JP2013243365A5 - - Google Patents

Download PDF

Info

Publication number
JP2013243365A5
JP2013243365A5 JP2013106746A JP2013106746A JP2013243365A5 JP 2013243365 A5 JP2013243365 A5 JP 2013243365A5 JP 2013106746 A JP2013106746 A JP 2013106746A JP 2013106746 A JP2013106746 A JP 2013106746A JP 2013243365 A5 JP2013243365 A5 JP 2013243365A5
Authority
JP
Japan
Prior art keywords
switch
heat
thermal
conductive elements
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013106746A
Other languages
English (en)
Japanese (ja)
Other versions
JP6223712B2 (ja
JP2013243365A (ja
Filing date
Publication date
Priority claimed from US13/477,414 external-priority patent/US9080820B2/en
Application filed filed Critical
Publication of JP2013243365A publication Critical patent/JP2013243365A/ja
Publication of JP2013243365A5 publication Critical patent/JP2013243365A5/ja
Application granted granted Critical
Publication of JP6223712B2 publication Critical patent/JP6223712B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013106746A 2012-05-22 2013-05-21 熱放散スイッチ Active JP6223712B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/477,414 2012-05-22
US13/477,414 US9080820B2 (en) 2012-05-22 2012-05-22 Heat dissipation switch

Publications (3)

Publication Number Publication Date
JP2013243365A JP2013243365A (ja) 2013-12-05
JP2013243365A5 true JP2013243365A5 (enExample) 2016-06-30
JP6223712B2 JP6223712B2 (ja) 2017-11-01

Family

ID=48468158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013106746A Active JP6223712B2 (ja) 2012-05-22 2013-05-21 熱放散スイッチ

Country Status (4)

Country Link
US (1) US9080820B2 (enExample)
EP (1) EP2667141B1 (enExample)
JP (1) JP6223712B2 (enExample)
CN (1) CN103429051B (enExample)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9417013B2 (en) * 2010-11-12 2016-08-16 Toyota Motor Engineering & Manufacturing North America, Inc. Heat transfer systems including heat conducting composite materials
WO2012140927A1 (ja) * 2011-04-12 2012-10-18 日本碍子株式会社 ヒートフロースイッチ
CN103826422B (zh) * 2014-02-13 2016-06-29 中国科学院工程热物理研究所 微通道冷却装置
CN104853562B (zh) * 2014-02-19 2018-04-27 联想(北京)有限公司 一种电子设备和气流加速装置
US9827697B2 (en) * 2014-08-29 2017-11-28 The Boeing Company Systems and methods for curing complex fiber-reinforced composite structures
JP6372785B2 (ja) * 2014-09-30 2018-08-15 パナソニックＩｐマネジメント株式会社 パネルユニット
US20160266621A1 (en) * 2015-03-13 2016-09-15 Microsoft Technology Licensing, Llc Electronic device cooling
US10330400B2 (en) * 2015-03-17 2019-06-25 Toyota Motor Engineering & Manufacturing North America, Inc. Self-assembled or reconfigurable structures for heat flow control devices
US10267578B2 (en) 2015-08-04 2019-04-23 Raytheon Company Shape memory material based thermal coupler/decoupler and method
FR3045012B1 (fr) * 2015-12-11 2017-12-08 Airbus Operations Sas Mat d'accrochage d'une turbomachine muni d'un element de protection thermique
CN106973543A (zh) * 2016-01-14 2017-07-21 中兴通讯股份有限公司 一种自调节高低温保护装置
JP6274246B2 (ja) * 2016-04-08 2018-02-07 株式会社デンソー 監視装置
KR102701849B1 (ko) * 2017-01-26 2024-09-02 삼성전자주식회사 적응적 열 저항 및 열 용량을 사용하는 열 관리 장치 및 방법
US10427934B1 (en) * 2017-03-23 2019-10-01 United States Of America As Represented By The Secretary Of The Air Force Thermal management using microelectromechanical systems bimorph cantilever beams
US10730645B2 (en) 2017-04-21 2020-08-04 The Boeing Company System and method for shape memory alloy thermal interface
CN106993399A (zh) * 2017-05-26 2017-07-28 北京小米移动软件有限公司 导热装置
JP6950933B2 (ja) 2017-07-14 2021-10-13 国立研究開発法人宇宙航空研究開発機構 熱応動アクチュエータおよび熱応動アクチュエータユニット
CN107863685A (zh) * 2017-11-29 2018-03-30 西安炬光科技股份有限公司 一种温度控制结构及激光器模块
US10292307B1 (en) * 2018-01-04 2019-05-14 Juniper Networks, Inc. Thermal heatsink
US11946705B2 (en) 2018-03-01 2024-04-02 Universitat De Lleida Deformable fin heat exchanger
FR3079021B1 (fr) * 2018-03-16 2020-09-11 Alstom Transp Tech Dispositif de conduction thermique et systeme de dissipation de chaleur associe
CN108870791A (zh) * 2018-04-26 2018-11-23 浙江大学 一种采用形状记忆合金的接触式冷却系统
GB2581998B (en) * 2019-03-07 2021-07-28 Dualitas Ltd Thermal management of display device
US11076504B2 (en) 2019-03-08 2021-07-27 Appleton Grp Llc Arrangement for dissipating heat of a power supply unit in a housing
JP7354689B2 (ja) * 2019-08-28 2023-10-03 大日本印刷株式会社 熱伝導率制御体
JP7451912B2 (ja) * 2019-09-19 2024-03-19 大日本印刷株式会社 構造物
JP7415396B2 (ja) * 2019-09-26 2024-01-17 大日本印刷株式会社 保温容器
JP7363579B2 (ja) * 2020-03-02 2023-10-18 大日本印刷株式会社 熱伝導率制御体、隔壁、および構造物
US10866036B1 (en) * 2020-05-18 2020-12-15 Envertic Thermal Systems, Llc Thermal switch
RU2736012C1 (ru) * 2020-06-20 2020-11-11 Сергей Сергеевич Примаков Способ регулирования теплопередачи между преимущественно твердым основанием и внешней средой
US11493551B2 (en) 2020-06-22 2022-11-08 Advantest Test Solutions, Inc. Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
US11549981B2 (en) 2020-10-01 2023-01-10 Advantest Test Solutions, Inc. Thermal solution for massively parallel testing
CN112636163A (zh) * 2020-10-09 2021-04-09 金雷 一种电子器件的温控装置
US11821913B2 (en) 2020-11-02 2023-11-21 Advantest Test Solutions, Inc. Shielded socket and carrier for high-volume test of semiconductor devices
US11808812B2 (en) 2020-11-02 2023-11-07 Advantest Test Solutions, Inc. Passive carrier-based device delivery for slot-based high-volume semiconductor test system
US12320841B2 (en) 2020-11-19 2025-06-03 Advantest Test Solutions, Inc. Wafer scale active thermal interposer for device testing
US11609266B2 (en) 2020-12-04 2023-03-21 Advantest Test Solutions, Inc. Active thermal interposer device
US11573262B2 (en) 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
US11587640B2 (en) 2021-03-08 2023-02-21 Advantest Test Solutions, Inc. Carrier based high volume system level testing of devices with pop structures
US12235314B2 (en) 2021-09-14 2025-02-25 Advantest Test Solutions, Inc Parallel test cell with self actuated sockets
US11656273B1 (en) 2021-11-05 2023-05-23 Advantest Test Solutions, Inc. High current device testing apparatus and systems
DE102022100684B3 (de) 2022-01-13 2023-06-07 Audi Aktiengesellschaft Thermisches Koppelelement
US12411167B2 (en) 2022-01-26 2025-09-09 Advantest Test Solutions, Inc. Tension-based socket gimbal for engaging device under test with thermal array
US11835549B2 (en) 2022-01-26 2023-12-05 Advantest Test Solutions, Inc. Thermal array with gimbal features and enhanced thermal performance
US12339075B2 (en) 2022-03-01 2025-06-24 Toyota Motor Engineering & Manufacturing North America, Inc. Bi-functional thermal cooling systems and methods thereof
CN114593623B (zh) * 2022-03-30 2023-10-20 内蒙古工业大学 一种可自动调整换热面积的换热器
CN117420896A (zh) * 2022-07-11 2024-01-19 戴尔产品有限公司 用于使用温度测量对计算装置进行热管理的系统和方法
IL309141A (en) * 2023-12-06 2025-07-01 Israel Aerospace Ind Ltd Heat transfer arrangement

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3519067A (en) * 1967-12-28 1970-07-07 Honeywell Inc Variable thermal conductance devices
US4304294A (en) 1978-08-17 1981-12-08 Ford Aerospace & Communications Corp. Thermal energy switch
JPS6235547A (ja) * 1985-08-08 1987-02-16 Nec Corp 半導体素子の冷却機構
US4742867A (en) * 1986-12-01 1988-05-10 Cape Cod Research, Inc. Method and apparatuses for heat transfer
US5131456A (en) * 1991-07-01 1992-07-21 Ibm Corporation Bimetallic insert fin for high conduction cooling structure
JPH05259667A (ja) * 1992-03-13 1993-10-08 Fujitsu Ltd 放熱構造
DE69328687D1 (de) * 1993-07-06 2000-06-21 Toshiba Kawasaki Kk Wärmeleitende platte
JPH07210257A (ja) * 1994-01-17 1995-08-11 Hitachi Ltd 熱流路可変表面を用いた温度制御装置
JPH11351679A (ja) * 1998-06-10 1999-12-24 Nikkiso Co Ltd 冷却装置
US6608752B2 (en) * 2001-09-24 2003-08-19 General Electric Company Adaptive heat sink for electronics applications
JP2003110185A (ja) * 2001-10-02 2003-04-11 Toshiba Corp 光通信モジュール
US20050074666A1 (en) * 2002-08-29 2005-04-07 Hirokazu Kimiya Heat control device for battery
WO2004047133A2 (en) * 2002-11-18 2004-06-03 Washington State University Research Foundation Thermal switch, methods of use and manufacturing methods for same
CN100370604C (zh) * 2004-04-15 2008-02-20 鸿富锦精密工业（深圳）有限公司 一种热界面材料及其制造方法
US20060141308A1 (en) * 2004-12-23 2006-06-29 Becerra Juan J Apparatus and method for variable conductance temperature control
US20070205473A1 (en) * 2006-03-03 2007-09-06 Honeywell International Inc. Passive analog thermal isolation structure
FR2899374B1 (fr) * 2006-03-30 2008-05-30 Air Liquide Interrupteur thermique
US20070241635A1 (en) * 2006-04-17 2007-10-18 Multispectral Imaging, Inc. Apparatus Comprising a Thermal Bimorph with Enhanced Sensitivity
JP4648351B2 (ja) * 2007-03-30 2011-03-09 住友ベークライト株式会社 伝熱シートおよび放熱構造体
US7752866B2 (en) * 2007-12-07 2010-07-13 University Of Central Florida Research Foundation, Inc. Shape memory thermal conduction switch
JP2009203441A (ja) * 2008-02-29 2009-09-10 Denso Corp コンポジット材料、その製造方法、及び複合構造体
US20090218087A1 (en) * 2008-02-29 2009-09-03 Denso Corporation Thermal conduction structure, composite material, and method of producing the material
US20090321044A1 (en) * 2008-06-30 2009-12-31 Alcatel-Lucent Technologies Inc. Active heat sink designs
US20100021678A1 (en) * 2008-07-23 2010-01-28 Tai-Her Yang Thermal conduction principle and device for intercrossed structure having different thermal characteristics
CN101458050A (zh) * 2008-12-22 2009-06-17 中国航天科技集团公司第五研究院第五一○研究所 一种可变散热器及其制作方法
US8215377B1 (en) * 2009-05-06 2012-07-10 Lockheed Martin Corporation Heat transfer device with flexible cooling layer
US20110168378A1 (en) * 2010-01-14 2011-07-14 Irvine Sensors Corporation Thermal power distribution system
US8659903B2 (en) * 2011-12-06 2014-02-25 Palo Alto Research Center Incorporated Heat switch array for thermal hot spot cooling
CN102594289A (zh) * 2012-01-31 2012-07-18 华为终端有限公司 热敏感器件及其散热系统

Similar Documents

Publication Publication Date Title
JP2013243365A5 (enExample)
JP6223712B2 (ja) 熱放散スイッチ
JP2006229180A5 (enExample)
JP2012227472A5 (enExample)
KR101439524B1 (ko) 히트파이프형 방열장치
RU2018125452A (ru) Вакуумный изолятор в камере для хранения пищевых продуктов и способы его изготовления и использования
CN205430849U (zh) 柔性均温板
JP2014110426A5 (enExample)
JP3196200U (ja) 均温板支持体構造
JP6391527B2 (ja) パワー半導体モジュール
JP2014053603A5 (enExample)
TWI541487B (zh) 均溫板支撐體結構
KR101366616B1 (ko) 방열판 및 그를 갖는 중계기
JP2015041768A (ja) ヒートシンク
TWM501091U (zh) 均溫板支撐體結構
JP5611076B2 (ja) 電子機器
CN105636403A (zh) 散热装置
TWI639078B (zh) 電子裝置
JP7172065B2 (ja) 半導体装置
JP2015133454A5 (enExample)
KR20150028702A (ko) 히트 싱크
TWM531125U (zh) 散熱板組合及電子裝置
JP6540358B2 (ja) 放熱構造、筐体および携帯端末
KR20140013813A (ko) 방열판
JP2015153901A (ja) ヒートシンク及びそれを備えた電気機器