CN101408301B - 带有散热装置的发光二极管灯具 - Google Patents

带有散热装置的发光二极管灯具 Download PDF

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CN101408301B
CN101408301B CN200710123808A CN200710123808A CN101408301B CN 101408301 B CN101408301 B CN 101408301B CN 200710123808 A CN200710123808 A CN 200710123808A CN 200710123808 A CN200710123808 A CN 200710123808A CN 101408301 B CN101408301 B CN 101408301B
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radiator
conducting plate
wall
heat pipe
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赖振田
周志勇
丁巧利
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QUANYIDA TECHNOLOGY (FOSHAN) Co Ltd
Hon Hai Precision Industry Co Ltd
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21Y2113/00—Combination of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
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Abstract

一种带有散热装置的发光二极管灯具，包括一散热器及若干发光二极管，所述散热器包括一底板及由所述底板顶面延伸而出的若干散热鳍片，还包括导热板及具有单向传热功能的相变热传导元件，所述热传导元件连设在所述散热器底板的底面与所述导热板之间，所述发光二极管安装于所述导热板背向所述散热器的一面，所述热传导元件加快所述导热板向所述散热器传热并阻止反向传热。该发光二极管灯具工作时，热量可以快速地传导到该散热器进而被散发出去，该发光二极管灯具在非工作状态时，即使该散热器受环境温度加热而温度升高，由于该导热板单向传热的特性，该散热器无法将来自外界的热量传递到该LED上，而达到保护LED的效果。

Description

带有散热装置的发光二极管灯具
技术领域
本发明涉及一种发光二极管灯具，特别是指一种带有散热装置的发光二极管灯具。
背景技术
发光二极管光源作为一种新兴的第三代光源，虽然现在还不能大规模取代传统的白炽灯，但是其具有工作寿命长、节能、环保等优点，而普遍被市场所看好。而且，目前由发光二极管组成的模块能产生大功率、高亮度的光源，完全可以取代现有白炽灯实现室内外照明，也将广泛地、革命性地取代传统的白炽灯等现有的光源，进而成为符合节能环保主题的主要光源。
在用于一些专业用途如作为户外照明设备时，作为LED照明设备光源的LED通常会被严密地封装在一壳体内以能在诸如沙尘很大或者空气很潮湿等的恶劣自然环境下正常工作。在这种情况下，为了解决LED的散热问题，与这些LED导热连接的散热器就需要将形成其上的散热鳍片暴露在该密封壳体外，以将LED产生的热量散发到周围的空气中。然而，在这样的户外环境下，该LED照明设备及其散热器在白天不工作时还将极有可长时间处在阳光的照射下，而使散热器处于高温状态。因为该散热器是和LED导热连接的，所以该散热器的不断地将来自阳光辐射产生的热量传导给LED，致使该LED无论是否工作都长期处在高温环境下，而影响其寿命及稳定性。
发明内容
有鉴于此，有必要提供一种受环境温度影响较小且散热良好的发光二极管灯具。
一种带有散热装置的发光二极管灯具，包括一散热器及若干发光二极管，所述散热器包括一底板及由所述底板顶面延伸而出的若干散热鳍片，还包括导热板及具有单向传热功能的相变热传导元件，所述热传导元件连设在所述散热器底板的底面与所述导热板之间，所述发光二极管安装于所述导热板背向所述散热器的一面，所述热传导元件加快所述导热板向所述散热器传热并阻止反向传热，所述相变热传导元件为热管，所述热管包括一第一外壁，与所述第一外壁相对的一第二外壁，所述第一外壁与所述导热板接触，所述第二外壁与所述底板接触，所述热管内设置有毛细结构，所述毛细结构组织可以为孔径较大的螺旋沟槽、铜网或者只在所述第一外壁对应的内壁设置的烧结层，所述热管内填充有工作流体，当所述热管水平放置且其第一外壁朝向下时，该工作流体刚好能足够浸没所述第一外壁内表面上的毛细结构组织。
上述发光二极管灯具中的相变导热元件具有单向传热的特性，该发光二极管灯具工作时，热量可以快速地传导到该散热器进而被散发出去，该发光二极管灯具在非工作状态时，即使该散热器受环境温度加热而温度升高，由于该导热板单向传热的特性，该散热器无法将来自外界的热量传递到该LED上，而达到保护LED的效果。
下面参照附图，结合实施例对本发明作进一步的描述。
附图说明
图1是发明带有散热装置的发光二极管灯具中的散热装置一优选实施例的立体组合图。
图2是图1中散热装置的立体分解图。
图3是图2中散热装置的倒置视图。
具体实施方式
参阅图1至图3，本发明一优选实施例中的带有散热装置的发光二极管灯具中的散热装置，用于对安装在该发光二极管灯具内的若干LED(发光二极管灯)100进行散热，该发光二极管灯具为一用于户外照明的专业灯具，一般工作在比较恶劣的环境下工作，故具有一密封壳体以保护其内的LED100及相关组件。该散热装置包括一散热器10，若干嵌置于散热器10内的热管20和贴设在该散热器10底面并同时与这些热管20接触的若干导热板30。这些LED100以一定的排列方式安装于这些导热板30上。
上述散热器10由导热性能良好的金属材料如铝、铜等一体成型，其包括一矩形底板12和从该底板12垂直向上延伸的若干散热鳍片14。该底板12具有面向该导热板30的一底面122和与该底面122平行并相对的一顶面124。该底板12的底面122上开设有与这些热管20形状相适配的若干容置槽120。这些容置槽120的形状与这些热管20的形状相一致，在不同实施例中可以是不同的形状如L形、U形和S形等等，在本实施例中，这些容置槽120为相互间隔的两组一字形容置槽120，每组容置槽120中包括紧挨着平行排列的三容置槽120，这些容置槽120与该底板12的两个相对侧边相平行。这些散热鳍片14从该底板12的顶面124向外延伸同时暴露在该发光二极管灯具的壳体外以将来自LED100的热量散发到周围环境中，该散热鳍片14可以设计成不同的形状，以使该散热器10的热交换面积最大化，在本实施例中，这些散热鳍片14相互等距间隔且与该底板12相对两侧边平行。
上述热管20的大小形状与该散热器10上的容置槽120相适配，以容置在这些容置槽120内。这些热管20分为两组，每组包括三热管20，每一热管20均呈扁平的长条状，并具一传统热管的壳体(未标号)及该壳体内腔中的工作流体，该壳体具有面向该导热板30的一第一外壁22以及朝向该散热器10底面122并平行该第一外壁22的第二外壁24。这些热管20均为具有单向传热功能的特殊相变热传导元件，即热量从该热管20的第一外壁22向第二外壁24传输时，该热管20的热阻很小而表现其高导热特性，但当热量反过来是从该热管20的第二外壁24向第一外壁22传输时，该热管20热阻很大而表现其绝热特性。该热管20的单向导热性能是通过该热管20壳体内设置的毛细结构的特定构造来实现的，该壳体内毛细结构组织可以为孔径较大的螺旋沟槽、铜网或者只在该第一外壁22对应的内壁设置的烧结层。当该热管20水平放置且其第一外壁22朝向地面时，该工作流体刚好能足够浸没该第一外壁22内表面上的毛细结构组织，该工作流体作为热载体将热量从第一外壁22传至第二外壁24。当这些热管20嵌入散热器10上的容置槽120时，这些热管20的第一外壁22的外表面与该散热器10的底面122形成一与该导热板30接触的接触面。
上述导热板30共有四个，均为由导热性能优良的材料如铜制成，每一导热板30均为一扁平板体，包括第一表面32及第二表面34，其中该第二表面34为第一表面32的反面且接触该散热器10。这些LED100分别安装在这些导热板30的第一表面32上。这些热管20的第一外壁22的外表面与该散热器10的底面122形成一接触面，这些导热板30的第二表面34与该平面通过焊接等方式固定并紧密接触，且这些热管20的第一外壁22表面占据该接触面的大多数面积，也就是说这些导热板30主要是与这些热管20接触，且每两组导热板30覆盖在一组热管20上。
上述散热装置处于工作状态时，这些LED100产生的热量直接被导热板30吸收，这些导热板30再通过热管20将热量传导到该散热器10上，最后由该散热器10上的散热鳍片14将热量散发到周围空气中，从而达到冷却LED100的效果。
此外，使用者须被告知，当户外LED灯被置于户外并曝露在阳光下时，应当保证该散热器10的底板12的底面122面向地面。这样，靠近这些热管20第一外壁22上的毛细结构组织将浸没在工作流体中，而该热管20的第二外壁24则与工作流体相离。因此因日照辐射在该散热器上聚集的热量就不能通过热管20传至导热板30上的LED100，从而起到保护这些LED100的作用。

Claims (6)

1.一种带有散热装置的发光二极管灯具，包括一散热器及若干发光二极管，所述散热器包括一底板及由所述底板顶面延伸而出的若干散热鳍片，其特征在于：还包括导热板及具有单向传热功能的相变热传导元件，所述热传导元件连设在所述散热器底板的底面与所述导热板之间，所述发光二极管安装于所述导热板背向所述散热器的一面，所述热传导元件加快所述导热板向所述散热器传热并阻止反向传热，所述相变热传导元件为热管，所述热管包括一第一外壁，与所述第一外壁相对的一第二外壁，所述第一外壁与所述导热板接触，所述第二外壁与所述底板接触，所述热管内设置有毛细结构，所述毛细结构为只在所述第一外壁对应的内壁设置的烧结层，所述热管内填充有工作流体，当所述热管水平放置且其第一外壁朝向下时，该工作流体刚好能足够浸没所述第一外壁内表面上的毛细结构组织。
2.根据权利要求1所述的带有散热装置的发光二极管灯具，其特征在于：所述热管呈L型，S型或U型，所述散热器底面上的容置槽的形状与所述热管的相一致，所述热管分别容置于对应的容置槽内。
3.根据权利要求1所述的带有散热装置的发光二极管灯具，其特征在于：所述导热板与所述散热器的底面及嵌置在所述散热器底面内的热管相接触，且大部分面积是与所述热管的第一外壁相接触。
4.根据权利要求1所述的带有散热装置的发光二极管灯具，其特征在于：所述导热板呈矩阵排列。
5.根据权利要求1所述的带有散热装置的发光二极管灯具，其特征在于：所述导热板的数量为四，且成两行两列的矩阵排列。
6.根据权利要求5所述的带有散热装置的发光二极管灯具，其特征在于：所述每一热管夹置在每一列导热板与所述散热器底面之间。
CN200710123808A 2007-10-10 2007-10-10 带有散热装置的发光二极管灯具 Expired - Fee Related CN101408301B (zh)

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CN200710123808A CN101408301B (zh) 2007-10-10 2007-10-10 带有散热装置的发光二极管灯具
US11/959,434 US20090095448A1 (en) 2007-10-10 2007-12-18 Heat dissipation device for led chips

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