JP2008543008A - 放出陰極の製造方法 - Google Patents
放出陰極の製造方法 Download PDFInfo
- Publication number
- JP2008543008A JP2008543008A JP2008514166A JP2008514166A JP2008543008A JP 2008543008 A JP2008543008 A JP 2008543008A JP 2008514166 A JP2008514166 A JP 2008514166A JP 2008514166 A JP2008514166 A JP 2008514166A JP 2008543008 A JP2008543008 A JP 2008543008A
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- layer
- cathode
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- etching
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000004020 conductor Substances 0.000 claims abstract description 103
- 238000005530 etching Methods 0.000 claims abstract description 56
- 238000000151 deposition Methods 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims description 305
- 239000011347 resin Substances 0.000 claims description 59
- 229920005989 resin Polymers 0.000 claims description 59
- 238000000034 method Methods 0.000 claims description 40
- 239000003054 catalyst Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 14
- 238000001459 lithography Methods 0.000 claims description 13
- 230000004888 barrier function Effects 0.000 claims description 10
- 239000002071 nanotube Substances 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 5
- 239000002086 nanomaterial Substances 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 claims description 3
- 238000004090 dissolution Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000002070 nanowire Substances 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
- 238000000206 photolithography Methods 0.000 claims description 2
- 239000002344 surface layer Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 10
- 229910052750 molybdenum Inorganic materials 0.000 description 10
- 239000011733 molybdenum Substances 0.000 description 10
- 239000000377 silicon dioxide Substances 0.000 description 6
- 238000001020 plasma etching Methods 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 229910017855 NH 4 F Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/022—Manufacture of electrodes or electrode systems of cold cathodes
- H01J9/025—Manufacture of electrodes or electrode systems of cold cathodes of field emission cathodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/158—Carbon nanotubes
- C01B32/16—Preparation
- C01B32/162—Preparation characterised by catalysts
-
- D—TEXTILES; PAPER
- D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
- D01F—CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS; APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBON FILAMENTS
- D01F9/00—Artificial filaments or the like of other substances; Manufacture thereof; Apparatus specially adapted for the manufacture of carbon filaments
- D01F9/08—Artificial filaments or the like of other substances; Manufacture thereof; Apparatus specially adapted for the manufacture of carbon filaments of inorganic material
- D01F9/12—Carbon filaments; Apparatus specially adapted for the manufacture thereof
- D01F9/127—Carbon filaments; Apparatus specially adapted for the manufacture thereof by thermal decomposition of hydrocarbon gases or vapours or other carbon-containing compounds in the form of gas or vapour, e.g. carbon monoxide, alcohols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
- H01J1/30—Cold cathodes, e.g. field-emissive cathode
- H01J1/304—Field-emissive cathodes
- H01J1/3048—Distributed particle emitters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J31/00—Cathode ray tubes; Electron beam tubes
- H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
- H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
- H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
- H01J31/123—Flat display tubes
- H01J31/125—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection
- H01J31/127—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection using large area or array sources, i.e. essentially a source for each pixel group
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/481—Insulated gate field-effect transistors [IGFETs] characterised by the gate conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2201/00—Electrodes common to discharge tubes
- H01J2201/30—Cold cathodes
- H01J2201/304—Field emission cathodes
- H01J2201/30446—Field emission cathodes characterised by the emitter material
- H01J2201/30453—Carbon types
- H01J2201/30469—Carbon nanotubes (CNTs)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2201/00—Electrodes common to discharge tubes
- H01J2201/30—Cold cathodes
- H01J2201/319—Circuit elements associated with the emitters by direct integration
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/221—Carbon nanotubes
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Composite Materials (AREA)
- Textile Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Cold Cathode And The Manufacture (AREA)
- Carbon And Carbon Compounds (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0551412A FR2886284B1 (fr) | 2005-05-30 | 2005-05-30 | Procede de realisation de nanostructures |
| PCT/FR2006/050490 WO2007026086A2 (fr) | 2005-05-30 | 2006-05-29 | Procede de fabrication d'une cathode emissive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008543008A true JP2008543008A (ja) | 2008-11-27 |
| JP2008543008A5 JP2008543008A5 (enExample) | 2012-01-05 |
Family
ID=35520555
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008514166A Pending JP2008543008A (ja) | 2005-05-30 | 2006-05-29 | 放出陰極の製造方法 |
| JP2008514165A Active JP5247438B2 (ja) | 2005-05-30 | 2006-05-29 | ナノ構造物の製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008514165A Active JP5247438B2 (ja) | 2005-05-30 | 2006-05-29 | ナノ構造物の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US7785164B2 (enExample) |
| EP (2) | EP1885649A2 (enExample) |
| JP (2) | JP2008543008A (enExample) |
| FR (1) | FR2886284B1 (enExample) |
| WO (2) | WO2007003826A2 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2873852B1 (fr) | 2004-07-28 | 2011-06-24 | Commissariat Energie Atomique | Structure de cathode a haute resolution |
| US8172633B2 (en) * | 2006-04-05 | 2012-05-08 | Industry Academic Cooperation Fundation of Kyunghee University | Field emission display and manufacturing method of the same having selective array of electron emission source |
| KR100803194B1 (ko) * | 2006-06-30 | 2008-02-14 | 삼성에스디아이 주식회사 | 탄소나노튜브 구조체 형성방법 |
| CA2671663A1 (en) | 2006-12-19 | 2008-06-26 | Basf Coatings Ag | Coating compositions with high scratch resistance and weathering stability |
| DE102007061855A1 (de) | 2007-12-19 | 2009-06-25 | Basf Coatings Ag | Beschichtungsmittel mit hoher Kratzbeständigkeit und Witterungsstabilität |
| DE102007061856A1 (de) | 2007-12-19 | 2009-06-25 | Basf Coatings Ag | Beschichtungsmittel mit hoher Kratzbeständigkeit und Witterungsstabilität |
| DE102007061854A1 (de) | 2007-12-19 | 2009-06-25 | Basf Coatings Ag | Beschichtungsmittel mit hoher Kratzbeständigkeit und Witterungsstabilität |
| JP5187689B2 (ja) * | 2008-08-08 | 2013-04-24 | 学校法人 関西大学 | ナノワイヤ構造体、ナノワイヤ結合体、およびその製造方法 |
| JP5572944B2 (ja) * | 2008-12-18 | 2014-08-20 | 富士通株式会社 | 配線構造体の製造方法及び配線構造体 |
| DE102009024103A1 (de) | 2009-06-06 | 2010-12-09 | Basf Coatings Gmbh | Beschichtungsmittel und daraus hergestellte Beschichtungen mit hoher Kratzfestigkeit und hoher Kocherstabilität |
| CN102064063B (zh) * | 2010-12-24 | 2012-08-29 | 清华大学 | 场发射阴极装置及其制备方法 |
| EP2541581A1 (en) * | 2011-06-29 | 2013-01-02 | Khalid Waqas | Device comprising nanostructures and method of manufacturing thereof |
| WO2013037951A1 (en) * | 2011-09-16 | 2013-03-21 | Danmarks Tekniske Universitet | Catalyst deposition for the preparation of carbon nanotubes |
| CN105984862B (zh) * | 2015-02-16 | 2018-08-28 | 北京大学深圳研究生院 | 用于生长碳纳米管的方法 |
| JP7556246B2 (ja) | 2020-09-23 | 2024-09-26 | セイコーエプソン株式会社 | 発光装置、発光装置の製造方法およびプロジェクター |
| CN114426255B (zh) * | 2020-10-28 | 2025-03-04 | 中国科学技术大学 | 一种微纳米结构定点缺陷掺杂的方法及nv色心传感器 |
Citations (12)
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| JPH0684478A (ja) * | 1992-02-26 | 1994-03-25 | Commiss Energ Atom | マイクロポイント放出陰極電子源及びこの電子源を使用する電界放出励起陰極線ルミネセンス表示装置 |
| JPH08115654A (ja) * | 1994-10-14 | 1996-05-07 | Sony Corp | 粒子放出装置、電界放出型装置及びこれらの製造方法 |
| JP2000067736A (ja) * | 1998-08-14 | 2000-03-03 | Sony Corp | 電子放出素子およびその製造方法、ならびにこれを用いたディスプレイ装置 |
| JP2000123713A (ja) * | 1998-10-15 | 2000-04-28 | Sony Corp | 電子放出素子およびその製造方法、ならびにこれを用いたディスプレイ装置 |
| JP2000323012A (ja) * | 1999-05-10 | 2000-11-24 | Futaba Corp | 電界放出素子 |
| JP2001023506A (ja) * | 1999-07-07 | 2001-01-26 | Sony Corp | 電子放出源およびその製造方法ならびにディスプレイ装置 |
| JP2001236879A (ja) * | 2000-01-07 | 2001-08-31 | Samsung Sdi Co Ltd | カーボンナノチューブを用いた3極電界放出素子の製造方法 |
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| JP2004288561A (ja) * | 2003-03-25 | 2004-10-14 | Mitsubishi Electric Corp | 冷陰極電子源の製造方法 |
| JP2005078850A (ja) * | 2003-08-28 | 2005-03-24 | Ulvac Japan Ltd | 炭素系超微細冷陰極およびその製造方法 |
| JP2008508665A (ja) * | 2004-07-28 | 2008-03-21 | コミツサリア タ レネルジー アトミーク | 高解像度陰極構造 |
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- 2005-05-30 FR FR0551412A patent/FR2886284B1/fr not_active Expired - Fee Related
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2006
- 2006-05-29 US US11/915,222 patent/US7785164B2/en not_active Expired - Fee Related
- 2006-05-29 EP EP06820247A patent/EP1885649A2/fr not_active Withdrawn
- 2006-05-29 WO PCT/FR2006/050489 patent/WO2007003826A2/fr not_active Ceased
- 2006-05-29 JP JP2008514166A patent/JP2008543008A/ja active Pending
- 2006-05-29 JP JP2008514165A patent/JP5247438B2/ja active Active
- 2006-05-29 EP EP06794468.6A patent/EP1885648B1/fr not_active Not-in-force
- 2006-05-29 WO PCT/FR2006/050490 patent/WO2007026086A2/fr not_active Ceased
- 2006-05-29 US US11/915,238 patent/US7993703B2/en not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2007003826A2 (fr) | 2007-01-11 |
| EP1885648B1 (fr) | 2018-08-29 |
| US20080197766A1 (en) | 2008-08-21 |
| JP5247438B2 (ja) | 2013-07-24 |
| US7785164B2 (en) | 2010-08-31 |
| JP2008546146A (ja) | 2008-12-18 |
| EP1885648A2 (fr) | 2008-02-13 |
| WO2007003826A3 (fr) | 2007-04-12 |
| US7993703B2 (en) | 2011-08-09 |
| WO2007026086A3 (fr) | 2007-05-31 |
| FR2886284A1 (fr) | 2006-12-01 |
| EP1885649A2 (fr) | 2008-02-13 |
| US20080194168A1 (en) | 2008-08-14 |
| WO2007026086A2 (fr) | 2007-03-08 |
| FR2886284B1 (fr) | 2007-06-29 |
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