JP2008538855A5 - - Google Patents

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Publication number
JP2008538855A5
JP2008538855A5 JP2007554152A JP2007554152A JP2008538855A5 JP 2008538855 A5 JP2008538855 A5 JP 2008538855A5 JP 2007554152 A JP2007554152 A JP 2007554152A JP 2007554152 A JP2007554152 A JP 2007554152A JP 2008538855 A5 JP2008538855 A5 JP 2008538855A5
Authority
JP
Japan
Prior art keywords
substrate
cover sheet
press
cooling fluid
conduit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007554152A
Other languages
English (en)
Japanese (ja)
Other versions
JP4607194B2 (ja
JP2008538855A (ja
Filing date
Publication date
Priority claimed from US11/050,303 external-priority patent/US7128801B2/en
Application filed filed Critical
Publication of JP2008538855A publication Critical patent/JP2008538855A/ja
Publication of JP2008538855A5 publication Critical patent/JP2008538855A5/ja
Application granted granted Critical
Publication of JP4607194B2 publication Critical patent/JP4607194B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007554152A 2005-02-03 2006-01-31 電気回路の回路素子を、該回路素子がその上に搭載される基板とカバーシートとの間に、密封するための装置 Expired - Fee Related JP4607194B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/050,303 US7128801B2 (en) 2005-02-03 2005-02-03 Method and apparatus for sealing flex circuits having heat sensitive circuit elements
PCT/US2006/003245 WO2006083773A2 (en) 2005-02-03 2006-01-31 Method and apparatus for sealing flex circuits having heat sensitive circuit elements

Publications (3)

Publication Number Publication Date
JP2008538855A JP2008538855A (ja) 2008-11-06
JP2008538855A5 true JP2008538855A5 (enExample) 2008-12-18
JP4607194B2 JP4607194B2 (ja) 2011-01-05

Family

ID=36755257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007554152A Expired - Fee Related JP4607194B2 (ja) 2005-02-03 2006-01-31 電気回路の回路素子を、該回路素子がその上に搭載される基板とカバーシートとの間に、密封するための装置

Country Status (7)

Country Link
US (2) US7128801B2 (enExample)
EP (1) EP1848578B1 (enExample)
JP (1) JP4607194B2 (enExample)
KR (1) KR100902436B1 (enExample)
CN (1) CN101146665B (enExample)
CA (1) CA2596440C (enExample)
WO (1) WO2006083773A2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
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EP1972289B1 (en) 2007-03-23 2018-10-17 coLigne AG Elongated stabilization member and bone anchor useful in bone and especially spinal repair processes
US20090011192A1 (en) * 2007-07-03 2009-01-08 John Tomczyk Method, system, and apparatus for producing dimensional image articles utilizing a cushioning assembly
US8014167B2 (en) * 2007-09-07 2011-09-06 Seagate Technology Llc Liquid crystal material sealed housing
US20090105532A1 (en) * 2007-10-22 2009-04-23 Zvika Gilad In vivo imaging device and method of manufacturing thereof
US20090188105A1 (en) * 2008-01-28 2009-07-30 Ming-Chin Chien Slim battery packaging method
US8231692B2 (en) * 2008-11-06 2012-07-31 International Business Machines Corporation Method for manufacturing an electronic device
US8279552B2 (en) * 2010-06-22 2012-10-02 Hitachi Global Storage Technologies, Netherlands B.V. Hermetically sealing a hard disk drive
EP2540500B1 (de) 2011-06-28 2016-10-26 Actilor Intellectual Asset AG Laminationsvorrichtung und -verfahren für Folien mit temperaturempfindlichen Elementen sowie damit hergestellte Dokumente
AU2014228643A1 (en) 2013-03-12 2015-10-15 Cardiac Pacemakers, Inc. Implantable medical device and assembly thereof
WO2015027348A1 (en) * 2013-08-29 2015-03-05 Jaquet Technology Group Ag Sensor device for determining rotational speed of a rotatable object and turbocharger with such a sensor device
US9282650B2 (en) * 2013-12-18 2016-03-08 Intel Corporation Thermal compression bonding process cooling manifold
US10192847B2 (en) * 2014-06-12 2019-01-29 Asm Technology Singapore Pte Ltd Rapid cooling system for a bond head heater
US12490387B2 (en) * 2019-02-18 2025-12-02 Jabil Inc. Adhesive circuit patterning process

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51109036A (ja) * 1975-03-20 1976-09-27 Yasuo Saito Ototsumennopuresusetsuchakusochi
DE3611839A1 (de) * 1986-04-09 1987-10-15 Siempelkamp Gmbh & Co Verfahren zum herstellen einer durch ein fluides medium beheizbaren pressenplatte
JP2787581B2 (ja) * 1988-10-31 1998-08-20 株式会社小松製作所 プラスチック圧縮成形機の温度調節装置
JP3230833B2 (ja) * 1992-03-27 2001-11-19 日立テクノエンジニアリング株式会社 ホットプレス
JP2001501547A (ja) 1992-06-12 2001-02-06 アルミナム カンパニー オブ アメリカ 非平面を有する多層構造の製造方法
JPH07195391A (ja) * 1993-12-28 1995-08-01 Hitachi Techno Eng Co Ltd ホットプレス
JPH07242085A (ja) * 1994-03-01 1995-09-19 Mitsubishi Electric Corp Ｉｃカードの製造方法及びｉｃカード
US5827999A (en) * 1994-05-26 1998-10-27 Amkor Electronics, Inc. Homogeneous chip carrier package
US20020079053A1 (en) * 1994-09-21 2002-06-27 Yamauchi Corporation Cushioning material for forming press
US6320257B1 (en) * 1994-09-27 2001-11-20 Foster-Miller, Inc. Chip packaging technique
US5993593A (en) * 1996-12-03 1999-11-30 Heat Sealing Technology, Inc. High-temperature, heat-sealed products and methods and means for their manufacture
US6110321A (en) * 1997-02-28 2000-08-29 General Electric Company Method for sealing an ultracapacitor, and related articles
JP3098003B2 (ja) * 1998-09-24 2000-10-10 日清紡績株式会社 太陽電池におけるラミネート装置
JP2000117493A (ja) * 1998-10-15 2000-04-25 Kitagawa Elaborate Mach Co Ltd 熱圧プレス装置における定盤冷却システム
JP4138995B2 (ja) * 1999-03-31 2008-08-27 株式会社クラレ 回路基板およびその製造方法
DE19920577C1 (de) * 1999-05-04 2001-01-04 Wemhoener Heinrich Gmbh Co Membranpresse
AU2002227246A1 (en) 2000-12-14 2002-06-24 World Properties Inc. Liquid crystalline polymer bond plies and circuits formed therefrom
JP2002217523A (ja) * 2001-01-23 2002-08-02 Tdk Corp 電子装置の製造方法
JP4513235B2 (ja) * 2001-05-31 2010-07-28 ソニー株式会社 フリップチップ実装装置
US6675852B2 (en) * 2001-06-15 2004-01-13 International Business Machines Corporation Platen for use in laminating press
US6977187B2 (en) 2002-06-19 2005-12-20 Foster-Miller, Inc. Chip package sealing method
US7768619B2 (en) * 2004-08-03 2010-08-03 Harris Corporation Method and apparatus for sealing flex circuits made with an LCP substrate

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