JP2008522406A5 - - Google Patents

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JP2008522406A5
JP2008522406A5 JP2007543147A JP2007543147A JP2008522406A5 JP 2008522406 A5 JP2008522406 A5 JP 2008522406A5 JP 2007543147 A JP2007543147 A JP 2007543147A JP 2007543147 A JP2007543147 A JP 2007543147A JP 2008522406 A5 JP2008522406 A5 JP 2008522406A5
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inlet
outlet
microchannel
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JP2008522406A (ja
JP5052350B2 (ja
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Priority claimed from US10/998,707 external-priority patent/US7353859B2/en
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Claims (10)

  1. 少なくとも1つの加熱表面を冷却するための装置であって、
    冷却媒体を受入れるように構成された複数の入口マニホルド及び該冷却媒体を排出するように構成された複数の出口マニホルドを形成しかつ前記入口及び出口マニホルドが交互配置された、ベースプレートと、
    前記ベースプレートに結合された内側表面及び前記加熱表面と熱接触状態になった外側表面を有し、前記内側表面が前記入口マニホルドから冷却媒体を受入れかつ該冷却媒体を前記出口マニホルドに送出するように構成された複数のマイクロチャネルを形成し、前記マイクロチャネルが前記入口及び出口マニホルドに対してほぼ垂直に配向された、少なくとも1つの基板と、
    前記入口マニホルドに冷却媒体を供給するように構成された入口プレナムと、
    前記出口マニホルドから冷却媒体を排出するように構成された出口プレナムと、を含み、
    前記入口プレナム及び出口プレナムが、前記ベースプレートの平面内に配向されている、
    装置。
  2. 前記マイクロチャネルが、連続している、請求項1記載の装置。
  3. 前記マイクロチャネルが、離散配列を形成する、請求項1記載の装置。
  4. 前記入口マニホルドの各々が、幅広端部及び幅狭端部を含み、前記幅広端部の各々が、前記幅狭端部のそれぞれの1つよりも大きく、
    前記入口マニホルドの各々が、前記幅広端部及び幅狭端部のそれぞれの1つ間でテーパになっており、
    前記入口マニホルドの各々が、前記入口プレナムから延びかつ該入口プレナムに対してほぼ垂直に配向され、
    前記出口マニホルドの各々が、幅広端部及び幅狭端部を含み、前記幅広端部の各々が、前記幅狭端部のそれぞれの1つよりも大きく、
    前記出口マニホルドの各々が、前記幅広端部及び幅狭端部のそれぞれの1つ間でテーパになっており、
    前記出口マニホルドの各々が、前記出口プレナムから延びかつ該出口プレナムに対してほぼ垂直に配向される
    請求項1記載の装置。
  5. 前記ベースプレートが、熱伝導材料を含み、
    前記基板が、少なくとも1つの電気的分離材料を含む
    請求項1記載の装置。
  6. 前記基板が、最上層、絶縁層及び内側層を含み、前記マイクロチャネルが、前記内側層内に形成され、前記絶縁層が、前記最上層と前記内側層との間に配置され、前記内側層が、前記ベースプレートに取付けられ、前記最上層が、前記加熱表面に結合される、請求項1記載の装置。
  7. 前記マイクロチャネルが、前記内側層を貫通して延びる、請求項6記載の装置。
  8. 前記基板が、最上層及び絶縁マイクロチャネル層を含み、前記マイクロチャネルが、前記絶縁マイクロチャネル層内に形成され、前記絶縁マイクロチャネル層が、前記最上層と前記ベースプレートとの間に配置され、前記最上層が、前記加熱表面に結合され
    前記基板が、前記絶縁マイクロチャネル層と前記ベースプレートとの間に配置されかつそれらに取付けられた下層をさらに含む、
    請求項1記載の装置。
  9. 前記基板が、内側層を含み、前記マイクロチャネルが、前記内側層内に形成されかつ該内側層を部分的に貫通して延びる、請求項1記載の装置。
  10. 該装置が、複数の基板をさらに含みかつ複数の加熱表面を冷却するようになっており、前記基板の各々が、内側表面及び外側表面を有し、前記内側表面の各々が、前記ベースプレートのそれぞれの部分に結合されかつ複数の前記マイクロチャネルを形成し、前記外側表面の各々が、前記加熱表面のそれぞれの1つと熱的接触状態になっている、請求項1記載の装置。
JP2007543147A 2004-11-24 2005-11-14 マイクロチャネル冷却を備えたヒートシンク Expired - Fee Related JP5052350B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/998,707 US7353859B2 (en) 2004-11-24 2004-11-24 Heat sink with microchannel cooling for power devices
US10/998,707 2004-11-24
PCT/US2005/041087 WO2007001456A1 (en) 2004-11-24 2005-11-14 Heat sink with microchannel cooling for power devices

Publications (3)

Publication Number Publication Date
JP2008522406A JP2008522406A (ja) 2008-06-26
JP2008522406A5 true JP2008522406A5 (ja) 2009-01-08
JP5052350B2 JP5052350B2 (ja) 2012-10-17

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JP2007543147A Expired - Fee Related JP5052350B2 (ja) 2004-11-24 2005-11-14 マイクロチャネル冷却を備えたヒートシンク

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US (2) US7353859B2 (ja)
EP (1) EP1825730B1 (ja)
JP (1) JP5052350B2 (ja)
CN (1) CN100559926C (ja)
CA (1) CA2589183C (ja)
DE (1) DE602005025923D1 (ja)
IL (1) IL183311A0 (ja)
WO (1) WO2007001456A1 (ja)

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