JP2008545949A - 電圧故障検出保護 - Google Patents

電圧故障検出保護 Download PDF

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Publication number
JP2008545949A
JP2008545949A JP2008503043A JP2008503043A JP2008545949A JP 2008545949 A JP2008545949 A JP 2008545949A JP 2008503043 A JP2008503043 A JP 2008503043A JP 2008503043 A JP2008503043 A JP 2008503043A JP 2008545949 A JP2008545949 A JP 2008545949A
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JP
Japan
Prior art keywords
probe
power
line
failure
disconnecting
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2008503043A
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English (en)
Japanese (ja)
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JP2008545949A5 (https=
Inventor
チャールズ エー． ミラー，
ブルース ジェイ． バーバラ，
Original Assignee
フォームファクター， インコーポレイテッド
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Application filed by フォームファクター， インコーポレイテッド filed Critical フォームファクター， インコーポレイテッド
Publication of JP2008545949A publication Critical patent/JP2008545949A/ja
Publication of JP2008545949A5 publication Critical patent/JP2008545949A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/36—Overload-protection arrangements or circuits for electric measuring instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Measuring Leads Or Probes (AREA)
JP2008503043A 2005-03-22 2006-03-16 電圧故障検出保護 Pending JP2008545949A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US59424805P 2005-03-22 2005-03-22
US11/306,186 US7609080B2 (en) 2005-03-22 2005-12-19 Voltage fault detection and protection
PCT/US2006/009575 WO2006102006A2 (en) 2005-03-22 2006-03-16 Voltage fault detection and protection

Publications (2)

Publication Number Publication Date
JP2008545949A true JP2008545949A (ja) 2008-12-18
JP2008545949A5 JP2008545949A5 (https=) 2009-04-30

Family

ID=37024398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008503043A Pending JP2008545949A (ja) 2005-03-22 2006-03-16 電圧故障検出保護

Country Status (6)

Country Link
US (2) US7609080B2 (https=)
EP (1) EP1869479A4 (https=)
JP (1) JP2008545949A (https=)
KR (1) KR101238529B1 (https=)
TW (1) TWI438451B (https=)
WO (1) WO2006102006A2 (https=)

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JP2014102200A (ja) * 2012-11-21 2014-06-05 Fujitsu Ltd 試験装置
JPWO2021220602A1 (https=) * 2019-08-29 2021-11-04

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JP4632122B2 (ja) * 2004-12-16 2011-02-16 エルピーダメモリ株式会社 モジュール
US7609080B2 (en) * 2005-03-22 2009-10-27 Formfactor, Inc. Voltage fault detection and protection
JP2007309733A (ja) * 2006-05-17 2007-11-29 Matsushita Electric Ind Co Ltd 半導体集積回路および半導体集積回路の検査方法
US7423446B2 (en) * 2006-08-03 2008-09-09 International Business Machines Corporation Characterization array and method for determining threshold voltage variation
US8476735B2 (en) * 2007-05-29 2013-07-02 Taiwan Semiconductor Manufacturing Company, Ltd. Programmable semiconductor interposer for electronic package and method of forming
JP5351389B2 (ja) * 2007-06-06 2013-11-27 日本電子材料株式会社 プローブカード
JP4589954B2 (ja) * 2007-10-03 2010-12-01 株式会社東京カソード研究所 過電流保護回路およびプローブ装置
US8862426B2 (en) * 2007-12-20 2014-10-14 International Business Machines Corporation Method and test system for fast determination of parameter variation statistics
KR100981046B1 (ko) * 2008-02-13 2010-09-10 두산중공업 주식회사 접지 오류 감지기
US7868640B2 (en) * 2008-04-02 2011-01-11 International Business Machines Corporation Array-based early threshold voltage recovery characterization measurement
US8154315B2 (en) * 2008-04-08 2012-04-10 Formfactor, Inc. Self-referencing voltage regulator
US7924035B2 (en) * 2008-07-15 2011-04-12 Formfactor, Inc. Probe card assembly for electronic device testing with DC test resource sharing
US8344746B2 (en) * 2008-09-29 2013-01-01 Thermo Fisher Scientific Inc. Probe interface for electrostatic discharge testing of an integrated circuit
US9097758B2 (en) 2009-03-31 2015-08-04 Freescale Semiconductor, Inc. Connection quality verification for integrated circuit test
US8098076B2 (en) * 2009-04-01 2012-01-17 Formfactor, Inc. Method and apparatus for terminating a test signal applied to multiple semiconductor loads under test
JP5206571B2 (ja) * 2009-04-22 2013-06-12 富士通セミコンダクター株式会社 グランドオープン検出回路を有する集積回路装置
US8400176B2 (en) * 2009-08-18 2013-03-19 Formfactor, Inc. Wafer level contactor
CN106684807B (zh) * 2010-06-01 2019-10-15 威巴斯托充电系统公司 公用设施接地侦测
US20130159792A1 (en) * 2011-01-24 2013-06-20 Robert Brooks Fault detection
US9391447B2 (en) 2012-03-06 2016-07-12 Intel Corporation Interposer to regulate current for wafer test tooling
US20140070831A1 (en) * 2012-08-27 2014-03-13 Advantest Corporation System and method of protecting probes by using an intelligent current sensing switch
US8937794B2 (en) * 2012-09-28 2015-01-20 Intel Corporation Sort probe over current protection mechanism
AT515818B1 (de) * 2014-05-16 2016-08-15 Omicron Electronics Gmbh Verfahren und System zum Prüfen einer Schaltanlage für Energieübertragungsanlagen
TWI704352B (zh) * 2015-03-13 2020-09-11 義大利商探針科技公司 測試頭之接觸探針
TWI608348B (zh) * 2015-11-20 2017-12-11 Detection circuit
US9784788B2 (en) * 2015-11-27 2017-10-10 Micron Technology, Inc. Fault isolation system and method for detecting faults in a circuit
US9974452B2 (en) * 2015-12-29 2018-05-22 Synaptics Incorporated Inductive non-contact resistance measurement
PE20190077A1 (es) * 2016-05-13 2019-01-14 Weir Minerals Australia Ltd Componente que indica el desgaste y metodo de monitoreo del desgaste
US10255468B2 (en) * 2016-10-28 2019-04-09 Avery Dennison Retail Information Services, Llc Transmission RFID test systems
US10267833B2 (en) * 2016-11-02 2019-04-23 Equinix, Inc. Power monitoring probe for monitoring power distribution in an electrical system
US10317428B2 (en) * 2016-11-02 2019-06-11 Intel Corporation Probe connector for a probing pad structure around a thermal attach mounting hole
US10203363B2 (en) * 2016-12-14 2019-02-12 General Electric Company DC leakage current detector and method of operation thereof for leakage current detection in DC power circuits
KR102637795B1 (ko) * 2017-02-10 2024-02-19 에스케이하이닉스 주식회사 반도체 장치
CN115210582A (zh) * 2020-03-10 2022-10-18 维耶尔公司 用于微型器件检测的耦合探针
CN114167153B (zh) * 2020-09-10 2025-02-11 台湾积体电路制造股份有限公司 用于测量环境静电的装置及方法与环境静电监控系统
KR20240139442A (ko) 2023-03-14 2024-09-23 삼성전자주식회사 테스트 장치 및 이를 포함하는 테스트 방법

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US6577148B1 (en) * 1994-08-31 2003-06-10 Motorola, Inc. Apparatus, method, and wafer used for testing integrated circuits formed on a product wafer
US5600257A (en) * 1995-08-09 1997-02-04 International Business Machines Corporation Semiconductor wafer test and burn-in
AU1678697A (en) * 1996-02-06 1997-08-28 Telefonaktiebolaget Lm Ericsson (Publ) Assembly and method for testing integrated circuit devices
IT1285299B1 (it) * 1996-03-06 1998-06-03 Cselt Centro Studi Lab Telecom Sonda per dispositivi attuatori di guasto
DE19735743A1 (de) * 1997-08-18 1999-02-25 Siemens Ag Fehlerstrom-Schutzeinrichtung
US6201383B1 (en) * 1998-01-22 2001-03-13 International Business Machines Corporation Method and apparatus for determining short circuit conditions using a gang probe circuit tester
US6657455B2 (en) * 2000-01-18 2003-12-02 Formfactor, Inc. Predictive, adaptive power supply for an integrated circuit under test
JP2002124552A (ja) * 2000-10-13 2002-04-26 Seiko Instruments Inc プローブカード及び半導体検査装置
JP2002158265A (ja) * 2000-11-20 2002-05-31 Advantest Corp 電子デバイスの試験装置及び試験方法
SE518250C2 (sv) * 2001-01-29 2002-09-17 Abb Ab Anordning och system för övervakning av en eller flera till ett elkraftnät anslutna avledare
JP4020305B2 (ja) * 2002-08-12 2007-12-12 株式会社シバソク 試験装置
JP4456325B2 (ja) * 2002-12-12 2010-04-28 東京エレクトロン株式会社 検査方法及び検査装置
US6897666B2 (en) * 2002-12-31 2005-05-24 Intel Corporation Embedded voltage regulator and active transient control device in probe head for improved power delivery and method
US6977493B2 (en) * 2004-03-11 2005-12-20 Santronics, Inc. Electrical power probe for testing and supplying power to electrical wiring and devices
US8581610B2 (en) * 2004-04-21 2013-11-12 Charles A Miller Method of designing an application specific probe card test system
US7609080B2 (en) * 2005-03-22 2009-10-27 Formfactor, Inc. Voltage fault detection and protection
US7557592B2 (en) * 2006-06-06 2009-07-07 Formfactor, Inc. Method of expanding tester drive and measurement capability

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014102200A (ja) * 2012-11-21 2014-06-05 Fujitsu Ltd 試験装置
JPWO2021220602A1 (https=) * 2019-08-29 2021-11-04
WO2021220602A1 (ja) * 2019-08-29 2021-11-04 三菱電機株式会社 半導体試験装置、半導体試験方法および半導体装置の製造方法
JP7370459B2 (ja) 2019-08-29 2023-10-27 三菱電機株式会社 半導体試験装置、半導体試験方法および半導体装置の製造方法

Also Published As

Publication number Publication date
KR101238529B1 (ko) 2013-02-28
WO2006102006A2 (en) 2006-09-28
EP1869479A4 (en) 2012-06-27
US7609080B2 (en) 2009-10-27
TWI438451B (zh) 2014-05-21
KR20070121010A (ko) 2007-12-26
TW200641375A (en) 2006-12-01
US20100039739A1 (en) 2010-02-18
US20060217906A1 (en) 2006-09-28
EP1869479A2 (en) 2007-12-26
WO2006102006A3 (en) 2009-04-09

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