CN108011007B - Led封装结构 - Google Patents
Led封装结构 Download PDFInfo
- Publication number
- CN108011007B CN108011007B CN201711211404.5A CN201711211404A CN108011007B CN 108011007 B CN108011007 B CN 108011007B CN 201711211404 A CN201711211404 A CN 201711211404A CN 108011007 B CN108011007 B CN 108011007B
- Authority
- CN
- China
- Prior art keywords
- lens
- silica gel
- layer
- heat
- led encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 239000004744 fabric Substances 0.000 claims abstract description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 107
- 239000000741 silica gel Substances 0.000 claims description 102
- 229910002027 silica gel Inorganic materials 0.000 claims description 102
- 239000000463 material Substances 0.000 claims description 40
- 229910003460 diamond Inorganic materials 0.000 claims description 8
- 239000010432 diamond Substances 0.000 claims description 8
- 238000009738 saturating Methods 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 13
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 238000004891 communication Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 abstract description 3
- 229960001866 silicon dioxide Drugs 0.000 description 88
- 238000010586 diagram Methods 0.000 description 16
- 238000000034 method Methods 0.000 description 8
- 238000012536 packaging technology Methods 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 241001025261 Neoraja caerulea Species 0.000 description 1
- 241001465382 Physalis alkekengi Species 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 235000012771 pancakes Nutrition 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711211404.5A CN108011007B (zh) | 2017-11-28 | 2017-11-28 | Led封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711211404.5A CN108011007B (zh) | 2017-11-28 | 2017-11-28 | Led封装结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108011007A CN108011007A (zh) | 2018-05-08 |
CN108011007B true CN108011007B (zh) | 2019-11-08 |
Family
ID=62054341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711211404.5A Active CN108011007B (zh) | 2017-11-28 | 2017-11-28 | Led封装结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108011007B (zh) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7353859B2 (en) * | 2004-11-24 | 2008-04-08 | General Electric Company | Heat sink with microchannel cooling for power devices |
US8764504B2 (en) * | 2011-02-25 | 2014-07-01 | Semiconductor Energy Laboratory Co., Ltd. | Lighting device and method for manufacturing the same |
DE102015104220A1 (de) * | 2015-03-20 | 2016-09-22 | Osram Opto Semiconductors Gmbh | Optoelektronische Leuchtvorrichtung |
-
2017
- 2017-11-28 CN CN201711211404.5A patent/CN108011007B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN108011007A (zh) | 2018-05-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8215802B2 (en) | Multiple-tier omnidirectional solid-state emission source | |
US20130187528A1 (en) | Multiple-tier Omnidirectional Solid-State Emission Source | |
CN106920870B (zh) | 一种大功率紫外led芯片共晶焊倒装结构 | |
TWI680257B (zh) | 發光裝置 | |
CN108011007B (zh) | Led封装结构 | |
CN208385456U (zh) | Led封装结构 | |
CN208256718U (zh) | 一种led的封装结构 | |
CN107994113A (zh) | 一种大功率蓝光led多层封装结构 | |
CN208538902U (zh) | Led封装体及高透光率led灯 | |
CN207852100U (zh) | 交通信号灯及系统 | |
CN105762255B (zh) | 一种高品质照明应用的大功率led点光源 | |
CN107978595B (zh) | 交通信号灯及系统 | |
CN207674244U (zh) | 智能led地面灯 | |
CN108011025B (zh) | Led封装工艺 | |
CN108011026A (zh) | 一种大功率led双层半球结构封装工艺 | |
CN108011011B (zh) | 一种led的封装结构 | |
CN108011022B (zh) | Led灯及led封装方法 | |
CN107946442A (zh) | Led封装体及高透光率led灯 | |
CN207880542U (zh) | 投光灯 | |
CN208093584U (zh) | 一种多层封装的大功率led结构 | |
CN207674291U (zh) | 节能大功率led工矿灯 | |
CN205429008U (zh) | 一种金属导热柱cob led光源 | |
CN207935800U (zh) | 手提灯 | |
CN208507727U (zh) | Led封装结构及高聚光led灯 | |
CN108011024B (zh) | Led灯及led封装工艺 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20191016 Address after: 317000 No. 5-81, Baishi Village, Datian street, Linhai City, Taizhou City, Zhejiang Province Applicant after: Liu Qiong Address before: 710065 No. 86 Leading Times Square (Block B), No. 2, Building No. 1, Unit 22, Room 12202, No. 51, High-tech Road, Xi'an High-tech Zone, Shaanxi Province Applicant before: Xi'an CREE Sheng Creative Technology Limited |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP02 | Change in the address of a patent holder |
Address after: AI Zhi technology building, Gulou District, Nanjing City, Jiangsu Province Patentee after: Liu Qiong Address before: 317000 No. 5-81, Baishi Village, Datian street, Linhai City, Taizhou City, Zhejiang Province Patentee before: Liu Qiong |
|
CP02 | Change in the address of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211230 Address after: 528200 a, building 104, building 2, Liandong Yougu Park, No. 3, East Third District, Jiansha Road, Danzao Town, Nanhai District, Foshan City, Guangdong Province (residence declaration) Patentee after: Guangdong Anlin Electronic Technology Co.,Ltd. Address before: AI Zhi technology building, Gulou District, Nanjing City, Jiangsu Province Patentee before: Liu Qiong |
|
TR01 | Transfer of patent right |