JP2008118080A5 - - Google Patents

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Publication number
JP2008118080A5
JP2008118080A5 JP2006302555A JP2006302555A JP2008118080A5 JP 2008118080 A5 JP2008118080 A5 JP 2008118080A5 JP 2006302555 A JP2006302555 A JP 2006302555A JP 2006302555 A JP2006302555 A JP 2006302555A JP 2008118080 A5 JP2008118080 A5 JP 2008118080A5
Authority
JP
Japan
Prior art keywords
heater
insulating layer
mounting surface
heating
heat insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006302555A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008118080A (ja
JP5157131B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006302555A priority Critical patent/JP5157131B2/ja
Priority claimed from JP2006302555A external-priority patent/JP5157131B2/ja
Publication of JP2008118080A publication Critical patent/JP2008118080A/ja
Publication of JP2008118080A5 publication Critical patent/JP2008118080A5/ja
Application granted granted Critical
Publication of JP5157131B2 publication Critical patent/JP5157131B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006302555A 2006-11-08 2006-11-08 加熱体及びそれを搭載した半導体製造装置 Active JP5157131B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006302555A JP5157131B2 (ja) 2006-11-08 2006-11-08 加熱体及びそれを搭載した半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006302555A JP5157131B2 (ja) 2006-11-08 2006-11-08 加熱体及びそれを搭載した半導体製造装置

Publications (3)

Publication Number Publication Date
JP2008118080A JP2008118080A (ja) 2008-05-22
JP2008118080A5 true JP2008118080A5 (enExample) 2009-12-17
JP5157131B2 JP5157131B2 (ja) 2013-03-06

Family

ID=39503764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006302555A Active JP5157131B2 (ja) 2006-11-08 2006-11-08 加熱体及びそれを搭載した半導体製造装置

Country Status (1)

Country Link
JP (1) JP5157131B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5447123B2 (ja) * 2009-05-28 2014-03-19 住友電気工業株式会社 ヒータユニット及びそれを備えた装置
JP5416570B2 (ja) * 2009-12-15 2014-02-12 住友電気工業株式会社 加熱冷却デバイスおよびそれを搭載した装置
CN104752301B (zh) * 2013-12-31 2018-05-25 北京北方华创微电子装备有限公司 一种静电卡盘以及腔室
NL2015429B1 (en) * 2015-09-11 2017-03-29 Walker Holdings B V Portable stove for solid fuels.
CN112114498A (zh) * 2020-09-12 2020-12-22 刘晟麟 一种匀胶显影均温加热装置
CN117286474B (zh) * 2022-12-28 2024-06-21 无锡至辰科技有限公司 一种高温金属外壳晶圆加热器及其加工方法
KR102760972B1 (ko) * 2023-02-09 2025-02-03 주식회사 알씨테크 반도체 공정에 이용되기 위한 케미컬 공급 장치

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002025912A (ja) * 2000-07-04 2002-01-25 Sumitomo Electric Ind Ltd 半導体製造装置用サセプタとそれを用いた半導体製造装置

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