JP2004226970A5 - - Google Patents

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Publication number
JP2004226970A5
JP2004226970A5 JP2004009476A JP2004009476A JP2004226970A5 JP 2004226970 A5 JP2004226970 A5 JP 2004226970A5 JP 2004009476 A JP2004009476 A JP 2004009476A JP 2004009476 A JP2004009476 A JP 2004009476A JP 2004226970 A5 JP2004226970 A5 JP 2004226970A5
Authority
JP
Japan
Prior art keywords
thermal
layer
heat
fiber
equalization device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004009476A
Other languages
English (en)
Japanese (ja)
Other versions
JP4313216B2 (ja
JP2004226970A (ja
Filing date
Publication date
Priority claimed from US10/696,961 external-priority patent/US7261146B2/en
Application filed filed Critical
Publication of JP2004226970A publication Critical patent/JP2004226970A/ja
Publication of JP2004226970A5 publication Critical patent/JP2004226970A5/ja
Application granted granted Critical
Publication of JP4313216B2 publication Critical patent/JP4313216B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004009476A 2003-01-17 2004-01-16 伝熱性の熱平等化装置 Expired - Fee Related JP4313216B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US44110903P 2003-01-17 2003-01-17
US10/696,961 US7261146B2 (en) 2003-01-17 2003-10-30 Conductive heat-equalizing device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009034063A Division JP2009103327A (ja) 2003-01-17 2009-02-17 伝熱性の熱平等化装置

Publications (3)

Publication Number Publication Date
JP2004226970A JP2004226970A (ja) 2004-08-12
JP2004226970A5 true JP2004226970A5 (enExample) 2007-03-01
JP4313216B2 JP4313216B2 (ja) 2009-08-12

Family

ID=32930425

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2004009476A Expired - Fee Related JP4313216B2 (ja) 2003-01-17 2004-01-16 伝熱性の熱平等化装置
JP2009034063A Pending JP2009103327A (ja) 2003-01-17 2009-02-17 伝熱性の熱平等化装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2009034063A Pending JP2009103327A (ja) 2003-01-17 2009-02-17 伝熱性の熱平等化装置

Country Status (3)

Country Link
US (1) US7261146B2 (enExample)
JP (2) JP4313216B2 (enExample)
DE (1) DE10360854B4 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7241253B2 (en) * 2003-02-11 2007-07-10 Illinois Tool Works Inc Fuser roll with improved heating performance
US7228098B2 (en) * 2004-10-28 2007-06-05 Xerox Corporation Fusing assembly having a temperature equalizing device
US20060185931A1 (en) * 2005-02-04 2006-08-24 Kawar Maher S Acoustic noise reduction apparatus for personal computers and electronics
US8289710B2 (en) * 2006-02-16 2012-10-16 Liebert Corporation Liquid cooling systems for server applications
US8041279B2 (en) * 2008-11-18 2011-10-18 Xerox Corporation ISO-thermalizing graphite printer structure and method for using same
US8378548B2 (en) * 2009-09-17 2013-02-19 Illinois Tool Works Inc. Current control assembly with drainage and slinger
JP5478409B2 (ja) * 2010-07-29 2014-04-23 京セラドキュメントソリューションズ株式会社 定着装置およびそれを備えた画像形成装置
WO2016098890A1 (ja) * 2014-12-18 2016-06-23 株式会社カネカ グラファイト積層体、グラファイト積層体の製造方法、熱輸送用構造物およびロッド状の熱輸送体
US10234915B2 (en) * 2015-09-09 2019-03-19 Htc Corporation Graphite thermal conductor, electronic device and method for manufacturing graphite thermal conductor
EP3802419B1 (en) * 2018-06-07 2024-04-03 SHT Smart High-Tech AB Laminated graphene based thermally conductive film and method for manufacturing the film
CN115159988A (zh) * 2021-04-02 2022-10-11 国家能源投资集团有限责任公司 耐高温蓄热材料及其制备方法与应用、用于制备耐高温蓄热材料的组合物及其应用

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3291204A (en) * 1961-03-16 1966-12-13 Thermel Inc Heat transfer roll
FR1574025A (enExample) 1968-04-03 1969-07-11
US3600550A (en) * 1969-09-11 1971-08-17 Mitsubishi Heavy Ind Ltd Method of and apparatus for heating a rotary roll
DE8502397U1 (de) 1985-01-30 1986-11-13 Dornier System Gmbh, 7990 Friedrichshafen Wärmerohr mit Kohlefaserkapillare
US4867235A (en) * 1986-10-20 1989-09-19 Westinghouse Electric Corp. Composite heat transfer means
US5042565A (en) * 1990-01-30 1991-08-27 Rockwell International Corporation Fiber reinforced composite leading edge heat exchanger and method for producing same
AU634107B2 (en) * 1990-11-27 1993-02-11 Kawasaki Steel Corporation Roll charged with heat transfer medium
JP3158224B2 (ja) * 1992-04-30 2001-04-23 富士通株式会社 定着装置
DE4322431C2 (de) 1993-07-06 1997-04-10 Mtu Muenchen Gmbh Kühlstruktur und Verfahren zu ihrer Herstellung
JPH0869862A (ja) * 1994-06-21 1996-03-12 Tokai Denka Kogyo Kk 面状ヒータ及びトナー定着装置
JPH08156165A (ja) * 1994-12-12 1996-06-18 Nippon Petrochem Co Ltd 発熱積層構造体
US5467814A (en) * 1995-02-24 1995-11-21 The United States Of America As Represented By The Secretary Of The Navy Graphite/epoxy heat sink/mounting for common pressure vessel
JPH10133503A (ja) * 1996-10-29 1998-05-22 Ricoh Co Ltd 加熱定着装置
US6005184A (en) * 1997-07-11 1999-12-21 Space Systems/Loral, Inc. Solar panels having improved heat dissipation properties
DE19730389C2 (de) 1997-07-16 2002-06-06 Deutsch Zentr Luft & Raumfahrt Wärmetauscher
JP2001005315A (ja) * 1999-06-17 2001-01-12 Matsushita Electric Ind Co Ltd 像加熱装置とこれに用いる発熱ローラおよび画像形成装置
JP3961169B2 (ja) * 1999-10-18 2007-08-22 株式会社リコー 加熱ローラおよびこれを用いた定着装置
US6339211B1 (en) * 2000-07-07 2002-01-15 Hewlett-Packard Company Reducing a temperature differential in a fixing device
US6469381B1 (en) * 2000-09-29 2002-10-22 Intel Corporation Carbon-carbon and/or metal-carbon fiber composite heat spreader
KR100416550B1 (ko) * 2001-10-10 2004-02-05 삼성전자주식회사 전자사진 화상형성장치의 정착롤러 장치
US6919115B2 (en) * 2002-01-08 2005-07-19 Cool Options, Inc. Thermally conductive drive belt
FR2838183B1 (fr) 2002-04-09 2004-07-09 Snecma Propulsion Solide Structure d'echangeur thermique haute temperature
KR100509475B1 (ko) * 2002-08-29 2005-08-22 삼성전자주식회사 전자사진 화상형성장치의 정착 장치

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