JP2014110426A5 - - Google Patents

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Publication number
JP2014110426A5
JP2014110426A5 JP2013245536A JP2013245536A JP2014110426A5 JP 2014110426 A5 JP2014110426 A5 JP 2014110426A5 JP 2013245536 A JP2013245536 A JP 2013245536A JP 2013245536 A JP2013245536 A JP 2013245536A JP 2014110426 A5 JP2014110426 A5 JP 2014110426A5
Authority
JP
Japan
Prior art keywords
clamshell
heat sink
heat
thermal
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013245536A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014110426A (ja
Filing date
Publication date
Priority claimed from US13/690,029 external-priority patent/US9036352B2/en
Application filed filed Critical
Publication of JP2014110426A publication Critical patent/JP2014110426A/ja
Publication of JP2014110426A5 publication Critical patent/JP2014110426A5/ja
Pending legal-status Critical Current

Links

JP2013245536A 2012-11-30 2013-11-28 一時的な熱管理のための相変化ヒートシンク Pending JP2014110426A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/690,029 2012-11-30
US13/690,029 US9036352B2 (en) 2012-11-30 2012-11-30 Phase change heat sink for transient thermal management

Publications (2)

Publication Number Publication Date
JP2014110426A JP2014110426A (ja) 2014-06-12
JP2014110426A5 true JP2014110426A5 (enExample) 2017-01-12

Family

ID=49752969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013245536A Pending JP2014110426A (ja) 2012-11-30 2013-11-28 一時的な熱管理のための相変化ヒートシンク

Country Status (6)

Country Link
US (1) US9036352B2 (enExample)
EP (1) EP2738803B1 (enExample)
JP (1) JP2014110426A (enExample)
CN (1) CN103857264B (enExample)
BR (1) BR102013029452A2 (enExample)
CA (1) CA2833896C (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5920356B2 (ja) * 2011-10-25 2016-05-18 富士通株式会社 水冷装置、水冷装置を有する電子機器、及び水冷方法
CN103796486B (zh) * 2012-10-31 2017-02-08 英业达科技有限公司 电子装置
US11049794B2 (en) * 2014-03-01 2021-06-29 Advanced Micro Devices, Inc. Circuit board with phase change material
US9836100B2 (en) * 2014-10-15 2017-12-05 Futurewei Technologies, Inc. Support frame with integrated phase change material for thermal management
CA2966202A1 (en) * 2014-11-12 2016-05-19 Ge Aviation Systems Llc Heat sink assemblies for transient cooling
CN104868196A (zh) * 2015-06-02 2015-08-26 中投仙能科技（苏州）有限公司 一种锂离子蓄电池
US9713284B2 (en) 2015-07-15 2017-07-18 Hong Kong Applied Science And Technology Research Institute Co. Ltd. Locally enhanced direct liquid cooling system for high power applications
TWI676405B (zh) * 2016-07-26 2019-11-01 日商Ｊｘ金屬股份有限公司 印刷配線板、電子機器、導管及金屬材料
US10714425B2 (en) * 2016-09-13 2020-07-14 Apple Inc. Flexible system integration to improve thermal properties
FR3058262A1 (fr) * 2016-10-31 2018-05-04 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif electronique protege
KR102701849B1 (ko) * 2017-01-26 2024-09-02 삼성전자주식회사 적응적 열 저항 및 열 용량을 사용하는 열 관리 장치 및 방법
US10415474B2 (en) 2017-01-31 2019-09-17 General Electric Company Method and system for phase change material component cooling
KR102271221B1 (ko) * 2017-03-14 2021-07-01 엘지이노텍 주식회사 열전 소자
US10627167B2 (en) 2017-09-12 2020-04-21 General Electric Company Gas turbine engine having a heat absorption device utilizing phase change material
CN108413792B (zh) * 2018-03-12 2024-05-28 宁夏洪腾科技开发有限公司 具有开关功能的热管
CN108613421B (zh) * 2018-05-14 2019-08-30 上海理工大学 包含有模块化微胶囊相变材料的容积式空气吸热器
US20200109901A1 (en) * 2018-10-03 2020-04-09 Raytheon Company Additively manufactured thermal energy storage units
US20200187386A1 (en) * 2018-12-10 2020-06-11 Zf Active Safety And Electronics Us Llc Thermal interface assembly
WO2021010874A1 (en) 2019-07-16 2021-01-21 Telefonaktiebolaget Lm Ericsson (Publ) A cooling device, a receptacle assembly, a system and a printed board assembly
CN113292863A (zh) * 2021-06-09 2021-08-24 中国人民解放军国防科技大学 一种瞬态复合材料及其制备方法、应用
US11674396B2 (en) 2021-07-30 2023-06-13 General Electric Company Cooling air delivery assembly
US12082374B2 (en) * 2021-10-08 2024-09-03 Simmonds Precision Products, Inc. Heatsinks comprising a phase change material
CN114497813B (zh) * 2022-03-31 2022-06-28 深圳市森若新材科技有限公司 相变复合膜及包括所述相变复合膜的电池和芯片组件
US12163740B2 (en) 2022-08-19 2024-12-10 Simmonds Precision Products, Inc. Phase change material (PCM) heatsinks

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4322737A (en) 1979-11-20 1982-03-30 Intel Corporation Integrated circuit micropackaging
JPS60160151A (ja) * 1984-01-26 1985-08-21 Fujitsu Ltd 集積回路の冷却方式
JPS62204341U (enExample) * 1986-06-18 1987-12-26
JPH01132199A (ja) * 1987-11-17 1989-05-24 Fujitsu Ltd プリント板実装冷却構造
JPH05218250A (ja) * 1992-02-06 1993-08-27 Mitsubishi Heavy Ind Ltd 熱伝達率可変型放熱器
DE4326207A1 (de) * 1992-10-06 1994-04-07 Hewlett Packard Co Mechanisch schwimmendes Mehr-Chip-Substrat
US5477409A (en) 1993-11-24 1995-12-19 Vlsi Technology Inc. Fusion heat sink for integrated circuit
AU697409B2 (en) * 1995-01-25 1998-10-08 Nortel Networks Corporation Printed circuit board and heat sink arrangement
US5597035A (en) 1995-08-18 1997-01-28 Dell Usa, L.P. For use with a heatsink a shroud having a varying cross-sectional area
JPH11274382A (ja) * 1998-01-21 1999-10-08 Ricoh Microelectronics Co Ltd ヒ―トシンク、該ヒ―トシンクの製造方法及び該ヒ―トシンクを備えた電子機器
US6239502B1 (en) 1999-11-22 2001-05-29 Bae Systems Controls Phase change assisted heat sink
EP1162659A3 (de) * 2000-06-08 2005-02-16 MERCK PATENT GmbH Einsatz von PCM in Kühlern für elektronische Bauteile
CN1290955A (zh) * 2000-10-31 2001-04-11 上海交通大学 储热式行波管
US6822867B2 (en) * 2001-06-29 2004-11-23 Intel Corporation Electronic assembly with solderable heat sink and methods of manufacture
TW537436U (en) * 2002-05-31 2003-06-11 Quanta Comp Inc Three-phase variable heat conducting structure
AU2003298561A1 (en) 2002-08-23 2004-05-13 Jonathan S. Dahm Method and apparatus for using light emitting diodes
JP2004111665A (ja) * 2002-09-19 2004-04-08 Hitachi Ltd 電子装置
JP2004152895A (ja) * 2002-10-29 2004-05-27 Sony Corp 冷却装置および冷却装置を有する電子機器
JP2004198036A (ja) * 2002-12-19 2004-07-15 Fuji Electric Fa Components & Systems Co Ltd 冷却装置
KR100468783B1 (ko) 2003-02-11 2005-01-29 삼성전자주식회사 반도체 모듈로부터 발생되는 열을 소산시키는 집게형 장치
JP3979531B2 (ja) * 2003-04-15 2007-09-19 日本ブロアー株式会社 電子冷却装置
JP2005012127A (ja) * 2003-06-20 2005-01-13 Denso Corp 電子制御装置
CN100426493C (zh) * 2004-12-04 2008-10-15 鸿富锦精密工业（深圳）有限公司 沸腾腔式散热装置
CN100543103C (zh) * 2005-03-19 2009-09-23 清华大学 热界面材料及其制备方法
US7623360B2 (en) * 2006-03-09 2009-11-24 Laird Technologies, Inc. EMI shielding and thermal management assemblies including frames and covers with multi-position latching
US20080123297A1 (en) 2006-05-15 2008-05-29 Isothermal Systems Research, Inc. Hybrid clamshell blade system
JP4799296B2 (ja) * 2006-06-30 2011-10-26 株式会社東芝 電子機器
JP4619387B2 (ja) * 2007-10-01 2011-01-26 株式会社日本自動車部品総合研究所 半導体素子の冷却装置
CN101408301B (zh) * 2007-10-10 2012-09-19 富准精密工业(深圳)有限公司 带有散热装置的发光二极管灯具
US20090184283A1 (en) * 2008-01-18 2009-07-23 Deborah Duen Ling Chung Antioxidants for phase change ability and thermal stability enhancement
DE102008015782A1 (de) * 2008-03-26 2009-10-01 Rubitherm Technologies Gmbh Verfahren zur Herstellung einer Phasenwechselmaterial-Zusammensetzung
CN201214294Y (zh) * 2008-04-09 2009-04-01 孔庆山 一种含相变蓄能材料的复合板
KR101446828B1 (ko) 2008-06-18 2014-10-30 브루사 일렉트로닉 아게 전자소자용의 냉각장치
JP5381561B2 (ja) 2008-11-28 2014-01-08 富士電機株式会社 半導体冷却装置
US7911796B2 (en) * 2009-06-19 2011-03-22 General Electric Company Avionics chassis
CN101832001A (zh) * 2010-04-02 2010-09-15 建研建材有限公司 自调温相变储能板
CN201802003U (zh) * 2010-04-02 2011-04-20 建研建材有限公司 自调温相变储能板
CN102173664A (zh) * 2011-01-17 2011-09-07 东南大学 一种石墨-石蜡复合相变储能混凝土及其制备方法

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