JP2008118080A5 - - Google Patents
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- Publication number
- JP2008118080A5 JP2008118080A5 JP2006302555A JP2006302555A JP2008118080A5 JP 2008118080 A5 JP2008118080 A5 JP 2008118080A5 JP 2006302555 A JP2006302555 A JP 2006302555A JP 2006302555 A JP2006302555 A JP 2006302555A JP 2008118080 A5 JP2008118080 A5 JP 2008118080A5
- Authority
- JP
- Japan
- Prior art keywords
- heater
- insulating layer
- mounting surface
- heating
- heat insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 2
- 229920001721 Polyimide Polymers 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- -1 fluororesin Substances 0.000 claims 1
- 239000010445 mica Substances 0.000 claims 1
- 229910052618 mica group Inorganic materials 0.000 claims 1
Claims (1)
- ウエハを加熱するための加熱体であって、ウエハ載置面を有するヒータ基板と発熱体を備えたヒータと、該ヒータ基板より熱伝導率の高い均熱板とを具備し、該均熱板がヒータのウエハ載置面の反対側に断熱層を介して固定され、該断熱層の材質がポリイミド、フッ素樹脂、マイカのいずれかであることを特徴とする加熱体。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006302555A JP5157131B2 (ja) | 2006-11-08 | 2006-11-08 | 加熱体及びそれを搭載した半導体製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006302555A JP5157131B2 (ja) | 2006-11-08 | 2006-11-08 | 加熱体及びそれを搭載した半導体製造装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008118080A JP2008118080A (ja) | 2008-05-22 |
| JP2008118080A5 true JP2008118080A5 (ja) | 2009-12-17 |
| JP5157131B2 JP5157131B2 (ja) | 2013-03-06 |
Family
ID=39503764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006302555A Active JP5157131B2 (ja) | 2006-11-08 | 2006-11-08 | 加熱体及びそれを搭載した半導体製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5157131B2 (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5447123B2 (ja) * | 2009-05-28 | 2014-03-19 | 住友電気工業株式会社 | ヒータユニット及びそれを備えた装置 |
| JP5416570B2 (ja) * | 2009-12-15 | 2014-02-12 | 住友電気工業株式会社 | 加熱冷却デバイスおよびそれを搭載した装置 |
| CN104752301B (zh) * | 2013-12-31 | 2018-05-25 | 北京北方华创微电子装备有限公司 | 一种静电卡盘以及腔室 |
| NL2015429B1 (en) * | 2015-09-11 | 2017-03-29 | Walker Holdings B V | Portable stove for solid fuels. |
| CN117286474A (zh) * | 2022-12-28 | 2023-12-26 | 无锡至辰科技有限公司 | 一种高温金属外壳晶圆加热器及其加工方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002025912A (ja) * | 2000-07-04 | 2002-01-25 | Sumitomo Electric Ind Ltd | 半導体製造装置用サセプタとそれを用いた半導体製造装置 |
-
2006
- 2006-11-08 JP JP2006302555A patent/JP5157131B2/ja active Active
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