|
US7327024B2
(en)
*
|
2004-11-24 |
2008-02-05 |
General Electric Company |
Power module, and phase leg assembly
|
|
US7190581B1
(en)
|
2005-01-11 |
2007-03-13 |
Midwest Research Institute |
Low thermal resistance power module assembly
|
|
EP1891672A2
(en)
*
|
2005-03-22 |
2008-02-27 |
Bharat Heavy Electricals Lilmited |
Selectively grooved cold plate for electronics cooling
|
|
US7331378B2
(en)
*
|
2006-01-17 |
2008-02-19 |
Delphi Technologies, Inc. |
Microchannel heat sink
|
|
US7515415B2
(en)
*
|
2006-02-02 |
2009-04-07 |
Sun Microsystems, Inc. |
Embedded microchannel cooling package for a central processor unit
|
|
US20070259523A1
(en)
*
|
2006-05-04 |
2007-11-08 |
Yechuri Sitaramarao S |
Method of fabricating high speed integrated circuits
|
|
KR100737162B1
(ko)
*
|
2006-08-11 |
2007-07-06 |
동부일렉트로닉스 주식회사 |
반도체 소자 및 그 제조방법
|
|
US7762314B2
(en)
*
|
2007-04-24 |
2010-07-27 |
International Business Machines Corporation |
Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways
|
|
US8479806B2
(en)
*
|
2007-11-30 |
2013-07-09 |
University Of Hawaii |
Two-phase cross-connected micro-channel heat sink
|
|
US20090151893A1
(en)
*
|
2007-12-13 |
2009-06-18 |
International Business Machines Corporation |
High performance compliant thermal interface cooling structures
|
|
US8302671B2
(en)
|
2008-04-29 |
2012-11-06 |
Raytheon Company |
Scaleable parallel flow micro-channel heat exchanger and method for manufacturing same
|
|
EP2291599A4
(en)
*
|
2008-04-29 |
2014-05-14 |
Carrier Corp |
MODULAR HEAT EXCHANGER
|
|
US8472193B2
(en)
*
|
2008-07-04 |
2013-06-25 |
Kabushiki Kaisha Toyota Jidoshokki |
Semiconductor device
|
|
US8807203B2
(en)
|
2008-07-21 |
2014-08-19 |
The Regents Of The University Of California |
Titanium-based thermal ground plane
|
|
US20100038774A1
(en)
*
|
2008-08-18 |
2010-02-18 |
General Electric Company |
Advanced and integrated cooling for press-packages
|
|
US8120915B2
(en)
*
|
2008-08-18 |
2012-02-21 |
General Electric Company |
Integral heat sink with spiral manifolds
|
|
US7817422B2
(en)
*
|
2008-08-18 |
2010-10-19 |
General Electric Company |
Heat sink and cooling and packaging stack for press-packages
|
|
US8929071B2
(en)
*
|
2008-12-22 |
2015-01-06 |
General Electric Company |
Low cost manufacturing of micro-channel heatsink
|
|
US20100175857A1
(en)
*
|
2009-01-15 |
2010-07-15 |
General Electric Company |
Millichannel heat sink, and stack and apparatus using the same
|
|
KR20120042713A
(ko)
|
2009-02-04 |
2012-05-03 |
퍼듀 리서치 파운데이션 |
금속 수소화물 저장 시스템용 코일형 마이크로채널 열교환기
|
|
WO2010091171A1
(en)
|
2009-02-04 |
2010-08-12 |
Purdue Research Foundation |
Finned heat exchangers for metal hydride storage systems
|
|
DE102009010256A1
(de)
*
|
2009-02-24 |
2010-08-26 |
Jungheinrich Aktiengesellschaft |
Leiterplatte mit Kühlkörper
|
|
US7898807B2
(en)
*
|
2009-03-09 |
2011-03-01 |
General Electric Company |
Methods for making millichannel substrate, and cooling device and apparatus using the substrate
|
|
US8358000B2
(en)
*
|
2009-03-13 |
2013-01-22 |
General Electric Company |
Double side cooled power module with power overlay
|
|
US7929306B2
(en)
*
|
2009-03-31 |
2011-04-19 |
Alcatel-Lucent Usa Inc. |
Circuit pack cooling solution
|
|
US20100302734A1
(en)
*
|
2009-05-29 |
2010-12-02 |
General Electric Company |
Heatsink and method of fabricating same
|
|
US8582298B2
(en)
*
|
2009-06-22 |
2013-11-12 |
Xyber Technologies |
Passive cooling enclosure system and method for electronics devices
|
|
CN101599471B
(zh)
*
|
2009-06-29 |
2012-05-23 |
浙江工业大学 |
一种功率器件的散热结构及其制造方法
|
|
US8345720B2
(en)
|
2009-07-28 |
2013-01-01 |
Northrop Grumman Systems Corp. |
Laser diode ceramic cooler having circuitry for control and feedback of laser diode performance
|
|
US20110024150A1
(en)
*
|
2009-07-31 |
2011-02-03 |
General Electric Company |
Cooling system and method for current carrying conductor
|
|
US9157581B2
(en)
|
2009-10-05 |
2015-10-13 |
Lighting Science Group Corporation |
Low profile luminaire with light guide and associated systems and methods
|
|
US9581756B2
(en)
|
2009-10-05 |
2017-02-28 |
Lighting Science Group Corporation |
Light guide for low profile luminaire
|
|
US8522569B2
(en)
*
|
2009-10-27 |
2013-09-03 |
Industrial Idea Partners, Inc. |
Utilization of data center waste heat for heat driven engine
|
|
CN102076203B
(zh)
*
|
2009-11-24 |
2015-11-25 |
通用电气公司 |
用于紧压包装的散热器和冷却及包装叠层
|
|
US9596785B2
(en)
*
|
2010-03-22 |
2017-03-14 |
Pratt & Whitney Canada Corp. |
Heat exchanger
|
|
EP2395549B1
(en)
*
|
2010-06-10 |
2014-06-25 |
Imec |
Device for cooling integrated circuits
|
|
US8218320B2
(en)
|
2010-06-29 |
2012-07-10 |
General Electric Company |
Heat sinks with C-shaped manifolds and millichannel cooling
|
|
US9827439B2
(en)
|
2010-07-23 |
2017-11-28 |
Biological Illumination, Llc |
System for dynamically adjusting circadian rhythm responsive to scheduled events and associated methods
|
|
US8760370B2
(en)
|
2011-05-15 |
2014-06-24 |
Lighting Science Group Corporation |
System for generating non-homogenous light and associated methods
|
|
US9532423B2
(en)
|
2010-07-23 |
2016-12-27 |
Lighting Science Group Corporation |
System and methods for operating a lighting device
|
|
US8465167B2
(en)
|
2011-09-16 |
2013-06-18 |
Lighting Science Group Corporation |
Color conversion occlusion and associated methods
|
|
US9024536B2
(en)
|
2011-12-05 |
2015-05-05 |
Biological Illumination, Llc |
Tunable LED lamp for producing biologically-adjusted light and associated methods
|
|
US9681522B2
(en)
|
2012-05-06 |
2017-06-13 |
Lighting Science Group Corporation |
Adaptive light system and associated methods
|
|
US8743023B2
(en)
|
2010-07-23 |
2014-06-03 |
Biological Illumination, Llc |
System for generating non-homogenous biologically-adjusted light and associated methods
|
|
US8841864B2
(en)
|
2011-12-05 |
2014-09-23 |
Biological Illumination, Llc |
Tunable LED lamp for producing biologically-adjusted light
|
|
US8686641B2
(en)
|
2011-12-05 |
2014-04-01 |
Biological Illumination, Llc |
Tunable LED lamp for producing biologically-adjusted light
|
|
US9252069B2
(en)
|
2010-08-31 |
2016-02-02 |
Teledyne Scientific & Imaging, Llc |
High power module cooling system
|
|
US8514901B2
(en)
*
|
2010-11-02 |
2013-08-20 |
Gerald Ho Kim |
Silicon-based cooling package for laser gain medium
|
|
US8401231B2
(en)
|
2010-11-09 |
2013-03-19 |
Biological Illumination, Llc |
Sustainable outdoor lighting system for use in environmentally photo-sensitive area
|
|
US8384984B2
(en)
|
2011-03-28 |
2013-02-26 |
Lighting Science Group Corporation |
MEMS wavelength converting lighting device and associated methods
|
|
US9151482B2
(en)
|
2011-05-13 |
2015-10-06 |
Lighting Science Group Corporation |
Sealed electrical device with cooling system
|
|
US8608348B2
(en)
|
2011-05-13 |
2013-12-17 |
Lighting Science Group Corporation |
Sealed electrical device with cooling system and associated methods
|
|
US9360202B2
(en)
|
2011-05-13 |
2016-06-07 |
Lighting Science Group Corporation |
System for actively cooling an LED filament and associated methods
|
|
US9173269B2
(en)
|
2011-05-15 |
2015-10-27 |
Lighting Science Group Corporation |
Lighting system for accentuating regions of a layer and associated methods
|
|
US8901850B2
(en)
|
2012-05-06 |
2014-12-02 |
Lighting Science Group Corporation |
Adaptive anti-glare light system and associated methods
|
|
US8754832B2
(en)
|
2011-05-15 |
2014-06-17 |
Lighting Science Group Corporation |
Lighting system for accenting regions of a layer and associated methods
|
|
US8982558B2
(en)
|
2011-06-24 |
2015-03-17 |
General Electric Company |
Cooling device for a power module, and a related method thereof
|
|
KR101255935B1
(ko)
*
|
2011-07-08 |
2013-04-23 |
삼성전기주식회사 |
전력 모듈 패키지 및 그 제조방법
|
|
US8897010B2
(en)
*
|
2011-08-22 |
2014-11-25 |
General Electric Company |
High performance liquid cooled heatsink for IGBT modules
|
|
US20130056176A1
(en)
*
|
2011-08-26 |
2013-03-07 |
Mikros Manufacturing, Inc. |
Heat Exchanger with Controlled Coefficient of Thermal Expansion
|
|
US8408725B1
(en)
|
2011-09-16 |
2013-04-02 |
Lighting Science Group Corporation |
Remote light wavelength conversion device and associated methods
|
|
US9913341B2
(en)
|
2011-12-05 |
2018-03-06 |
Biological Illumination, Llc |
LED lamp for producing biologically-adjusted light including a cyan LED
|
|
US9220202B2
(en)
|
2011-12-05 |
2015-12-29 |
Biological Illumination, Llc |
Lighting system to control the circadian rhythm of agricultural products and associated methods
|
|
US9289574B2
(en)
|
2011-12-05 |
2016-03-22 |
Biological Illumination, Llc |
Three-channel tuned LED lamp for producing biologically-adjusted light
|
|
US8866414B2
(en)
|
2011-12-05 |
2014-10-21 |
Biological Illumination, Llc |
Tunable LED lamp for producing biologically-adjusted light
|
|
US8963450B2
(en)
|
2011-12-05 |
2015-02-24 |
Biological Illumination, Llc |
Adaptable biologically-adjusted indirect lighting device and associated methods
|
|
US8545034B2
(en)
|
2012-01-24 |
2013-10-01 |
Lighting Science Group Corporation |
Dual characteristic color conversion enclosure and associated methods
|
|
CN102548367B
(zh)
*
|
2012-02-07 |
2014-07-02 |
山东大学 |
含双梯形截面肋片的电力电子集成模块微小通道液冷基板
|
|
US9402294B2
(en)
|
2012-05-08 |
2016-07-26 |
Lighting Science Group Corporation |
Self-calibrating multi-directional security luminaire and associated methods
|
|
US8899775B2
(en)
|
2013-03-15 |
2014-12-02 |
Lighting Science Group Corporation |
Low-angle thoroughfare surface lighting device
|
|
US8680457B2
(en)
|
2012-05-07 |
2014-03-25 |
Lighting Science Group Corporation |
Motion detection system and associated methods having at least one LED of second set of LEDs to vary its voltage
|
|
US8899776B2
(en)
|
2012-05-07 |
2014-12-02 |
Lighting Science Group Corporation |
Low-angle thoroughfare surface lighting device
|
|
US9006987B2
(en)
|
2012-05-07 |
2015-04-14 |
Lighting Science Group, Inc. |
Wall-mountable luminaire and associated systems and methods
|
|
JP5924106B2
(ja)
*
|
2012-05-08 |
2016-05-25 |
富士電機株式会社 |
電力変換装置
|
|
US8937976B2
(en)
|
2012-08-15 |
2015-01-20 |
Northrop Grumman Systems Corp. |
Tunable system for generating an optical pulse based on a double-pass semiconductor optical amplifier
|
|
US9127818B2
(en)
|
2012-10-03 |
2015-09-08 |
Lighting Science Group Corporation |
Elongated LED luminaire and associated methods
|
|
US9174067B2
(en)
|
2012-10-15 |
2015-11-03 |
Biological Illumination, Llc |
System for treating light treatable conditions and associated methods
|
|
CN103809708A
(zh)
*
|
2012-11-07 |
2014-05-21 |
辉达公司 |
平板电子设备及其辅助散热装置、以及两者的组件
|
|
US9322516B2
(en)
|
2012-11-07 |
2016-04-26 |
Lighting Science Group Corporation |
Luminaire having vented optical chamber and associated methods
|
|
US9347655B2
(en)
|
2013-03-11 |
2016-05-24 |
Lighting Science Group Corporation |
Rotatable lighting device
|
|
US9459397B2
(en)
|
2013-03-12 |
2016-10-04 |
Lighting Science Group Corporation |
Edge lit lighting device
|
|
US10270220B1
(en)
*
|
2013-03-13 |
2019-04-23 |
Science Research Laboratory, Inc. |
Methods and systems for heat flux heat removal
|
|
KR101998920B1
(ko)
*
|
2013-03-15 |
2019-09-27 |
엠티피브이 파워 코퍼레이션 |
마이크로-갭 열광전 디바이스를 위한 마이크로채널 히트 싱크
|
|
US9255670B2
(en)
|
2013-03-15 |
2016-02-09 |
Lighting Science Group Corporation |
Street lighting device for communicating with observers and associated methods
|
|
US20140268731A1
(en)
|
2013-03-15 |
2014-09-18 |
Lighting Science Group Corpporation |
Low bay lighting system and associated methods
|
|
CN105164873A
(zh)
|
2013-05-02 |
2015-12-16 |
皇家飞利浦有限公司 |
用于冷却激光装置的冷却设备和包括冷却设备的激光系统
|
|
US9510478B2
(en)
|
2013-06-20 |
2016-11-29 |
Honeywell International Inc. |
Cooling device including etched lateral microchannels
|
|
US20150034280A1
(en)
*
|
2013-08-01 |
2015-02-05 |
Hamilton Sundstrand Corporation |
Header for electronic cooler
|
|
US9041193B2
(en)
*
|
2013-09-17 |
2015-05-26 |
Hamilton Sundstrand Corporation |
Semiconductor substrate including a cooling channel and method of forming a semiconductor substrate including a cooling channel
|
|
US9429294B2
(en)
|
2013-11-11 |
2016-08-30 |
Lighting Science Group Corporation |
System for directional control of light and associated methods
|
|
TWI489741B
(zh)
*
|
2013-12-20 |
2015-06-21 |
Ind Tech Res Inst |
具有散熱功能之馬達驅控器及其散熱方法
|
|
US20150195951A1
(en)
*
|
2014-01-06 |
2015-07-09 |
Ge Aviation Systems Llc |
Cooled electronic assembly and cooling device
|
|
KR101695708B1
(ko)
|
2014-01-09 |
2017-01-13 |
한국전자통신연구원 |
반도체 소자 및 그 제조방법
|
|
JP6279950B2
(ja)
*
|
2014-03-25 |
2018-02-14 |
京セラ株式会社 |
熱交換部材
|
|
US9437523B2
(en)
*
|
2014-05-30 |
2016-09-06 |
Toyota Motor Engineering & Manufacturing North America, Inc. |
Two-sided jet impingement assemblies and power electronics modules comprising the same
|
|
JP6156283B2
(ja)
*
|
2014-08-07 |
2017-07-05 |
株式会社デンソー |
電力変換装置
|
|
EP3195711A4
(en)
*
|
2014-09-15 |
2018-08-29 |
D'Onofrio, Nicholas, Michael |
Liquid cooled metal core printed circuit board
|
|
KR102291151B1
(ko)
*
|
2014-11-03 |
2021-08-19 |
현대모비스 주식회사 |
전력변환장치용 냉각유로모듈 및 이를 구비한 전력변화장치
|
|
US20170303431A1
(en)
*
|
2014-11-22 |
2017-10-19 |
Gerald Ho Kim |
Silicon Cooling Plate With An Integrated PCB
|
|
US20160150678A1
(en)
*
|
2014-11-22 |
2016-05-26 |
Gerald Ho Kim |
Silicon Cooling Plate With An Integrated PCB
|
|
EP3800421A1
(en)
*
|
2014-12-03 |
2021-04-07 |
Intelligent Platforms, Llc. |
Combined energy dissipation apparatus
|
|
US9762018B2
(en)
|
2014-12-09 |
2017-09-12 |
Raytheon Company |
System and method for cooling a laser gain medium using an ultra-thin liquid thermal optical interface
|
|
US9445526B2
(en)
|
2014-12-22 |
2016-09-13 |
Toyota Motor Engineering & Manufacturing North America, Inc. |
Modular jet impingement assemblies with passive and active flow control for electronics cooling
|
|
FI127831B
(en)
*
|
2015-01-15 |
2019-03-29 |
Lappeenrannan Teknillinen Yliopisto |
A method for fabricating a semiconductor module
|
|
US9693487B2
(en)
|
2015-02-06 |
2017-06-27 |
Caterpillar Inc. |
Heat management and removal assemblies for semiconductor devices
|
|
KR102219482B1
(ko)
|
2015-03-03 |
2021-02-25 |
한국전자통신연구원 |
반도체 소자
|
|
CN104768356B
(zh)
*
|
2015-04-27 |
2017-06-06 |
中国电子科技集团公司第三十八研究所 |
一种应用3d打印技术的新型水冷板结构
|
|
CN104852257A
(zh)
*
|
2015-05-18 |
2015-08-19 |
大连理工大学 |
一种大口径激光液冷镜构型
|
|
US9443786B1
(en)
*
|
2015-08-19 |
2016-09-13 |
Ac Propulsion, Inc. |
Packaging and cooling method and apparatus for power semiconductor devices
|
|
US9980415B2
(en)
|
2015-08-20 |
2018-05-22 |
Toyota Motor Engineering & Manufacturing North America, Inc. |
Configurable double-sided modular jet impingement assemblies for electronics cooling
|
|
US11003808B2
(en)
*
|
2015-09-30 |
2021-05-11 |
Siemens Industry Software Inc. |
Subtractive design for heat sink improvement
|
|
WO2017059382A1
(en)
|
2015-09-30 |
2017-04-06 |
Microfabrica Inc. |
Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems
|
|
US12255123B2
(en)
|
2015-09-30 |
2025-03-18 |
Microfabrica Inc. |
Micro heat transfer arrays, micro cold plates, and thermal management systems for semiconductor devices, and methods for using and making such arrays, plates, and systems
|
|
US10211590B2
(en)
|
2015-11-25 |
2019-02-19 |
Raytheon Company |
Dual-function optical bench and cooling manifold for high-power laser system
|
|
US11114813B2
(en)
|
2015-11-25 |
2021-09-07 |
Raytheon Company |
Integrated pumplight homogenizer and signal injector for high-power laser system
|
|
US10056731B2
(en)
|
2015-11-25 |
2018-08-21 |
Raytheon Company |
Planar waveguide (PWG) amplifier-based laser system with adaptive optic wavefront correction in low-power beam path
|
|
US10297968B2
(en)
|
2015-11-25 |
2019-05-21 |
Raytheon Company |
High-gain single planar waveguide (PWG) amplifier laser system
|
|
US9865988B2
(en)
|
2015-11-25 |
2018-01-09 |
Raytheon Company |
High-power planar waveguide (PWG) pumphead with modular components for high-power laser system
|
|
MX389031B
(es)
|
2016-02-08 |
2025-03-20 |
Mtpv Power Corp |
Sistema termofotovoltaico de intervalo micrometrico radiativo con emisor transparente
|
|
US10069270B2
(en)
|
2016-02-11 |
2018-09-04 |
Raytheon Company |
Planar waveguides with enhanced support and/or cooling features for high-power laser systems
|
|
US9917413B2
(en)
*
|
2016-02-11 |
2018-03-13 |
Coherent, Inc. |
Cooling apparatus for diode-laser bars
|
|
CN105576113A
(zh)
*
|
2016-02-16 |
2016-05-11 |
广东富信科技股份有限公司 |
半导体制冷组件
|
|
US9484284B1
(en)
|
2016-03-16 |
2016-11-01 |
Northrop Grumman Systems Corporation |
Microfluidic impingement jet cooled embedded diamond GaN HEMT
|
|
US10411435B2
(en)
|
2016-06-06 |
2019-09-10 |
Raytheon Company |
Dual-axis adaptive optic (AO) system for high-power lasers
|
|
US11022383B2
(en)
|
2016-06-16 |
2021-06-01 |
Teledyne Scientific & Imaging, Llc |
Interface-free thermal management system for high power devices co-fabricated with electronic circuit
|
|
US10492343B2
(en)
*
|
2016-08-23 |
2019-11-26 |
Ford Global Technologies, Llc |
Vehicle power module assembly with cooling
|
|
WO2018039680A1
(en)
|
2016-08-26 |
2018-03-01 |
Inertech Ip Llc |
Cooling systems and methods using single-phase fluid and a flat tube heat exchanger with counter-flow circuiting
|
|
US10615100B2
(en)
*
|
2016-12-08 |
2020-04-07 |
Toyota Motor Engineering & Manufacturing North America, Inc. |
Electronics assemblies and cooling structures having metalized exterior surface
|
|
JP6496845B2
(ja)
*
|
2017-02-13 |
2019-04-10 |
新電元工業株式会社 |
電子機器
|
|
CN107634037A
(zh)
*
|
2017-03-02 |
2018-01-26 |
天津开发区天地信息技术有限公司 |
高导热封装基板
|
|
DE102018203231A1
(de)
|
2017-03-06 |
2018-09-06 |
Dana Canada Corporation |
Wärmetauscher zum kühlen mehrerer schichten aus elektronischen modulen
|
|
CN108966583B
(zh)
|
2017-05-17 |
2020-04-14 |
华为技术有限公司 |
散热器以及通信设备
|
|
CN108011007B
(zh)
*
|
2017-11-28 |
2019-11-08 |
刘琼 |
Led封装结构
|
|
CN108011008B
(zh)
*
|
2017-11-28 |
2020-07-07 |
西安科锐盛创新科技有限公司 |
Led封装结构
|
|
CN108006490B
(zh)
*
|
2017-11-28 |
2020-07-07 |
江苏明月照明电器有限公司 |
Led隧道灯
|
|
CN108006488B
(zh)
*
|
2017-11-28 |
2020-06-26 |
广东胜和照明实业有限公司 |
一种led洗墙灯
|
|
CN108006491B
(zh)
*
|
2017-11-28 |
2020-10-30 |
吉安建伟纸塑制品包装有限公司 |
Led隧道灯
|
|
CN108011019B
(zh)
*
|
2017-11-28 |
2019-12-17 |
廊坊源驰科技有限公司 |
一种led封装方法
|
|
CN108006566B
(zh)
*
|
2017-11-28 |
2020-06-05 |
高邮市诚顺照明电器有限公司 |
太阳能路灯
|
|
US10511135B2
(en)
|
2017-12-19 |
2019-12-17 |
Raytheon Company |
Laser system with mechanically-robust monolithic fused planar waveguide (PWG) structure
|
|
JP2019140332A
(ja)
*
|
2018-02-14 |
2019-08-22 |
トヨタ自動車株式会社 |
半導体装置
|
|
US10822096B2
(en)
*
|
2018-03-30 |
2020-11-03 |
Ge Aviation Systems Llc |
Avionics cooling module
|
|
DE102018112000B4
(de)
*
|
2018-05-18 |
2024-08-08 |
Rogers Germany Gmbh |
System zum Kühlen eines Metall-Keramik-Substrats, ein Metall-Keramik-Substrat und Verfahren zum Herstellen des Systems
|
|
US11133639B2
(en)
|
2018-07-24 |
2021-09-28 |
Raytheon Company |
Fast axis thermal lens compensation for a planar amplifier structure
|
|
US11729945B2
(en)
|
2018-10-25 |
2023-08-15 |
Mikros Technologies Llc |
Active device with heat sink and low mechanical stress
|
|
CN111315182B
(zh)
*
|
2018-12-12 |
2022-02-08 |
台达电子工业股份有限公司 |
整合式电子装置
|
|
CN110010574B
(zh)
*
|
2018-12-29 |
2021-02-09 |
浙江臻镭科技股份有限公司 |
一种多层堆叠型纵向互联的射频结构及其制作方法
|
|
CN109980317B
(zh)
*
|
2019-03-15 |
2021-05-18 |
北京航空航天大学 |
具有主动调节冷却能力分布的空间电源系统冷板
|
|
KR102495489B1
(ko)
|
2019-04-24 |
2023-02-03 |
한화에어로스페이스 주식회사 |
냉각 장치
|
|
US10874037B1
(en)
*
|
2019-09-23 |
2020-12-22 |
Ford Global Technologies, Llc |
Power-module assembly with cooling arrangement
|
|
US11101509B2
(en)
*
|
2019-10-02 |
2021-08-24 |
GM Global Technology Operations LLC |
Battery cooling plate with distributed coolant flow
|
|
CN112696961B
(zh)
*
|
2019-10-23 |
2022-04-01 |
北京航空航天大学 |
一种三级相变换热器
|
|
US11428478B2
(en)
|
2019-12-16 |
2022-08-30 |
Toyota Motor Engineering & Manufacturing North America, Inc. |
Fin geometries for manifold microchannel heat sinks
|
|
DE102020200301A1
(de)
*
|
2020-01-13 |
2021-07-15 |
Zf Friedrichshafen Ag |
Kühlkörper und Leistungsmodulzusammenstellung
|
|
US12315782B2
(en)
*
|
2020-05-20 |
2025-05-27 |
Google Llc |
Spring loaded compliant coolant distribution manifold for direct liquid cooled modules
|
|
US11602087B2
(en)
|
2020-10-30 |
2023-03-07 |
Toyota Jidosha Kabushiki Kaisha |
Double-sided hybrid cooling of PCB embedded power electronics and capacitors
|
|
US11765858B2
(en)
*
|
2021-06-24 |
2023-09-19 |
Baidu Usa Llc |
Multi-system cooling device for high powered integrated circuits
|
|
JP2024546224A
(ja)
*
|
2021-10-25 |
2024-12-19 |
ラム リサーチ コーポレーション |
基板処理システムの電源ボックス用のマイクロチャネルアセンブリ冷却電力回路
|
|
CN114178812B
(zh)
*
|
2021-12-21 |
2023-05-12 |
威海凯美立电子有限公司 |
一种应用于叠片式汽车散热器的装配机
|
|
US11723173B1
(en)
|
2022-03-23 |
2023-08-08 |
Rolls-Royce Corporation |
Stacked cold plate with flow guiding vanes and method of manufacturing
|
|
US12439552B2
(en)
*
|
2022-07-22 |
2025-10-07 |
Hewlett Packard Enterprise Development Lp |
Cooling module for a circuit module having a plurality of chipsets
|
|
KR102782628B1
(ko)
*
|
2022-12-07 |
2025-03-19 |
한국전자기술연구원 |
냉각제 순환 유닛을 결합한 pcb 방열 플레이트
|
|
JP2024087237A
(ja)
*
|
2022-12-19 |
2024-07-01 |
株式会社フジクラ |
コールドプレート
|
|
CN116190330B
(zh)
*
|
2023-02-21 |
2024-07-05 |
华中科技大学 |
基于热点区域定向优化的歧管微通道散热器
|
|
DE102023105321A1
(de)
*
|
2023-03-03 |
2024-09-05 |
Infineon Technologies Ag |
Trägerstruktur, packageanordnung, verfahren zum herstellen einer trägerstruktur, und verfahren zum herstellen einer packageanordnung
|
|
KR20240145637A
(ko)
*
|
2023-03-28 |
2024-10-07 |
현대모비스 주식회사 |
인버터의 파워 모듈용 냉각기
|
|
CN116741724A
(zh)
*
|
2023-04-28 |
2023-09-12 |
浙江大学杭州国际科创中心 |
冷却集成的碳化硅模块及其制备方法、芯片的改造方法
|