TWI438451B - 用於故障偵測與防護之電子設備 - Google Patents

用於故障偵測與防護之電子設備 Download PDF

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Publication number
TWI438451B
TWI438451B TW095109690A TW95109690A TWI438451B TW I438451 B TWI438451 B TW I438451B TW 095109690 A TW095109690 A TW 095109690A TW 95109690 A TW95109690 A TW 95109690A TW I438451 B TWI438451 B TW I438451B
Authority
TW
Taiwan
Prior art keywords
probe
power
electronic device
voltage
card assembly
Prior art date
Application number
TW095109690A
Other languages
English (en)
Chinese (zh)
Other versions
TW200641375A (en
Inventor
米勒 查理斯
巴巴拉 布魯斯
Original Assignee
佛姆費克特股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 佛姆費克特股份有限公司 filed Critical 佛姆費克特股份有限公司
Publication of TW200641375A publication Critical patent/TW200641375A/zh
Application granted granted Critical
Publication of TWI438451B publication Critical patent/TWI438451B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/36—Overload-protection arrangements or circuits for electric measuring instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Measuring Leads Or Probes (AREA)
TW095109690A 2005-03-22 2006-03-21 用於故障偵測與防護之電子設備 TWI438451B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59424805P 2005-03-22 2005-03-22
US11/306,186 US7609080B2 (en) 2005-03-22 2005-12-19 Voltage fault detection and protection

Publications (2)

Publication Number Publication Date
TW200641375A TW200641375A (en) 2006-12-01
TWI438451B true TWI438451B (zh) 2014-05-21

Family

ID=37024398

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095109690A TWI438451B (zh) 2005-03-22 2006-03-21 用於故障偵測與防護之電子設備

Country Status (6)

Country Link
US (2) US7609080B2 (https=)
EP (1) EP1869479A4 (https=)
JP (1) JP2008545949A (https=)
KR (1) KR101238529B1 (https=)
TW (1) TWI438451B (https=)
WO (1) WO2006102006A2 (https=)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4632122B2 (ja) * 2004-12-16 2011-02-16 エルピーダメモリ株式会社 モジュール
US7609080B2 (en) * 2005-03-22 2009-10-27 Formfactor, Inc. Voltage fault detection and protection
JP2007309733A (ja) * 2006-05-17 2007-11-29 Matsushita Electric Ind Co Ltd 半導体集積回路および半導体集積回路の検査方法
US7423446B2 (en) * 2006-08-03 2008-09-09 International Business Machines Corporation Characterization array and method for determining threshold voltage variation
US8476735B2 (en) * 2007-05-29 2013-07-02 Taiwan Semiconductor Manufacturing Company, Ltd. Programmable semiconductor interposer for electronic package and method of forming
JP5351389B2 (ja) * 2007-06-06 2013-11-27 日本電子材料株式会社 プローブカード
JP4589954B2 (ja) * 2007-10-03 2010-12-01 株式会社東京カソード研究所 過電流保護回路およびプローブ装置
US8862426B2 (en) * 2007-12-20 2014-10-14 International Business Machines Corporation Method and test system for fast determination of parameter variation statistics
KR100981046B1 (ko) * 2008-02-13 2010-09-10 두산중공업 주식회사 접지 오류 감지기
US7868640B2 (en) * 2008-04-02 2011-01-11 International Business Machines Corporation Array-based early threshold voltage recovery characterization measurement
US8154315B2 (en) * 2008-04-08 2012-04-10 Formfactor, Inc. Self-referencing voltage regulator
US7924035B2 (en) * 2008-07-15 2011-04-12 Formfactor, Inc. Probe card assembly for electronic device testing with DC test resource sharing
US8344746B2 (en) * 2008-09-29 2013-01-01 Thermo Fisher Scientific Inc. Probe interface for electrostatic discharge testing of an integrated circuit
US9097758B2 (en) 2009-03-31 2015-08-04 Freescale Semiconductor, Inc. Connection quality verification for integrated circuit test
US8098076B2 (en) * 2009-04-01 2012-01-17 Formfactor, Inc. Method and apparatus for terminating a test signal applied to multiple semiconductor loads under test
JP5206571B2 (ja) * 2009-04-22 2013-06-12 富士通セミコンダクター株式会社 グランドオープン検出回路を有する集積回路装置
US8400176B2 (en) * 2009-08-18 2013-03-19 Formfactor, Inc. Wafer level contactor
CN106684807B (zh) * 2010-06-01 2019-10-15 威巴斯托充电系统公司 公用设施接地侦测
US20130159792A1 (en) * 2011-01-24 2013-06-20 Robert Brooks Fault detection
US9391447B2 (en) 2012-03-06 2016-07-12 Intel Corporation Interposer to regulate current for wafer test tooling
US20140070831A1 (en) * 2012-08-27 2014-03-13 Advantest Corporation System and method of protecting probes by using an intelligent current sensing switch
US8937794B2 (en) * 2012-09-28 2015-01-20 Intel Corporation Sort probe over current protection mechanism
JP6044297B2 (ja) * 2012-11-21 2016-12-14 富士通株式会社 試験装置
AT515818B1 (de) * 2014-05-16 2016-08-15 Omicron Electronics Gmbh Verfahren und System zum Prüfen einer Schaltanlage für Energieübertragungsanlagen
TWI704352B (zh) * 2015-03-13 2020-09-11 義大利商探針科技公司 測試頭之接觸探針
TWI608348B (zh) * 2015-11-20 2017-12-11 Detection circuit
US9784788B2 (en) * 2015-11-27 2017-10-10 Micron Technology, Inc. Fault isolation system and method for detecting faults in a circuit
US9974452B2 (en) * 2015-12-29 2018-05-22 Synaptics Incorporated Inductive non-contact resistance measurement
PE20190077A1 (es) * 2016-05-13 2019-01-14 Weir Minerals Australia Ltd Componente que indica el desgaste y metodo de monitoreo del desgaste
US10255468B2 (en) * 2016-10-28 2019-04-09 Avery Dennison Retail Information Services, Llc Transmission RFID test systems
US10267833B2 (en) * 2016-11-02 2019-04-23 Equinix, Inc. Power monitoring probe for monitoring power distribution in an electrical system
US10317428B2 (en) * 2016-11-02 2019-06-11 Intel Corporation Probe connector for a probing pad structure around a thermal attach mounting hole
US10203363B2 (en) * 2016-12-14 2019-02-12 General Electric Company DC leakage current detector and method of operation thereof for leakage current detection in DC power circuits
KR102637795B1 (ko) * 2017-02-10 2024-02-19 에스케이하이닉스 주식회사 반도체 장치
JP2021039086A (ja) * 2019-08-29 2021-03-11 三菱電機株式会社 半導体試験装置、半導体試験方法および半導体装置の製造方法
CN115210582A (zh) * 2020-03-10 2022-10-18 维耶尔公司 用于微型器件检测的耦合探针
CN114167153B (zh) * 2020-09-10 2025-02-11 台湾积体电路制造股份有限公司 用于测量环境静电的装置及方法与环境静电监控系统
KR20240139442A (ko) 2023-03-14 2024-09-23 삼성전자주식회사 테스트 장치 및 이를 포함하는 테스트 방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6577148B1 (en) * 1994-08-31 2003-06-10 Motorola, Inc. Apparatus, method, and wafer used for testing integrated circuits formed on a product wafer
US5600257A (en) * 1995-08-09 1997-02-04 International Business Machines Corporation Semiconductor wafer test and burn-in
AU1678697A (en) * 1996-02-06 1997-08-28 Telefonaktiebolaget Lm Ericsson (Publ) Assembly and method for testing integrated circuit devices
IT1285299B1 (it) * 1996-03-06 1998-06-03 Cselt Centro Studi Lab Telecom Sonda per dispositivi attuatori di guasto
DE19735743A1 (de) * 1997-08-18 1999-02-25 Siemens Ag Fehlerstrom-Schutzeinrichtung
US6201383B1 (en) * 1998-01-22 2001-03-13 International Business Machines Corporation Method and apparatus for determining short circuit conditions using a gang probe circuit tester
US6657455B2 (en) * 2000-01-18 2003-12-02 Formfactor, Inc. Predictive, adaptive power supply for an integrated circuit under test
JP2002124552A (ja) * 2000-10-13 2002-04-26 Seiko Instruments Inc プローブカード及び半導体検査装置
JP2002158265A (ja) * 2000-11-20 2002-05-31 Advantest Corp 電子デバイスの試験装置及び試験方法
SE518250C2 (sv) * 2001-01-29 2002-09-17 Abb Ab Anordning och system för övervakning av en eller flera till ett elkraftnät anslutna avledare
JP4020305B2 (ja) * 2002-08-12 2007-12-12 株式会社シバソク 試験装置
JP4456325B2 (ja) * 2002-12-12 2010-04-28 東京エレクトロン株式会社 検査方法及び検査装置
US6897666B2 (en) * 2002-12-31 2005-05-24 Intel Corporation Embedded voltage regulator and active transient control device in probe head for improved power delivery and method
US6977493B2 (en) * 2004-03-11 2005-12-20 Santronics, Inc. Electrical power probe for testing and supplying power to electrical wiring and devices
US8581610B2 (en) * 2004-04-21 2013-11-12 Charles A Miller Method of designing an application specific probe card test system
US7609080B2 (en) * 2005-03-22 2009-10-27 Formfactor, Inc. Voltage fault detection and protection
US7557592B2 (en) * 2006-06-06 2009-07-07 Formfactor, Inc. Method of expanding tester drive and measurement capability

Also Published As

Publication number Publication date
KR101238529B1 (ko) 2013-02-28
WO2006102006A2 (en) 2006-09-28
EP1869479A4 (en) 2012-06-27
US7609080B2 (en) 2009-10-27
KR20070121010A (ko) 2007-12-26
TW200641375A (en) 2006-12-01
US20100039739A1 (en) 2010-02-18
US20060217906A1 (en) 2006-09-28
EP1869479A2 (en) 2007-12-26
WO2006102006A3 (en) 2009-04-09
JP2008545949A (ja) 2008-12-18

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