。
- 発光ダイオード構造であって、
請求項1乃至請求項7の何れか1項に記載の筐体と、
前記筐体に設置された発光ダイオードチップとを、含むことを特徴とする発光ダイオード構造。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW099111570A TWI509838B (zh) | 2010-04-14 | 2010-04-14 | 具氟化聚合物之表面塗層的發光二極體外殼及其發光二極體結構 |
TW099111570 | 2010-04-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011228705A true JP2011228705A (ja) | 2011-11-10 |
JP5346351B2 JP5346351B2 (ja) | 2013-11-20 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2011088955A Active JP5346351B2 (ja) | 2010-04-14 | 2011-04-13 | フッ素化ポリマーの表面塗膜を備えた発光ダイオードの筐体及びその発光ダイオード構造 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9000463B2 (ja) |
JP (1) | JP5346351B2 (ja) |
TW (1) | TWI509838B (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005019488A (ja) * | 2003-06-24 | 2005-01-20 | Citizen Electronics Co Ltd | 光伝送モジュール |
JP2007242820A (ja) * | 2006-03-08 | 2007-09-20 | Asahi Kasei Corp | 発光デバイス及び発光デバイスモジュール |
JP2009051876A (ja) * | 2007-08-23 | 2009-03-12 | Three M Innovative Properties Co | コーティング組成物及びそれを使用した物品 |
US20100032702A1 (en) * | 2008-08-11 | 2010-02-11 | E. I. Du Pont De Nemours And Company | Light-Emitting Diode Housing Comprising Fluoropolymer |
WO2010035788A1 (ja) * | 2008-09-25 | 2010-04-01 | デンカAgsp株式会社 | 発光素子搭載用基板及びその製造方法 |
JP2010177443A (ja) * | 2009-01-29 | 2010-08-12 | Showa Denko Kk | 発光装置及び発光モジュール |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE492141T1 (de) * | 2005-06-30 | 2011-01-15 | Koninkl Philips Electronics Nv | Beleuchtungssystem mit einem gelbes und grünes licht emittierenden leuchtstoff |
US20070269586A1 (en) * | 2006-05-17 | 2007-11-22 | 3M Innovative Properties Company | Method of making light emitting device with silicon-containing composition |
JP2008060344A (ja) * | 2006-08-31 | 2008-03-13 | Toshiba Corp | 半導体発光装置 |
US8901583B2 (en) * | 2010-04-12 | 2014-12-02 | Cree Huizhou Opto Limited | Surface mount device thin package |
CN102244178A (zh) * | 2010-05-14 | 2011-11-16 | 展晶科技(深圳)有限公司 | 发光二极管的封装结构 |
-
2010
- 2010-04-14 TW TW099111570A patent/TWI509838B/zh active
-
2011
- 2011-04-13 JP JP2011088955A patent/JP5346351B2/ja active Active
- 2011-04-14 US US13/086,739 patent/US9000463B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005019488A (ja) * | 2003-06-24 | 2005-01-20 | Citizen Electronics Co Ltd | 光伝送モジュール |
JP2007242820A (ja) * | 2006-03-08 | 2007-09-20 | Asahi Kasei Corp | 発光デバイス及び発光デバイスモジュール |
JP2009051876A (ja) * | 2007-08-23 | 2009-03-12 | Three M Innovative Properties Co | コーティング組成物及びそれを使用した物品 |
US20100032702A1 (en) * | 2008-08-11 | 2010-02-11 | E. I. Du Pont De Nemours And Company | Light-Emitting Diode Housing Comprising Fluoropolymer |
WO2010035788A1 (ja) * | 2008-09-25 | 2010-04-01 | デンカAgsp株式会社 | 発光素子搭載用基板及びその製造方法 |
JP2010177443A (ja) * | 2009-01-29 | 2010-08-12 | Showa Denko Kk | 発光装置及び発光モジュール |
Also Published As
Publication number | Publication date |
---|---|
US9000463B2 (en) | 2015-04-07 |
TWI509838B (zh) | 2015-11-21 |
TW201135981A (en) | 2011-10-16 |
JP5346351B2 (ja) | 2013-11-20 |
US20110254038A1 (en) | 2011-10-20 |
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